Embedded Systems | Industrial Computing
BVM supply a diverse range of industrial and embedded systems. From industrial motherboards, SBCs and Box PCs, to Rack Mount Computers and Industrial Panel PCs . If you can’t find an off the shelf system that meets your specific requirements, our engineering team can design a bespoke system from ground through to our production team taking care of its manufacture.
If your application lies within the Industrial Automation, Military, Medical, Transportation and Smart City – or a host of any other market verticals, we’re sure that we can provide the system that fits your needs.
• What are the Advantages of an Industrial PC?
• What are the Advantages of a Rugged Computer?
• New Products
Showing 1–20 of 41 results
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DFI VC900-M8M NXP i.MX 8M In-Vehicle PC
• DFI VC900-M8M NXP i.MX 8M In-Vehicle PC
• ARM-Based In-vehicle system
• NXP i.MX8 series
• 16GB/64GB eMMC and micro SD card slot
• Rich I/O: 1 GbE, 2 COM, 1 CANBus, 2 USB 3.0, 1 Micro USB (OTG)
• Wide voltage: 9~36V vehicle power input with ACC/IGN function
• Wide temperature: -20°C~65°C operation without active fan -
DFI EC500-ADS 12th Gen Alder Lake 5G Fanless Embedded System
• DFI EC500-ADS 12th Gen Alder Lake 5G Fanless Embedded System
• 12th Generation Intel Core with Intel H610E/Q670E/R680E
• Supports DDR4 SODIMM up to 64GB
• Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
• Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0
• Multiple Expansion: 3 M.2 slots
• Support 5G Communication
• Operating Temperature: -20 to 70°C
• 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap) -
DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System
• DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System
• Intel Atom Processors X Series Fanless Embedded System
• Support 5G Sub-6 module
• Support WiFi 6 module
• 4 LAN: Support 1 x 2.5GbE TSN , 3 x GbE LAN
• Wide Operating Temperature: Support up to -40 ~ 70°C
• Support Isolated COM & DIO
• 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap) -
DFI EC70A-TGU Tiger Lake Fanless Embedded System
• DFI EC70A-TGU Tiger Lake Fanless Embedded System
• 11th Gen Intel Core i7/i5/i3 Processors
• On board memory 8GB and 1 SO-DIMM DDR4
• Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz)
• Support M.2 B key 3042/3052 5G-NR module
• Up to 4 LAN or 6 USB
• 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap) -
DFI DT200-CS High Performance MXM Embedded System
• DFI DT200-CS High Performance MXM Embedded System
• 8th/9th Generation Intel Core Processors
• Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection)
• AI accelerated: up to 110W GPU MXM module supported
• Support M.2 B key 3052 5G cellar module
• Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM
• 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap) -
DFI MD711 i7 Medical Embedded System
• DFI MD711-SU2061-100G – Medical Embedded System
• 6th Generation Intel Core Medical Computing System
• 2 DDR4 SODIMM up to 32GB
• 2 x 2.5″ SATA 3.0 drive bay
• Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
• 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0
• 15-Year CPU Life Cycle Support -
DFI MD711 i5 Medical Embedded System
• DFI MD711-SU2061-000G – Medical Embedded System
• 6th Generation Intel Core Medical Computing System
• 2 DDR4 SODIMM up to 32GB
• 2 x 2.5″ SATA 3.0 drive bay
• Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
• 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0
• 15-Year CPU Life Cycle Support -
DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System
• DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System
• 8th/9th Gen Intel® Core™ Processors with Intel® C246/Q370/H310 Chipset
• 2 DDR4 SODIMM up to 64GB
• Single/Triple storage: 1 M.2 SSD + 2 2.5″ SSD (option) (with RAID supported)
• Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM
• 2 HDMI 2.0 Support resolution 4K@60Hz
• Acoustic level support full load 36dB @operating temperature 45° C
• 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap) -
DFI EC102-XNX NVIDIA Jetson Xavier NX Embedded System
• DFI’s EC102-XNX NVIDIA Jetson Industrial PC – AI Embedded System powered by NVIDIA Jetson Xavier NX
• Fully support NVIDIA® Jetson Xavier™ NX
• 91.4mm (W) x 70mm (H) x 76.6mm (D)
• Fanless chassis technology
• 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
• 1 x HDMI 2.0a/b Type-A supports 4K@60Hz -
DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Embedded System
• DFI EC510-CS/EC511-CS | 8th/9th Gen Intel Core | 5G | AI accelerator card | PoE | Coffee Lake | Fanless Embedded System | High-Performance | Modular-Designed
• 8th/9th Generation Intel® Core™ with Intel® Q370/H310
• Supports DDR4 SODIMM up to 64GB
• Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
• Support 4 PoE (EC51x-CS6G86E-Q)
• 1 PCIe and 3 M.2 slots support NVMe
• Support 5G Communication
• Operating Temperature: -20 to 70°C
• 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap) -
DFI EC543-CS 8th/9th Gen 5G Fanless Embedded System
• DFI EC543-CS | 8th/9th Gen Intel Core | 5G | AI accelerator card | PoE | Coffee Lake | Fanless Embedded System | High-Performance | Modular-Designed
• 8th/9th Generation Intel® Core™ with Intel® Q370
• Supports DDR4 SODIMM up to 64GB
• Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
• Support 4 PoE (EC543-CS6G86E-Q configuration)
• 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
• Support 5G communication
• Operating temperature: -20 to 70°C
• 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap) -
DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System
• DFI EC500-CS | 8th/9th Gen Intel Core | 5G | Coffee Lake | Fanless Embedded System | High-Performance | Modular-Designed
• 8th/9th Generation Intel® Core™ with Intel® Q370/H310
• Supports DDR4 SODIMM up to 64GB
• Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
• Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only)
• 3 M.2 slots support NVMe
• Support 5G Communication
• Operating Temperature: -20 to 70°C
• 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap) -
DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System
• DFI EC90A-GH | AMD Ryzen R1000 Series | Ulrta Small Mini PC | Fanless Embedded System
• AMD Ryzen™ Embedded R1000 Series
• Ultra Small Size: 110 x 80mm x 60mm (W x H x D)
• Expansion Options of 2 serial ports or LTE or WiFi
• User friendly of installing SIM card design
• I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI
• 10-Year CPU Life Cycle Support Until Q1′ 30 (Based on AMD Roadmap) -
DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC
• DFI ECX700-AL | Ruggedized | Outdoor | IoT | IP67 | Fanless Embedded System
• Intel® Atom® Processor E3900 Series
• Ruggedized IPC67 Grade Box PC
• Outdoor IoT Gateway Application
• 4GB DDR3 onboard, 64G eMMC
• Operating temperature: -40° to 70° C
• 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap) -
DFI EC100-XNX NVIDIA Jetson Xavier NX PoE Embedded System
• DFI’s EC100-XNX NVIDIA Jetson Industrial PC – PoE Embedded System powered by NVIDIA Jetson Xavier NX
• Fully support NVIDIA® Jetson Xavier™ NX
• 8 x 10/100 MbE with PoE
• Fanless chassis technology
• 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
• 1 x HDMI 2.0a/b Type-A supports 4K@60Hz -
DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC
• DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC
• 8th/9th Generation Intel® Core™ Processors
• 4 x 802.3af POE Ports
• AI Accelerated: Up to 110W GPU MXM Module Supported
• Multiple Expansion Slots for 3G/LTE/5G Cellular Support
• Extended Operating Temperature: -25°C to 70°C
• Support 5G Communication
• 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap) -
DFI RC-300-CS AI-Enabled 5G MXM Railway System
• DFI RC-300-CS AI-Enabled 5G MXM Railway System
• 8th/9th Generation Intel® Core™ Processors
• 4 x M12 X-coded PoE Ports at 15W
• AI Accelerated: Up to 110W GPU MXM Module Supported
• Multiple Expansion Slots for 3G/LTE/5G Cellular Support
• Extended Operating Temperature: -25°C to 70°C Operation without Active Fan
• Support 5G Communication
• 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap) -
DFI VC230-AL Intel Atom E3900 Series In-Vehicle PC
• DFI VC230-AL Intel Atom E3900 Series Anti-vibration In-Vehicle PC
• Anti-vibration and fanless In-Vehicle computer
• Supports ignition delay on/off function
• 1 mSATA, eMMC (optional)
• GPS Onboard, 3 SIM Slots Onboard
• Supports Wi-Fi, 3G, and GPRS application
• 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap) -
DFI EC300-CS AI-Enabled 5G MXM PoE High Performance System
• DFI EC300-CS AI-Enabled 5G MXM PoE High Performance System
• 8th/9th Generation Intel® Core™ Processors
• 4 x RJ45 type PoE ports at 15W
• AI Accelerated: Up to 110W GPU MXM Module Supported
• Multiple Expansion Slots for 3G/LTE/5G Cellular Support
• Extended Operating Temperature: -25°C to 70°C
• Support 5G Communication
• 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap) -
DFI EC700-AL Fanless Wide Temp Embedded Ultra Compact PC
• DFI EC700-AL Fanless Wide Temp Embedded Ultra Compact PC
• DDR3L-1866 memory onboard + 1 SODIMM up to 8GB
• Displays: 1 DP/HDMI combo + 1 DP/VGA
• Supports 2 Mini PCIe and 1 M.2 slots
• Rich I/O ports: up to 4 Intel GbE, 4 COM, 4 USB
• Extended operating temperature: -40 to 70°C
• 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)