Computer-On-Modules
Showing 21–40 of 73 results
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DFI COM101-BAT Mini-ITX – COMe Basic/Compact Carrier Board
• DFI COM101-BAT Mini-ITX – COMe Basic/Compact Carrier Board
• COM Express® R2.1, Pin-out Type 6
• Supports Compact/Basic modules
• Multiple displays: 1 DP, 1 LVDS, 1 VGA
• Rich I/O: 1 GbE, 6 USB
• Mini-ITX form factor -
DFI COM332-B(R.A) Micro-ATX – COMe Basic/Compact Carrier Board
• DFI COM332-B(R.A) Micro-ATX – COMe Basic/Compact Carrier Board
• COM Express® R2.1, Pin-out Type 6
• Supports Compact and Basic modules
• Multiple displays: VGA, LVDS, DP, eDP
• Rich I/O: 1 GbE, 4 USB 3.0, 4 USB 2.0
• microATX form factor -
DFI COM332-B(R.B1) Micro-ATX – COMe Basic/Compact Carrier Board
• DFI COM332-B(R.B1) Micro-ATX – COMe Basic/Compact Carrier Board
• COM Express® R2.1, Pin-out Type 6
• Supports Compact and Basic modules
• Multiple displays: VGA, LVDS, DP, eDP
• Rich I/O: 1 GbE, 4 USB 3.1, 4 USB 2.0
• microATX form factor -
DFI COM333-I Micro-ATX – COMe Basic/Compact Carrier Board
• DFI COM333-I Micro-ATX – COMe Basic/Compact Carrier Board
• COM Express® R3.0, Pin-out Type 7
• Supports Compact and Basic modules
• Multiple expansion: 8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0
• Rich I/O: 2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM
• microATX form factor -
DFI F8700 NXP i.MX8X Qseven
• DFI F8700 NXP i.MX8X Qseven
• 4GB LPDDR4 Memory Down
• Supports dual displays: 1 HDMI, 1 LVDS
• Multiple expansions: 1 PCIe x1, 1 SDIO x4 bit
• Rich I/O: 1 GbE, 3 USB 3.0, 1 USB 2.0 OTG
• 15-Year CPU Life Cycle Support Until Q1′ 29 (Based on NXP Roadmap) -
DFI Q7A-551 Qseven Carrier Board
• DFI Q7A-551 Qseven Carrier Board
• Qseven R1.2
• Supports Qseven modules
• Multiple displays: 1 LVDS, 1 HDMI
• Rich I/O: 1 GbE, 2 USB 2.0, 3 COM
• 190 x 102mm (7.48″ x 4.02″) -
DFI Q7X-151(R.A) Mini-ITX – Qseven Carrier Board
• DFI Q7X-151(R.A) Mini-ITX – Qseven Carrier Board
• Qseven R2.0
• Supports Qseven modules
• Multiple displays: 1 DP, 1 LVDS
• Rich I/O: 1 GbE, 1 USB 3.0, 6 USB 2.0, 2 COM
• Mini-ITX form factor -
DFI Q7X-151(R.D1) Mini-ITX – Qseven Carrier Board
• DFI Q7X-151(R.D1) Mini-ITX – Qseven Carrier Board
• Qseven R2.1
• Supports Qseven modules
• Multiple displays: 2 DP, 1 LVDS, 1 eDP
• Rich I/O: 1 GbE, 3 USB 3.0, 8 USB 2.0, 2 COM
• Mini-ITX form factor -
DFI SDML-WL 8th Gen Intel iCore Smart Display Module
• DFI SDML-WL 8th Gen Intel iCore Smart Display Module
• 2 DDR4 2400MHz SODIMM up to 32G
• Multiple expansion: 1 M.2 E Key, 1 M.2 M Key, 1 M.2 B Key
• 1 HDMI resolution up to 4096 x 2160 @ 60Hz Display port resolution up to 4096 x 2304 @ 60Hz
• Rich I/O: 1 Intel GbE, 4 USB3.1, 1 USB3.1 Type C
• 15-Year CPU Life Cycle Support Until Q3′ 34 (Based on Intel IOTG Roadmap) -
DFI WL968 Whiskey Lake 8th Gen Intel iCore COM Express Compact
• DFI WL968 Whiskey Lake 8th Gen Intel iCore COM Express Compact
• 8th Generation Intel® Core™ Processor COM Express® Compact
• DDR4 2400/2133MHz SODIMM up to 64GB
• VGA/DDI + LVDS/eDP + DDI
• DP++ supports 4K x 2K resolution
• Multiple expansion: 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
• Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap) -
DFI TGU968 Tiger Lake 11th Gen Intel iCore COM Express Compact
• DFI TGU968 Tiger Lake 11th Gen Intel iCore COM Express Compact
• 11th Generation Intel® Processor COM Express® Compact
• DDR4 3200MHz SODIMM up to 64GB
• VGA/DDI + LVDS/eDP + DDI
• DP++ supports 4K x 2K resolution
• Multiple expansion: 8 PCIe x1, 1 I2C, 1 SMBus
• Rich I/O: 1 Intel 2.5GbE, 4 USB 3.1, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap) -
DFI WL9A3 Whiskey Lake 8th Gen Intel iCore COM Express Mini
• DFI WL9A3 Whiskey Lake 8th Gen Intel iCore COM Express Mini
• Intel® Core™ 8th Gen Processor
• Dual Channel LPDDR3 2133MHz;Memory Down up to 16GB
• 1 LVDS/eDP, 1 DDI (HDMI/DP);Supports dual displays: DDI + LVDS/eDP
• Multiple expansions: 4 PCIe x1
• Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap) -
DFI TGU9A2 Tiger Lake 11th Gen Intel COM Express Mini
• DFI TGU9A2 Tiger Lake 11th Gen Intel COM Express Mini
• 11th Generation Intel® Processor COM Express® Mini
• Dual Channel LPDDR4X 4266MHz
• 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP++) , Dual Display:DDI + LVDS/eDP
• DP++ supports 4K x 2K resolution
• Multiple expansion: 1 PCIe x4, 2 I2C, 1 SMBus
• Rich I/O: 1 Intel GbE, 2 USB 3.2, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap) -
ASRock Industrial COM-653-E-2176M 8th Gen Com Express Basic
• Asrock 8th Gen Com Express – COM-653-E-2176M
• Intel® 8th Generation Intel® Core™ Processor BGA 1440
• Intel® Xeon® Processor E-2100M
• Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
• 2 x DDI channels, 1 x eDP(shared with LVDS)
• 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
• 1 x Intel® LAN
• 1 x TPM2.0 on board IC (optional) -
DFI GH960-R1505G Ryzen Embedded Com Express Basic Module
• DFI Ryzen Embedded Com Express Module – GH960-R1505G
• Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default);Supports up to four independent displays
• DP++ resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x8, 7 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap) -
ASRock Industrial COM-653-i3-8100H 8th Gen Com Express Basic
• Asrock 8th Gen Com Express – COM-653-i3-8100H
• Intel® 8th Generation Intel® Core™ Processor BGA 1440
• Intel® Xeon® Processor E-2100M
• Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
• 2 x DDI channels, 1 x eDP(shared with LVDS)
• 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
• 1 x Intel® LAN
• 1 x TPM2.0 on board IC (optional) -
DFI GH960-R1606G Ryzen Embedded Com Express Basic Module
• DFI Ryzen Embedded Com Express Module – GH960-R1606G
• Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default);Supports up to four independent displays
• DP++ resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x8, 7 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap) -
ASRock Industrial COM-653-i5-8400H 8th Gen Com Express Basic
• Asrock 8th Gen Com Express – COM-653-i5-8400H
• Intel® 8th Generation Intel® Core™ Processor BGA 1440
• Intel® Xeon® Processor E-2100M
• Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
• 2 x DDI channels, 1 x eDP(shared with LVDS)
• 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
• 1 x Intel® LAN
• 1 x TPM2.0 on board IC (optional) -
DFI GH960-V1202 Ryzen Embedded Com Express Basic Module
• DFI Ryzen Embedded Com Express Module – GH960-V1202
• Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default);Supports up to four independent displays
• DP++ resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x8, 7 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap) -
ASRock Industrial COM-653-i7-8850H 8th Gen Com Express Basic
• Asrock 8th Gen Com Express – COM-653-i7-8850H
• Intel® 8th Generation Intel® Core™ Processor BGA 1440
• Intel® Xeon® Processor E-2100M
• Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
• 2 x DDI channels, 1 x eDP(shared with LVDS)
• 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
• 1 x Intel® LAN
• 1 x TPM2.0 on board IC (optional)