DFI CS103-Q370/C246 8th Gen Intel Core Wide Temp Mini-ITX
• DFI CS103-Q370/C246 8th Gen Intel Core Wide Temp Mini-ITX
• 8th Gen Intel® Core™ with Intel® Q370/C246
• 2 DDR4 2400/2666MHz SODIMM up to 32GB
• Three independent displays: LVDS + DP++ + DP++
• DP++ resolution supports up to 4096×2304 @ 60Hz
• Multiple Expansions: 1 PCIe x4 Gen 3, 1 M.2 2280 M Key, 1 M.2 2230 E Key
• Storage: 2 SATA 3.0
• Rich I/O: 2 Intel GbE, 4 COM, 4 USB 3.1 Gen 2, 4 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 33 (Based on Intel IOTG Roadmap)
Description
- 8th Gen Intel® Core™ with Intel® Q370/C246
- 2 DDR4 2400/2666MHz SODIMM up to 32GB
- Three independent displays: LVDS + DP++ + DP++
- DP++ resolution supports up to 4096×2304 @ 60Hz
- Multiple Expansions: 1 PCIe x4 Gen 3, 1 M.2 2280 M Key, 1 M.2 2230 E Key
- Storage: 2 SATA 3.0
- Rich I/O: 2 Intel GbE, 4 COM, 4 USB 3.1 Gen 2, 4 USB 2.0
- 15-Year CPU Life Cycle Support Until Q2′ 33 (Based on Intel IOTG Roadmap)
Specification
System
Processor
9th Generation Intel® Core™ Processors, LGA 1151 Socket
Intel® Core i7-9700TE Processor (Core 8; Max speed 3.8 GHz; TDP 35W)
Intel® Core i5-9500E Processor (Core 6; Max speed 4.2 GHz; TDP 65W)
Intel® Core i5-9500TE Processor (Core 6; Max speed 3.6 GHz; TDP 35W)
Intel® Core i3-9100E Processor (Core 4; Max speed 3.7 GHz; TDP 65W) (support ECC memory)
Intel® Core i3-9100TE Processor (Core 4; Max speed 3.2 GHz; TDP 35W) (support ECC memory)
8th Generation Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-8700 Processor (Core 6; Max speed 4.6 GHz; TDP 65W)
Intel® Core™ i7-8700T Processor (Core 6; Max speed 4.0 GHz; TDP 35W)
Intel® Core™ i5-8500 Processor (Core 6; Max speed 4.1 GHz; TDP 65W)
Intel® Core™ i5-8500T Processor (Core 6; Max speed 3.5 GHz; TDP 35W)
Intel® Core™ i3-8100 Processor (Core 4; Max speed 3.6 GHz; TDP 65W) (support ECC memory)
Intel® Core™ i3-8100T Processor (Core 4; Max speed 3.1 GHz; TDP 35W) (support ECC memory)
Intel® Pentium G5400 Processor (Core 2; Max speed 3.7 GHz; TDP 58W) (support ECC memory)
Intel® Celeron G4900 Processor (Core 2; Max speed 3.1 GHz; TDP 54W) (support ECC memory)
Intel® Core i7-9700TE Processor (Core 8; Max speed 3.8 GHz; TDP 35W)
Intel® Core i5-9500E Processor (Core 6; Max speed 4.2 GHz; TDP 65W)
Intel® Core i5-9500TE Processor (Core 6; Max speed 3.6 GHz; TDP 35W)
Intel® Core i3-9100E Processor (Core 4; Max speed 3.7 GHz; TDP 65W) (support ECC memory)
Intel® Core i3-9100TE Processor (Core 4; Max speed 3.2 GHz; TDP 35W) (support ECC memory)
8th Generation Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-8700 Processor (Core 6; Max speed 4.6 GHz; TDP 65W)
Intel® Core™ i7-8700T Processor (Core 6; Max speed 4.0 GHz; TDP 35W)
Intel® Core™ i5-8500 Processor (Core 6; Max speed 4.1 GHz; TDP 65W)
Intel® Core™ i5-8500T Processor (Core 6; Max speed 3.5 GHz; TDP 35W)
Intel® Core™ i3-8100 Processor (Core 4; Max speed 3.6 GHz; TDP 65W) (support ECC memory)
Intel® Core™ i3-8100T Processor (Core 4; Max speed 3.1 GHz; TDP 35W) (support ECC memory)
Intel® Pentium G5400 Processor (Core 2; Max speed 3.7 GHz; TDP 58W) (support ECC memory)
Intel® Celeron G4900 Processor (Core 2; Max speed 3.1 GHz; TDP 54W) (support ECC memory)
Chipset
Intel® Q370/C246 Chipset
Memory
Two 260-pin SODIMM up to 32GB
Dual Channel DDR4 2400/2666MHz (support ECC memory by C246)
Dual Channel DDR4 2400/2666MHz (support ECC memory by C246)
BIOS
AMI SPI 128Mbit
Graphics
Controller
Intel® UHD Graphics 630 (only Pentium G5400, Celeron G4900 support 610 )
Feature
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
Display
1 x LVDS
2 x DP++
LVDS: resolution up to 1920×1200 @ 60Hz
DP1.2: resolution up to 4096×2304 @ 60Hz
2 x DP++
LVDS: resolution up to 1920×1200 @ 60Hz
DP1.2: resolution up to 4096×2304 @ 60Hz
Triple Displays
DP++ +DP++ + LVDS
Expansion
Interface
1 x PCIe x4 (Gen 3)
2 x DFI proprietary extension bus for PCIe/PCI expansion
1 x M.2 2280 M Key (PCIe x4/SATA) (support NVMe and Intel® Optane memory)
1 x M.2 2230 E Key (USB/PCIe)
2 x DFI proprietary extension bus for PCIe/PCI expansion
1 x M.2 2280 M Key (PCIe x4/SATA) (support NVMe and Intel® Optane memory)
1 x M.2 2230 E Key (USB/PCIe)
Audio
Audio Codec
Realtek ALC888S-VD2-GR
Ethernet
Controller
1 x Intel® I219LM PHY with iAMT12 and vPro (10/100/1000Mbps) (Core i7/i5 supports iAMT)
1 x Intel® I211AT PCIe (10/100/1000Mbps)
1 x Intel® I211AT PCIe (10/100/1000Mbps)
Rear I/O
Ethernet
2 x GbE (RJ-45)
USB
4 x USB 3.1 Gen2
Display
2 x DP++
Internal I/O
Serial
2 x RS-232/422/485 (2.0mm pitch)
2 x RS-232 (2.0mm pitch)
2 x RS-232 (2.0mm pitch)
USB
4 x USB 2.0 (2.0mm pitch)
Display
1 x LVDS
Audio
1 x Front Audio (2.0mm pitch)
SATA
2 x SATA 3.0 (up to 6Gb/s)
1 x SATA Power
RAID 0/1/5
1 x SATA Power
RAID 0/1/5
DIO
1 x 8-bit DIO
LPC
1 x LPC
SMBus
1 x SMBus
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
dTPM 2.0
Power
Type
9-36V DC-in
Connector
DC-in Jack
Right Angle Connector (4-pin) (available upon request)
Straight Type Connector (4-pin) (available upon request)
Right Angle Connector (4-pin) (available upon request)
Straight Type Connector (4-pin) (available upon request)
Consumption
Idle: i7-8700 65W: 19V @ 0.61A (11.59W)
Max: i7-8700 65W: 19V @ 5.74A (109.06W)
Max: i7-8700 65W: 19V @ 5.74A (109.06W)
RTC Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows 10 IoT Enterprise 64-bit
Linux
Linux
Environment
Temperature
Operating: -10 to 70°C
Storage: -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
CS103-C246: 604,132 hrs @ 25°C; 359,766 hrs @ 45°C; 232,819 hrs @ 60°C; 172,632 hrs @ 70°C
CS103-Q370: 604,132 hrs @ 25°C; 359,766 hrs @ 45°C; 232,819 hrs @ 60°C; 172,632 hrs @ 70°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
CS103-Q370: 604,132 hrs @ 25°C; 359,766 hrs @ 45°C; 232,819 hrs @ 60°C; 172,632 hrs @ 70°C
Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
Mini-ITX Form Factor
170mm (6.7″) x 170mm (6.7″)
170mm (6.7″) x 170mm (6.7″)
Height
PCB: 1.6mm
Top Side: 20mm, Bottom Side: 3mm
Top Side: 20mm, Bottom Side: 3mm
Packing List
Packing List
• 1 CS103 motherboard
• 1 Serial ATA data with power cable (Length: 300mm) A81-002013-000G
• 1 COM port cable (Length: 250mm, 1 x COM ports) A81-015011-001G
• 1 Serial ATA data with power cable (Length: 300mm) A81-002013-000G
• 1 COM port cable (Length: 250mm, 1 x COM ports) A81-015011-001G
Country of Origin
Country of Origin
Taiwan
BVM Customisation Service
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.
If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.
Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.
Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.
Design | Develop | Test | Manufacture
With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality
Here’s a selection of our design, manufacturing & associated services: –
|
|
|
ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
 Testing |
 Materials Management |
 Logistics and Tracking |
 External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
Manufacturer : DFI
Motherboard
- Form Factor : Mini-ITX
CPU
- Powered By : Intel
- CPU Family : Celeron, iCore
- CPU Generation : Coffee Lake-S
- CPU Model : i3 Support, i5 Support, i7 Support
- CPU Speed :
- CPU Cores : Dual Core, Quad Core
Memory
- Memory Installed :
- Memory Slots : 2
- Memory Type : 2400Mhz DDR4, 2666Mhz DDR4
I/O and Expansion
- Expansion Slots : M.2, PCIe, SATA
- LAN Ports : 2
- Serial Ports : 4
- USB 2 Ports : 4
- USB 3 Ports :
- USB 3.1 Ports : 4
- Video Output : DisplayPort
- Multi Display : Triple Display
- Wireless Connectivity :
Operating System
- OS : Linux, Windows
Certifications
- Certifications :
Industry
- Industry : Digital Signage, Gaming and Casino, Industrial Automation and Control, Medical, Military, Transport - Road, Transport and Smart City
Features
- 24/7 Use :
- 4G-GPS :
- Artificial Intelligence Use :
- ATEX :
- High Performance :
- Industrial :
- In-Vehicle :
- IoT :
- IP Rating :
- Low Powered :
- Mini-ITX :
- Multi Displays : Triple
- NUC :
- Other Features : GPIO
- PoE :
- Rugged : Yes
- Ryzen :
- System Type :
- Touchscreen :
- Whiskey Lake :
- Wide Temp : Yes
Categories : Intel Coffee Lake Mini-ITX Motherboards and SBCs, Mini-ITX Industrial Motherboards
.jpg?resize=300%2C300&ssl=1)
.jpg?resize=300%2C300&ssl=1)
