DFI Ryzen Embedded Com Express Module – GH960-V1756

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DFI Ryzen Embedded Com Express Module – GH960-V1756 – 3.25Ghz – Quad Core – PCIe – LVDS VGA eDP

Description

  • Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
  • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default);Supports up to four independent displays
  • DP++ resolution supports up to 4096×2304 @ 60Hz
  • Multiple expansion: 1 PCIe x8, 7 PCIe x1
  • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
  • 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap)

Specification

System
Processor
AMD® Ryzen™ Embedded V1807, Quad Core, 2MB Cache, 11 CU, 3.35GHz (3.8GHz), 35-54W
AMD® Ryzen™ Embedded V1756, Quad Core, 2MB Cache, 8 CU, 3.25GHz (3.6GHz), 35-54W
AMD® Ryzen™ Embedded V1605, Quad Core, 2MB Cache, 8 CU, 2.0GHz (3.6GHz), 12-25W
AMD® Ryzen™ Embedded V1202, Dual Core, 1MB Cache, 3 CU, 2.3GHz (3.2GHz), 12-25W
AMD® Ryzen™ Embedded R1606G, Dual Core, 1MB Cache, 3 CU, 2.6GHz (3.5GHz), 12-25W
AMD® Ryzen™ Embedded R1505G, Dual Core, 1MB Cache, 3 CU, 2.4GHz (3.3GHz), 12-25W
Memory
Two 260-pin SODIMM up to 32GB
Dual Channel DDR4 up to 2400/3200MHz
BIOS
Insyde SPI 64Mbit
Graphics
Controller
AMD® Radeon™ Vega Graphics
Feature
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
Display
1 x VGA/DDI (DDI available upon request)
1 x LVDS/eDP (eDP available upon request)
2 x DDI (HDMI/DVI/DP++)
VGA: resolution up to 1920×1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920×1200 @ 60Hz
eDP: resolution up to 3840×2160 @ 60 Hz
HDMI: resolution up to 2560×1600 @ 60Hz or 4096×2160 @ 24Hz
DVI: resolution up to 1920×1200 @ 60Hz
DP++: resolution up to 4096×2304 @ 60Hz
Quad Displays
VGA + LVDS + 2 DDI or eDP + 3 DDI (available upon request)
Expansion
Interface
HD Audio
Ethernet
Controller
1 x Intel® I210AT with iAMT12.0 PCIe (10/100/1000Mbps) (normal temp.) or
1 x Intel® I210IT with iAMT12.0 PCIe (10/100/1000Mbps) (wide temp.)
I/O
USB
4 x USB 3.1
8 x USB 2.0
SATA
1 or 2 x SATA 3.0 (up to 6Gb/s)
RAID 0/1
DIO
1 x 8-bit DIO (Default 4 inputs and 4 outputs)
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
TPM1.2/2.0 (Available Upon Request)
Power
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Consumption
TBD
OS Support
OS Support
Windows: Windows 10 IoT Enterprise 64-bit
Linux
Environment
Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
COM Express® Basic
95mm (3.74″) x 125mm (4.9″)
Compliance
PICMG COM Express® R3.0, Type 6
Packing List
Packing List
1 GH960 board
1 Cooler (Height: 36.58mm): TBD

 

Datasheet

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If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

 

Design | Develop | Test | Manufacture

Here’s a selection of our design, manufacturing

& associated services: –

 

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.DesignToOrder

  • FREE Pre-design / Pre-sales advise
  • Prototyping – Custom PC Design, Custom Panel PC, Custom Racks or Custom Peli Case PC
  • Prototyping pre checks (chargeable one-time fee for existing prototype)
    • Hardware compatibility
    • Thermal testing
    • Software compatibility
  • Custom PCB / Board Design
  • Custom Chassis Design
  • Custom Cables
  • Custom Back Panels and Faceplates
  • Custom Cooling
  • Custom Metal Work (internal brackets, mounting brackets)
  • Touchscreen Integration and Display Enhancements
  • Software – Custom OS Image

Build to Order: Embedded System Integration and Customisation Services​

Take an existing system and we can:BuildToOrder

  • Custom specification (CPU, Ram, I/O, Storage)
  • Chassis customisation and branding
  • Custom BIOS
  • Software – Custom OS Image
  • Custom Packaging and branding
  • Integrating newly designed or existing hardware into a larger system

Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs

Windows IoT and Windows 10 Embedded: Integration and Embedded Software Services

Porting, Integration & DeploymentEmbeddedSoftware

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images?
  • Custom BIOS

Manufacturer : DFI

Motherboard

  • Form Factor : Com Express

CPU

  • Powered By : AMD
  • CPU Family : AMD Ryzen
  • CPU Generation : Ryzen V-Series
  • CPU Model : V1756B
  • CPU Speed : 3.6Ghz
  • CPU Cores : Quad Core

Memory

  • Memory Installed :
  • Memory Slots : 2
  • Memory Type : 2400Mhz DDR4, 2666Mhz DDR4

I/O and Expansion

  • Expansion Slots : PCIe, SATA
  • LAN Ports : 2
  • Serial Ports :
  • USB 2 Ports : 8
  • USB 3 Ports :
  • USB 3.1 Ports : 4
  • Video Output : DDI, eDisplayPort, LVDS, VGA
  • Multi Display : Quad Display
  • Wireless Connectivity :

Operating System

  • OS :

Certifications

  • Certifications :

Industry

  • Industry :

Features

  • 24/7 Use :
  • 4G-GPS :
  • Artificial Intelligence Use :
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT :
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays : Quad
  • NUC :
  • Other Features :
  • PoE :
  • Rugged :
  • Ryzen : Yes
  • System Type : SBC
  • Touchscreen :
  • Whiskey Lake :
  • Wide Temp :

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