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CES-471 - COM-Express - Core 2 Duo Mobile CPU Module

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• Supports Intel Core 2 Duo mobile processor Merom with Socket P @ 533/800MHz FSB.
• 1 x DDR2 SO-DIMM supports up to 2GB.
• Intel GME965 & ICH8M Chipset.
• Intel GME965 built-in GMA X3100 VGA, LVDS, SATA, USB 2.0, Intel Giga LAN.

Specifications
Board Size: 125 x 95mm.
CPU Type: supports Intel Core 2 Duo processor Merom with Socket P @ 800/533MHz FSB.
Chipset: Intel GME965 & ICH8M.
Memory Type: 1 x DDR2 SO-DIMM supports up to 2GB.
VGA Interface: Intel GME965 Integrated GMA X3100 Technology.
LVDS Interface: 24-bit Dual channel LVDS interface.
Enhanced IDE: One UltraATA/100 IDE up to 2 ATAPI.
Series ATA: Integrated Series ATA controller facilities high-speed data transfer up to 300MB/s for each of 3 ports.
LAN Interface: 10/100/1000 Mbps Ethernet port provided by Intel 82573.
Audio: Intel ICH8M HD Audio.
USB: Intel ICH8M contains 1 x EHCI and 4 x UHCI controller support for 8 x Hi-Speed USB2.0 ports.
PCI-Express Interface: 1 x PCI-Express x16, interface, 4 x PCI-Express x1 interface.
PCI Interface: supports 4 x external PCI bus interface.


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