Embedded Systems | Industrial Computing

BVM supply a diverse range of industrial and embedded systems. From industrial motherboards, SBCs and Box PCs, to Rack Mount Computers and Industrial Panel PCs . If you can’t find an off the shelf system that meets your specific requirements, our engineering team can design a bespoke system from ground through to our production team taking care of its manufacture.

If your application lies within the Industrial Automation, Military, Medical, Transportation and Smart City – or a host of any other market verticals, we’re sure that we can provide the system that fits your needs.

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Showing 1–20 of 32 results

  • VC900 M8M 1 1

    DFI VC900-M8M NXP i.MX 8M In-Vehicle PC

    • DFI VC900-M8M NXP i.MX 8M In-Vehicle PC
    • ARM-Based In-vehicle system
    • NXP i.MX8 series
    • 16GB/64GB eMMC and micro SD card slot
    • Rich I/O: 1 GbE, 2 COM, 1 CANBus, 2 USB 3.0, 1 Micro USB (OTG)
    • Wide voltage: 9~36V vehicle power input with ACC/IGN function
    • Wide temperature: -20°C~65°C operation without active fan

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  • EC500 ADS 1

    DFI EC500-ADS 12th Gen Alder Lake 5G Fanless Embedded System

    • DFI EC500-ADS 12th Gen Alder Lake 5G Fanless Embedded System
    • 12th Generation Intel Core with Intel H610E/Q670E/R680E
    • Supports DDR4 SODIMM up to 64GB
    • Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
    • Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0
    • Multiple Expansion: 3 M.2 slots
    • Support 5G Communication
    • Operating Temperature: -20 to 70°C
    • 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)

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  • ED700 EHL side

    DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System

    • DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System
    • Intel Atom Processors X Series Fanless Embedded System
    • Support 5G Sub-6 module
    • Support WiFi 6 module
    • 4 LAN: Support 1 x 2.5GbE TSN , 3 x GbE LAN
    • Wide Operating Temperature: Support up to -40 ~ 70°C
    • Support Isolated COM & DIO
    • 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)

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  • EC70A TGU 5

    DFI EC70A-TGU Tiger Lake Fanless Embedded System

    • DFI EC70A-TGU Tiger Lake Fanless Embedded System
    • 11th Gen Intel Core i7/i5/i3 Processors
    • On board memory 8GB and 1 SO-DIMM DDR4
    • Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz)
    • Support M.2 B key 3042/3052 5G-NR module
    • Up to 4 LAN or 6 USB
    • 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)

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  • DT200 CS side w600

    DFI DT200-CS High Performance MXM Embedded System

    • DFI DT200-CS High Performance MXM Embedded System
    • 8th/9th Generation Intel Core Processors
    • Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection)
    • AI accelerated: up to 110W GPU MXM module supported
    • Support M.2 B key 3052 5G cellar module
    • Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM
    • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

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  • MD711 SU

    DFI MD711 i7 Medical Embedded System

    • DFI MD711-SU2061-100G – Medical Embedded System
    • 6th Generation Intel Core Medical Computing System
    • 2 DDR4 SODIMM up to 32GB
    • 2 x 2.5″ SATA 3.0 drive bay
    • Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0
    • 15-Year CPU Life Cycle Support

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  • MD711 SU

    DFI MD711 i5 Medical Embedded System

    • DFI MD711-SU2061-000G – Medical Embedded System
    • 6th Generation Intel Core Medical Computing System
    • 2 DDR4 SODIMM up to 32GB
    • 2 x 2.5″ SATA 3.0 drive bay
    • Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0
    • 15-Year CPU Life Cycle Support

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  • ES220 CSSide200612 w600

    DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System

    • DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System
    • 8th/9th Gen Intel® Core™ Processors with Intel® C246/Q370/H310 Chipset
    • 2 DDR4 SODIMM up to 64GB
    • Single/Triple storage: 1 M.2 SSD + 2 2.5″ SSD (option) (with RAID supported)
    • Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM
    • 2 HDMI 2.0 Support resolution 4K@60Hz
    • Acoustic level support full load 36dB @operating temperature 45° C
    • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

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  • EC102 XNX 1 1

    DFI EC102-XNX NVIDIA Jetson Xavier NX Embedded System

    • DFI’s EC102-XNX NVIDIA Jetson Industrial PC – AI Embedded System powered by NVIDIA Jetson Xavier NX
    • Fully support NVIDIA® Jetson Xavier™ NX
    • 91.4mm (W) x 70mm (H) x 76.6mm (D)
    • Fanless chassis technology
    • 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • 1 x HDMI 2.0a/b Type-A supports 4K@60Hz

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  • EC51X CSSide210310R1 w600

    DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Embedded System

    • DFI EC510-CS/EC511-CS | 8th/9th Gen Intel Core | 5G | AI accelerator card | PoE | Coffee Lake | Fanless Embedded System | High-Performance | Modular-Designed
    • 8th/9th Generation Intel® Core™ with Intel® Q370/H310
    • Supports DDR4 SODIMM up to 64GB
    • Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
    • Support 4 PoE (EC51x-CS6G86E-Q)
    • 1 PCIe and 3 M.2 slots support NVMe
    • Support 5G Communication
    • Operating Temperature: -20 to 70°C
    • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

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  • EC543 CSSide210324 w600

    DFI EC543-CS 8th/9th Gen 5G Fanless Embedded System

    • DFI EC543-CS | 8th/9th Gen Intel Core | 5G | AI accelerator card | PoE | Coffee Lake | Fanless Embedded System | High-Performance | Modular-Designed
    • 8th/9th Generation Intel® Core™ with Intel® Q370
    • Supports DDR4 SODIMM up to 64GB
    • Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
    • Support 4 PoE (EC543-CS6G86E-Q configuration)
    • 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
    • Support 5G communication
    • Operating temperature: -20 to 70°C
    • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

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  • EC500 CSSide200824 w600

    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

    • DFI EC500-CS | 8th/9th Gen Intel Core | 5G | Coffee Lake | Fanless Embedded System | High-Performance | Modular-Designed
    • 8th/9th Generation Intel® Core™ with Intel® Q370/H310
    • Supports DDR4 SODIMM up to 64GB
    • Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
    • Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only)
    • 3 M.2 slots support NVMe
    • Support 5G Communication
    • Operating Temperature: -20 to 70°C
    • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

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  • EC90ASide210324 w600

    DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System

    • DFI EC90A-GH | AMD Ryzen R1000 Series | Ulrta Small Mini PC | Fanless Embedded System
    • AMD Ryzen™ Embedded R1000 Series
    • Ultra Small Size: 110 x 80mm x 60mm (W x H x D)
    • Expansion Options of 2 serial ports or LTE or WiFi
    • User friendly of installing SIM card design
    • I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI
    • 10-Year CPU Life Cycle Support Until Q1′ 30 (Based on AMD Roadmap)

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  • ECX700 ALSide201126R2 W600

    DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC

    • DFI ECX700-AL | Ruggedized | Outdoor | IoT | IP67 | Fanless Embedded System
    • Intel® Atom® Processor E3900 Series
    • Ruggedized IPC67 Grade Box PC
    • Outdoor IoT Gateway Application
    • 4GB DDR3 onboard, 64G eMMC
    • Operating temperature: -40° to 70° C
    • 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)

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  • EC100 XNX side w600

    DFI EC100-XNX NVIDIA Jetson Xavier NX PoE Embedded System

    • DFI’s EC100-XNX NVIDIA Jetson Industrial PC – PoE Embedded System powered by NVIDIA Jetson Xavier NX
    • Fully support NVIDIA® Jetson Xavier™ NX
    • 8 x 10/100 MbE with PoE
    • Fanless chassis technology
    • 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • 1 x HDMI 2.0a/b Type-A supports 4K@60Hz

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  • RC300 CS SideIO200729R2 w600

    DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC

    • DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC
    • 8th/9th Generation Intel® Core™ Processors
    • 4 x 802.3af POE Ports
    • AI Accelerated: Up to 110W GPU MXM Module Supported
    • Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Extended Operating Temperature: -25°C to 70°C
    • Support 5G Communication
    • 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)

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  • RC300 CS Front200721 w600

    DFI RC-300-CS AI-Enabled 5G MXM Railway System

    • DFI RC-300-CS AI-Enabled 5G MXM Railway System
    • 8th/9th Generation Intel® Core™ Processors
    • 4 x M12 X-coded PoE Ports at 15W
    • AI Accelerated: Up to 110W GPU MXM Module Supported
    • Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Extended Operating Temperature: -25°C to 70°C Operation without Active Fan
    • Support 5G Communication
    • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

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  • VC230 ALSide190313 w600

    DFI VC230-AL Intel Atom E3900 Series In-Vehicle PC

    • DFI VC230-AL Intel Atom E3900 Series Anti-vibration In-Vehicle PC
    • Anti-vibration and fanless In-Vehicle computer
    • Supports ignition delay on/off function
    • 1 mSATA, eMMC (optional)
    • GPS Onboard, 3 SIM Slots Onboard
    • Supports Wi-Fi, 3G, and GPRS application
    • 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)

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  • RC300 CS SideIO200729R2 w600

    DFI EC300-CS AI-Enabled 5G MXM PoE High Performance System

    • DFI EC300-CS AI-Enabled 5G MXM PoE High Performance System
    • 8th/9th Generation Intel® Core™ Processors
    • 4 x RJ45 type PoE ports at 15W
    • AI Accelerated: Up to 110W GPU MXM Module Supported
    • Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Extended Operating Temperature: -25°C to 70°C
    • Support 5G Communication
    • 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)

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  • EC700 AL 1

    DFI EC700-AL Fanless Wide Temp Embedded Ultra Compact PC

    • DFI EC700-AL Fanless Wide Temp Embedded Ultra Compact PC
    • DDR3L-1866 memory onboard + 1 SODIMM up to 8GB
    • Displays: 1 DP/HDMI combo + 1 DP/VGA
    • Supports 2 Mini PCIe and 1 M.2 slots
    • Rich I/O ports: up to 4 Intel GbE, 4 COM, 4 USB
    • Extended operating temperature: -40 to 70°C
    • 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)

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