Please enter some search terms and try again.

CES-471 - COM-Express - Core 2 Duo Mobile CPU Module

Product image

• Supports Intel Core 2 Duo mobile processor Merom with Socket P @ 533/800MHz FSB.
• 1 x DDR2 SO-DIMM supports up to 2GB.
• Intel GME965 & ICH8M Chipset.
• Intel GME965 built-in GMA X3100 VGA, LVDS, SATA, USB 2.0, Intel Giga LAN.

Board Size: 125 x 95mm.
CPU Type: supports Intel Core 2 Duo processor Merom with Socket P @ 800/533MHz FSB.
Chipset: Intel GME965 & ICH8M.
Memory Type: 1 x DDR2 SO-DIMM supports up to 2GB.
VGA Interface: Intel GME965 Integrated GMA X3100 Technology.
LVDS Interface: 24-bit Dual channel LVDS interface.
Enhanced IDE: One UltraATA/100 IDE up to 2 ATAPI.
Series ATA: Integrated Series ATA controller facilities high-speed data transfer up to 300MB/s for each of 3 ports.
LAN Interface: 10/100/1000 Mbps Ethernet port provided by Intel 82573.
Audio: Intel ICH8M HD Audio.
USB: Intel ICH8M contains 1 x EHCI and 4 x UHCI controller support for 8 x Hi-Speed USB2.0 ports.
PCI-Express Interface: 1 x PCI-Express x16, interface, 4 x PCI-Express x1 interface.
PCI Interface: supports 4 x external PCI bus interface.

Please contact us for more information.

We like to make life easier, for further help and assistance with this product click to our FAQ's page.

Want more help to find a solution? Contact us or check out our design capabilities.

Windows Embedded Partner