DFI QM370 Xeon E-2176M 8th Gen Com Express Basic Module
• DFI 8th Gen Com Express Module – QM370 – Xeon E-2176M
• Dual channel DDR4 2666MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
• eDP resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
Description
- Dual channel DDR4 2666MHz SODIMM up to 32GB
- Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
- eDP resolution supports up to 4096×2304 @ 60Hz
- Multiple expansion: 1 PCIe x16, 8 PCIe x1
- Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
- 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
Specification
| System |
| Processor |
| 8th Generation Intel® Core™ Processors, BGA 1440 |
| Intel® Xeon® E-2176M Processor, 6 Cores, 12M Cache, 2.7GHz (4.4GHz), 45W |
| Intel® Core™ i7-8850H Processor, 6 Cores, 12M Cache, 2.6GHz (4.3GHz), 45W |
| Intel® Core™ i5-8400H Processor, 4 Cores, 8M Cache, 2.5GHz (4.2GHz), 45W |
| Intel® Core™ i3-8100H Processor, 4 Cores, 6M Cache, 3.0GHz, 45W |
| Chipset |
| Intel® CM246 Chipset (Support ECC) |
| Intel® QM370 Chipset |
| Memory |
| Two 260-pin SODIMM up to 32GB |
| Dual Channel DDR4 2666MHz |
| BIOS |
| AMI SPI 128Mbit |
| Graphics |
| Controller |
| Intel® HD Graphics |
| Feature |
| OpenGL up to 4.5, DirectX 11, OpenCL 2.1 |
| HW Decode: HEVC/H.265, H.264, M/JPEG, MPEG2, VC1/WMV9, VP8 (8-bit), VP9 (10-bit) |
| HW Encode: HEVC/H.265, M/JPEG, MPEG2, VP8 |
| Display |
| 1 x VGA/DDI (DDI available upon request) |
| 1 x LVDS/eDP (eDP available upon request) |
| 2 x DDI (HDMI/DVI/DP++) |
| VGA: resolution up to 1920×1200 @ 60Hz |
| LVDS: dual channel 24-bit, resolution up to 1920×1200 @ 60Hz |
| HDMI: resolution up to 4096×2160 @ 30Hz 24bpp |
| DVI: resolution up to 1920×1200 @ 60Hz |
| DP++/eDP: resolution up to 4096×2304 @ 60Hz |
| Triple Displays |
| VGA + LVDS + DDI or VGA + DDI 1 + DDI 2 |
| eDP + 2 DDI (available upon request) |
| Expansion |
| Interface |
| 1 x PCIe x16 or 2 x PCIe x8 (Gen 3) |
| 8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3) |
| 1 x LPC |
| 1 x I2C |
| 1 x SMBus |
| 2 x UART (TX/RX) |
| Audio |
| Interface |
| HD Audio |
| Ethernet |
| Controller |
| 1 x Intel® I219LM with iAMT12.0 PCIe (10/100/1000Mbps) |
| I/O |
| USB |
| 4 x USB 3.1 |
| 8 x USB 2.0 |
| SATA |
| 4 x SATA 3.0 (up to 6Gb/s) |
| RAID 0/1/5/10 |
| DIO |
| 1 x 8-bit DIO (Default 4 inputs and 4 outputs) |
| Watchdog Timer |
| Output & Interval |
| System Reset, Programmable via Software from 1 to 255 Seconds |
| Security |
| TPM |
| Available Upon Request |
| Power |
| Type |
| 12V, 5VSB, VCC_RTC (ATX mode) |
| 12V, VCC_RTC (AT mode) |
| Consumption |
| Typical: 12V @ 0.85A (13.07Watt) |
| Max.: 12V @ 5.75A (74.084Watt) |
| OS Support |
| OS Support |
| Windows: Windows 10 IoT Enterprise 64-bit |
| Linux |
| Environment |
| Temperature |
| Operating: 0 to 60°C, -40 to 85°C |
| Storage: -40 to 85°C |
| Humidity |
| Operating: 5 to 90% RH |
| Storage: 5 to 90% RH |
| MTBF |
| 1,360,171 hrs @ 25°C; 892,642 hrs @ 45°C; 624,277 hrs @ 60°C excluding accessories |
| Calculation Model: Telcordia Issue 4 |
| Environment: GB, GC – Ground Benign, Controlled |
| Mechanism |
| Compliance |
| PICMG COM Express® R2.1, Type 6 |
| Dimensions (W x H x D) |
| COM Express® Basic |
| 95mm (3.74″) x 125mm (4.9″) |
| Packing List |
| Packing List |
| 1 CH960-CM246/QM370 board |
| 1 Cooler (Height: 36.58mm): Wide Temp: A71-111100-010G, Standard: A71-111100-000G |
Ordering Information
| Model Name | Part Number | Description |
| CH960-QM370TS-8850H | 770-CH9601-000G | Cooler, Intel Core i7-8850H, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, -40 to 85°C |
| CH960-CM246BS-2176M | 770-CH9601-100G | Cooler, Intel Xeon E-2176M, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C |
| CH960-QM370BS-8850H | 770-CH9601-200G | Cooler, Intel Core i7-8850H, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C |
| CH960-QM370BS-8400H | 770-CH9601-500G | Cooler, Intel Core i5-8400H, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C |
| CH960-QM370BS-8100H | 770-CH9601-700G | Cooler, Intel Core i3-8100H, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C |
BVM Customisation Service
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.
If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.
Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.
Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.
Design | Develop | Test | Manufacture
With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality
Here’s a selection of our design, manufacturing & associated services: –
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
 Testing |
 Materials Management |
 Logistics and Tracking |
 External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
Manufacturer : DFI
Motherboard
- Form Factor :
CPU
- Powered By : Intel
- CPU Family : Xeon
- CPU Generation :
- CPU Model : E-2176M
- CPU Speed : 2.7Ghz
- CPU Cores : 6 Cores
Memory
- Memory Installed :
- Memory Slots : 2
- Memory Type : 2666Mhz DDR4
I/O and Expansion
- Expansion Slots : PCIe, SATA
- LAN Ports : 1
- Serial Ports :
- USB 2 Ports : 8
- USB 3 Ports :
- USB 3.1 Ports : 4
- Video Output : DDI, eDisplayPort, LVDS, VGA
- Multi Display : Triple Display
- Wireless Connectivity :
Operating System
- OS :
Certifications
- Certifications :
Industry
- Industry :
Features
- 24/7 Use :
- 4G-GPS :
- Artificial Intelligence Use :
- ATEX :
- High Performance :
- Industrial :
- In-Vehicle :
- IoT :
- IP Rating :
- Low Powered :
- Mini-ITX :
- Multi Displays : Triple
- NUC :
- Other Features :
- PoE :
- Rugged :
- Ryzen :
- System Type : Computer-On-Module
- Touchscreen :
- Whiskey Lake :
- Wide Temp :
Categories : COM Express Basic, Intel 8th Generation COM Express Basic Modules
