• IEI tKINO-ULT6 Intel Celeron Tiger Lake USB4 Mini-ITX Motherboard
• Thin Mini-ITX form factor with 11th Gen. Intel® Tiger Lake-UP3 Processor support DDR4-3200 memory
• Wide range 9~36V DC Input
• Support quadruple independent displays (HDMI, DP, eDP/LVDS, USB4)
• Dual Intel® 2.5GbE LAN
• M.2 A key for WIFI+Bluetooth (PCIe x1/USB 2.0), M.2 M key for Storage (PCIe x2/SATA)
• PCIe x8 Gen 4.0 slot (x4 signal)
Thin Mini-ITX form factor with 11th Gen. Intel® Core™ Processor Family (Tiger Lake-UP3) 11th Generation Intel® Core™ mobile processors with Iris Xe graphics.
Tiger Lake is Intel’s codename for the 11th generation Intel Core mobile processors based on the new Willow Cove Core microarchitecture, manufactured using Intel’s third-generation 10 nm process node known as 10SF (“10 nm SuperFin”).
Tiger Lake replaces the Ice Lake family of mobile processors, representing an Optimization step in Intel’s process–architecture–optimization model. Tiger Lake processors launched in 2020 are part of the Tiger Lake U family and include dual-core and quad-core 9 W (7-15 W) TDP and 15 W (12-28 W) TDP models.
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| Form Factor | |
|---|---|
| Form Factor | Mini-ITX Motherboard |
| System | |
| CPU | 11th Gen. Intel® mobile Tiger Lake-UP3 on-board processor Intel® Core™ i7-1185G7E (up to 4.4GHz, quad-core, 12M Cache, TDP=28/15/12W) Intel® Core™ i5-1145G7E (up to 4.1GHz, quad-core, 8M Cache, TDP=28/15/12W) Intel® Core™ i3-1115G4E (up to 3.9GHz, dual-core, 6M Cache, TDP=28/15/12W) Intel® Celeron® 6305E (up to 1.8GHz, dual-core, 4M Cache, TDP=15W) |
| Memory | 2 x SO-DIMM DDR4 3200MHz, system maximun up to 64GB |
| Memory Max. | Up to 64GB |
| Cooling method / System Fan | 1 x CPU Cooler |
| Physical Characteristics | |
| Dimensions (LxWxH) (mm) | 170mm x 170mm |
| Net Weight | GW:900g / NW:400g |
| Storage | |
| Storage | 1 x M.2(NGFF) |
| 2 x SATA | |
| I/O Interface | |
| Display Output | 1 x Display Port |
| 1 x eDP | |
| 1 x HDMI | |
| 1 x LVDS | |
| Ethernet | 2 x LAN: 2.5GbE LAN (Intel® I225-V) |
| Audio | 1 x Front Audio(2×5-pin) |
| HD Audio: Realtek ALC888S HD audio codec | |
| 1 x Line out | |
| 1 x Mic | |
| I/O Interface | 1 x DIO: 8-bit digital I/O (2×5 pin) |
| 5 x External USB 3.2 Gen2x2: 4 x USB 3.2 Gen2, 1 x USB 4 | |
| 4 x Internal RS-232(2×5 pin, P=2.0) | |
| 1 x Internal RS-232/422/485(2×5 pin, P=2.0) (RS-485 support AFC) | |
| 1 x Internal RS-422/485(2×5 pin, P=2.0) (RS-485 support AFC) | |
| 4 x Internal USB 2.0(2×4 pin, P=2.0) | |
| 1 x PS/2(1×6 pin) | |
| Expansion | 2 x M.2(NGFF): 1 x M.2 2230 A key (PCIe x1/USB 2.0), 1 x M.2 2242/2280 M key (PCIe x2/SATA) |
| 1 x PCIe x8: Open-ended Slot(with x4 Gen4.0 signal) | |
| Other Features | |
| TPM | 1 x TPM 2.0 connector (2×10 pin) (SPI interface) |
| Power | |
| Input | 9~36V DC input 1 x Internal power connector (2×2 pin) 1 x External DC power Jack (Ø5.5mm) |
| Power Consumption | 12V@6.48A (Intel® Core™ i7-1185G7E up to 4.4GHz CPU with 16GB (8GB x 2) DDR4-3200 memory running in 2.8GHz) |
| Environment | |
| Operating Temperature | -20°C ~ 60°C |
| Storage Temperature | -30°C ~ 70°C |
| Humidity | 5% ~ 95%, non-condensing |
| Certifications | |
| Safety & EMC | CE/FCC compliant |
| tKINO-ULT6-i7-R10 | Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Core™ i7-1185G7E Proccessor,
9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS |
|---|---|
| tKINO-ULT6-i5-R10 | Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Core™ i5-1145G7E Proccessor,
9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS |
| tKINO-ULT6-i3-R10 | Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Core™ i3-1115G4E Proccessor,
9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS |
| tKINO-ULT6-C-R10 | Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Celeron® 6305E Proccessor,
9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS |
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.
If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.
Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.
Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.
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 Testing |
 Materials Management |
 Logistics and Tracking |
 External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
Categories : Intel Tiger Lake Mini-ITX Motherboards and SBCs, Mini-ITX Embedded SBCs
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