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The ultra-slim, fanless high performance UTX-110 SBC is optimised for IoT - 16/12/2014

The ultra-slim, fanless high performance UTX-110 SBC is optimised for IoT

The BVM Group has introduced the ASRock UTX-110, a super-compact SBC in the new 4.4” x 4.6” UTX form factor, developed in response to requirements for powerful embedded computing required for the growth of the Internet of Things (IoT). The UTX-110 is designed around the Bay Trail fourth generation Intel Atom E3800 single/dual/quad core SoC family; it supports up to 8GB of single channel DDR3L 1333MHz DRAM. With dual display 1920 x 1200 HDMI capability and dual channel 24-bit 1920 x 1200 LVDS, it offers high-resolution graphics and enhanced stereoscopic 3D. The ultra-slim profile allows installation in confined spaces, and its reliability meets intelligent embedded systems’ requirements for maintenance-free extended MTBF. The UTX-110 is designed for intelligent systems and other applications where low power consumption, high performance and fanless operation are essential. Typical uses are in IoT gateways, kiosks, vending machines, POS & ATMs, automotive systems, retail, medical, security, surveillance and in-vehicle infotainment.

 

Two Gigabit Ethernet ports, one USB3.0 and two USB2.0 ports and two serial ports are provided. Full and half size Mini-PCIe slots and an expansion slot support Wi-Fi via an external module and give additional mass storage via mSATA. A separate internal SATA 3Gb/s port is also provided. To maximise heat dissipation, the processor is mounted on the solder side of the board. Power is from an external 12VDC source and AT/ATX operation is supported.

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