Asrock iEPF-9001S-EX4 Intel Xeon Q470E Expendable Rugged Edge AIoT Platform

iEPF-9001S-EX4 Rugged Intelligent Edge Platform – Intel 10th Gen (Comet Lake) Xeon W and Core Processors with Q470E Chipset

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Description

ASRockInd iEPF 9000S iEP 9000E Series Edge AIoT Platform

Expendable Edge AIoT Platform

Designed to perform and built to last, the Expandable Edge AIoT Platform features super computing power encompassing flexible expansions with wide connectivity options, and a rugged design for edge AI computing. The Series is the essential core for workload consolidation and accelerates system integration development across industries.

Features

  • Intel® 10th Gen (Comet Lake) Xeon® W and Core™ Processors with Q470E Chipset
  • 4 x 260-pin SO-DIMM up to 128GB (32GB per DIMM)
  • 1 x PCIe x16 (Gen 3) or 2 x PCIe x8 (Gen 3), 2 x PCIe x4
  • 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
  • 4 x USB 3.2 Gen2, 3 x USB 2.0, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO
  • 5 x Intel Gigabit LAN (2 support PoE)
  • Supports Triple Display, 2 x Displayport, 1 x VGA

Specification

Processor System
CPU Intel® 10 Gen (Comet Lake) Xeon® W and Core™ Processors
Chipset Intel® Q470E
Socket LGA1200
Memory
Technology Dual Channel DD4 2933 / 2666 / 2400 / 2133 MHz
(ECC memory supported by CPU)
– Intel® Xeon® W (10 & 8 Core) and Core™ CPUs support DDR4 up to 2933 MHz
– Intel® Xeon® W (6 Core) and Core™ CPUs support DDR4 up to 2666 MHz
– Intel Pentium / Celeron CPU support DDR4 up to 2400 MHz
– When all 4 x SO-DIMM are occupied, the DDR4 frequency is up to 2133 MHz
Capacity 128 GB (32 GB per DIMM)
Socket 4 x 260-pin SO-DIMM
Graphics
Controller Intel® UHD Graphics
DisplayPort DisplayPort 1.2 , DP++
Max resolution up to 4096×2160@60Hz
VGA Max resolution up to 1920×1200@60Hz
MultiDisplay Triple Display
Expansion Slot
PCIe 1 x PCIe x16 (Single at x16 or dual at x8)
1 x PCIe x8 (shared with dual at x8)
2 x PCIe x4 (1 shared with M.2 Key M)
mini-PCIe 2 x Full/Half size with PCIe x1 and USB 2.0
M.2 1 x M.2 (Key E, 2230) with PCIe x1 and USB 2.0 for Wireless
1 x M.2 (Key B, 2280/3042/3052) with PCIe x1 / SATA / USB 3.2 and SIM for 4G / 5G
SIM Socket 2 (1 connected to Mini PCIe, 1 connected to M.2 Key B)
Audio
Interface Realtek ALC897, High Definition Audio.
Ethernet
Controller/ Speed 4 x i210IT (2 support PoE) + 1 x i219LM (vPro support)
Connector 5 x RJ45
Rear I/O
DisplayPort 2
VGA 1
Ethernet 5 x 1 Gigabit LAN
USB 4 x USB 3.2 Gen2, 3 x USB 2.0 (1 x internal connector w/ lock function)
COM 6 x COM (2 x RS-232, 4 x RS-232/422/485)
Audio 1 x Mic-in, 1 x Line-out
DIO 8-ch DI and 8-ch DO
Storage
M.2 1 x M.2 (Key M, 2230/2242/2280) with PCIe x4 (shared with PCIe x4 slot) and SATA for SSD
SATA 4 x SATA3 (6Gb/s), support RAID 0/1/5/10
4 x 2.5″ HDD/SSD Tray
CFast 1 x Type II socket (Shared SATA)
Watchdog Timer
Output From Super I/O to drag RESETCON#
Interval 256 Segments, 0, 1, 2, …255sec
Power Requirements
Input PWR 9V~36V VDC with Ignition control and remote power on/off switch.
80V Surge Protection, OVP, UVP, OCP and reverse protection
Environment
Operating Temp 35W CPU: -40°C~75°C ( -40°F~167°F)
65W CPU: -40°C~55°C ( -40°F~131°F)
80W CPU: -40°C~45°C ( -40°F~113°F)
Storage Temp -40°C~85°C ( -40°F~185°F)
Operating Humidity 95% @ 40°C (non-condensing)
Storage Humidity 95% @ 40°C (non-condensing)
Shock Operating: 50 Grms, half sine 11ms duration (w/ 2.5″ SSD/CFast)
Vibration Operating: 5 Grms, 5-500 Hz, 3 axes (w/2.5″ SSD/CFast)
ESD Contact +/-4kV, Air +/-8kV
EMC EN61000-6-4/-2, CE & FCC Class A
Safety CB, UL
Mechanical
Construction Aluminum heatsink + Metal chassis
Mounting Wall Mount
Dimensions (W x H x D) 202mm (W) x 290mm (D) x 209.3mm (H) (7.95″ x 11.42″ x 8.24″)
Weight TBD
Others
OS Support Windows 10 & Linux (Ubuntu)
TPM TPM 2.0

 

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

Datasheet

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If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

 

Design | Develop | Test | Manufacture

Here’s a selection of our design, manufacturing

& associated services: –

 

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.DesignToOrder

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:BuildToOrder

  • Custom specification (CPU, Ram, I/O, Storage)
  • Chassis customisation and branding
  • Custom BIOS
  • Software – Custom OS Image
  • Custom Packaging and branding
  • Integrating newly designed or existing hardware into a larger system

Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & DeploymentEmbeddedSoftware

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images?
  • Custom BIOS

Manufacturer : Asrock

CPU

  • Powered By : Intel
  • CPU Family : Celeron, Pentium, Xeon
  • CPU Generation : Comet lake-S
  • CPU Model : Xeon Support
  • CPU Speed :
  • CPU Cores :

Memory

  • Memory Installed :
  • Memory Slots : 4
  • Memory Type : 2133Mhz DDR4, 2666Mhz DDR4, 2933Mhz DDR4

I/O and Expansion

  • Expansion Slots : CFast, M.2, Mini PCIe, PCIe, SATA
  • LAN Ports : 5
  • Serial Ports : 6
  • USB 2 Ports : 3
  • USB 3 Ports :
  • USB 3.1 Ports : 4
  • Video Output : DisplayPort, VGA
  • Multi Display : Triple Display
  • Wireless Connectivity :

Operating System

  • OS : Linux, Windows

Certifications

  • Certifications : EN61000-6-2

Industry

  • Industry : Harsh Environments, Industrial Automation and Control, Transport and Smart City

Features

  • 24/7 Use : Yes
  • 4G-GPS : Yes
  • Artificial Intelligence Use : Artificial Intelligence, Edge Computing, Machine Learning, Machine Vision
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT : Yes
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays : Triple
  • NUC :
  • Other Features : GPIO
  • PoE : Yes
  • Rugged : Yes
  • Ryzen :
  • System Type : Box PC
  • Touchscreen :
  • Whiskey Lake :
  • Wide Temp : Yes

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