DFI AL9A2 Intel Atom E3900 COM Express Mini
COM Express Type 10, Intel Atom E3900, DDR3L, 4 PCIe x1, 2 SATA 3.0, 10 USB, 1 LVDS, 1 DDI, eMMC
Description
- Intel Atom® E3900 Processor Series
- Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0
- Multiple expansions: 4 PCIe x1
- 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP) Supports dual displays: DDI + LVDS/eDP
- Dual Channel DDR3L 1600MHz Memory Down up to 8GB
- 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
Rugged Design and Energy-Efficiency for Deeply Embedded Applications
DFI launched new products to provide enhanced processing capability, low-power consumption, and brilliant graphic performance under Goldmont architecture with 14nm manufacturing node. Relying on DFI’s innovative abilities in design and manufacture, these products are small-sized, fanless, and support extended temperature range from -40°C up to +85°C, which makes it a perfect suite for many space-constrained and thermally limited embedded applications.
Wide Operating Temperature with Fanless Design
These products are able to survive under a wide -40°C to +85°C operating temperature range. Satisfying the demands of industries in harsh environments with the need of thermal solution designs. Also, this outstanding fanless design makes awesome system integration.
Energy Saving but High Performance
With the latest processor under Goldmont architecture, these boards offer 30% significant improvement for processing and intense graphic performance (Gen9), it also saves an average of 9 watts TDP energy.
Specification
Intel Atom® x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12W
Intel Atom® x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W
Intel Atom® x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6.5W
Intel® Pentium® Processor N4200, Quad Core, 2M Cache, 1.1GHz (2.5GHz), 6W
Intel® Celeron® Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W
Single Channel DDR3L 1600MHz
HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
1 x LVDS/eDP
LVDS: single channel 24-bit, resolution up to 1366×768 @ 60Hz
HDMI: resolution up to 3840 x 2160 @ 30Hz
DP++: resolution up to 4096×2160 @ 60Hz
eDP: resolution up to 3840×2160 @ 60Hz
DDI + eDP
1 x SDIO (available upon request)
1 x LPC
2 x I2C
1 x SMBus
1 x SPI
2 x UART (TX/RX)
1 x Intel® I210IT (10/100/1000Mbps) (-40°C to 85°C)
8 x USB 2.0
Max.: E3950:12V @ 1.89A (22.68W)
Linux
-40 to 85°C
Storage: -40 to 85°C
Storage: 5 to 90% RH
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
1 Heat sink: A71-008114-000G (E Series); A71-008114-010G (N Series)
Ordering Information
Description |
AL9A2-T80-E3940 – 770-AL9A21-000G – Fanless, Intel Atom E3940, 1 LVDS, 1 DIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 8GB DDR3L Memory Down, -40 to 85°C |
AL9A2-B80-E3950 – 770-AL9A21-100G – Fanless, Intel Atom E3950, 1 LVDS, 1 DIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 8GB DDR3L Memory Down, 0 to 60°C |
AL9A2-T40-E3930 – 770-AL9A21-200G – Fanless, Intel Atom E3930, 1 LVDS, 1 DIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down, -40 to 85°C |
AL9A2-B40-N4200 – 770-AL9A21-300G – Fanless, Intel Pentium N4200, 1 LVDS, 1 DIO, 1 LAN, 2 USB 3.0, 8 USB 2.0, 4GB DDR3L Memory Down, 0 to 60°C |
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.
Design | Develop | Test | Manufacture
Here’s a selection of our design, manufacturing
& associated services: –
Design to Order: OEM/ODM Embedded Product Design Services
For customers designing a brand-new product from scratch or working with an existing prototype.
- FREE Pre-design / Pre-sales advise
- Prototyping – Custom PC Design, Custom Panel PC, Custom Racks or Custom Peli Case PCs
- Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
- Custom PCB / Board Design
- Custom Chassis Design
- Custom Cables
- Custom Back Panels and Faceplates
- Custom Cooling
- Custom Metal Work (internal brackets, mounting brackets)
- Touchscreen Integration and Display Enhancements
- Software – Custom OS Image
Build to Order: Embedded Computer Design and Customisation Services
Take an existing system and we can:
- Custom specification (CPU, Ram, I/O, Storage)
- Chassis customisation and branding
- Custom BIOS
- Software – Custom OS Image
- Custom Packaging and branding
- Integrating newly designed or existing hardware into a larger system
Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs
Embedded Software Services : Configuration, Integration and Deployment
Porting, Integration & Deployment
- Windows image capture from customers HDD
- Linux image capture from customers HDD
- Windows / Linux Deployment from customers image
- Custom Windows images, create and deploy
- Update management
- Custom Linux and Android images?
- Custom BIOS