IEI tKINO-ULT6 Intel Celeron Tiger Lake USB4 Mini-ITX Motherboard

  • Product Name: IEI tKINO-ULT6
  • Motherboard Form Factor: Mini-ITX
  • CPU: Intel Celeron Tiger Lake
  • RAM: Supports DDR4-3200 memory
  • Expansion: PCIe x8 Gen 4.0 slot (x4 signal)
  • Other features: Thin Mini-ITX form factor with 11th Gen. Intel Tiger Lake-UP3 Processor support, Wide range 9~36V DC Input, Support quadruple independent displays (HDMI, DP, eDP/LVDS, USB4), Dual Intel 2.5GbE LAN, M.2 A key for WIFI+Bluetooth (PCIe x1/USB 2.0), M.2 M key for Storage (PCIe x2/SATA)

Description

tKINO-ULT6

Thin Mini-ITX SBC supports 11th Gen. Intel® Core™ Processor Family (Tiger Lake-UP3), 9~36V DC input,
Quadruple Independent Display, SATA 6Gb/s, Dual Intel® 2.5GbE, USB4, M.2, HD audio and RoHS

 

tKINO ULT6 small

Key Features

  • Thin Mini-ITX form factor with 11th Gen. Intel® Tiger Lake-UP3 Processor support DDR4-3200 memory
  • Wide range 9~36V DC Input
  • Support quadruple independent displays (HDMI, DP, eDP/LVDS, USB4)
  • Dual Intel® 2.5GbE LAN
  • M.2 A key for WIFI+Bluetooth (PCIe x1/USB 2.0), M.2 M key for Storage (PCIe x2/SATA)
  • PCIe x8 Gen 4.0 slot (x4 signal)

Breaking the Boundaries of Performance

The Best Thin Mini-ITX board with industry-leading Graphics and AI performance

Thin Mini-ITX form factor with 11th Gen. Intel® Core™ Processor Family (Tiger Lake-UP3) 11th Generation Intel® Core™ mobile processors with Iris Xe graphics.

 

11th Gen Tiger Lake-UP3 CPU & Graphic Performance

Tiger Lake is Intel’s codename for the 11th generation Intel Core mobile processors based on the new Willow Cove Core microarchitecture, manufactured using Intel’s third-generation 10 nm process node known as 10SF (“10 nm SuperFin”).

Tiger Lake replaces the Ice Lake family of mobile processors, representing an Optimization step in Intel’s process–architecture–optimization model. Tiger Lake processors launched in 2020 are part of the Tiger Lake U family and include dual-core and quad-core 9 W (7-15 W) TDP and 15 W (12-28 W) TDP models.

 

USB4: Higher transfer speeds, improved bandwidth & backward compatibility

New Thin Mini ITX SBC feature pic USB 4

  • Two-lane operation with up to 40 Gbps operation using the USB Type-C connection
  • More efficient sharing between data and display protocols
  • Backward compatibility with USB 3.2, USB 3.1, USB 3.0, USB 2.0, and even Thunderbolt 3.

 

2.5GbE LAN

  • 2.5 times faster
    • 2.5GbE is 2.5 times faster than standard Ethernet (1GbE), increasing network performance to boost productivity. Works with existing cables
  • Works with existing cables
    • No special cables or connectors are required to take advantage of 2.5GbE. Simply use your existing CAT5e cables as normal with your new 2.5GbE infrastructure.
  • More affordable
    • If you can’t budget a 10GbE upgrade at this time, the more affordable 2.5GbE provides a notable improvement in current Ethernet speeds.

 

Application Areas

digital signage applicationDigital Signage smart retail application

SMART Retail

face recognition application

Surveillance

 

I/O

iei tkino ult6 tigerlake embedded industrial motherboard IO interface

 

Specification

Form Factor
Form Factor Mini-ITX Motherboard
System
CPU 11th Gen. Intel® mobile Tiger Lake-UP3 on-board processor
Intel® Core™ i7-1185G7E (up to 4.4GHz, quad-core, 12M Cache, TDP=28/15/12W)
Intel® Core™ i5-1145G7E (up to 4.1GHz, quad-core, 8M Cache, TDP=28/15/12W)
Intel® Core™ i3-1115G4E (up to 3.9GHz, dual-core, 6M Cache, TDP=28/15/12W)
Intel® Celeron® 6305E (up to 1.8GHz, dual-core, 4M Cache, TDP=15W)
Memory 2 x SO-DIMM DDR4 3200MHz, system maximun up to 64GB
Memory Max. Up to 64GB
Cooling method / System Fan 1 x CPU Cooler
Physical Characteristics
Dimensions (LxWxH) (mm) 170mm x 170mm
Net Weight GW:900g / NW:400g
Storage
Storage 1 x M.2(NGFF)
2 x SATA
I/O Interface
Display Output 1 x Display Port
1 x eDP
1 x HDMI
1 x LVDS
Ethernet 2 x LAN: 2.5GbE LAN (Intel® I225-V)
Audio 1 x Front Audio(2×5-pin)
HD Audio: Realtek ALC888S HD audio codec
1 x Line out
1 x Mic
I/O Interface 1 x DIO: 8-bit digital I/O (2×5 pin)
5 x External USB 3.2 Gen2x2: 4 x USB 3.2 Gen2, 1 x USB 4
4 x Internal RS-232(2×5 pin, P=2.0)
1 x Internal RS-232/422/485(2×5 pin, P=2.0) (RS-485 support AFC)
1 x Internal RS-422/485(2×5 pin, P=2.0) (RS-485 support AFC)
4 x Internal USB 2.0(2×4 pin, P=2.0)
1 x PS/2(1×6 pin)
Expansion 2 x M.2(NGFF): 1 x M.2 2230 A key (PCIe x1/USB 2.0), 1 x M.2 2242/2280 M key (PCIe x2/SATA)
1 x PCIe x8: Open-ended Slot(with x4 Gen4.0 signal)
Other Features
TPM 1 x TPM 2.0 connector (2×10 pin) (SPI interface)
Power
Input 9~36V DC input
1 x Internal power connector (2×2 pin)
1 x External DC power Jack (Ø5.5mm)
Power Consumption 12V@6.48A (Intel® Core™ i7-1185G7E up to 4.4GHz CPU with 16GB (8GB x 2) DDR4-3200 memory running in 2.8GHz)
Environment
Operating Temperature -20°C ~ 60°C
Storage Temperature -30°C ~ 70°C
Humidity 5% ~ 95%, non-condensing
Certifications
Safety & EMC CE/FCC compliant

 

Ordering Information

tKINO-ULT6-i7-R10 Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Core™ i7-1185G7E Proccessor,

9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS

tKINO-ULT6-i5-R10 Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Core™ i5-1145G7E Proccessor,

9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS

tKINO-ULT6-i3-R10 Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Core™ i3-1115G4E Proccessor,

9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS

tKINO-ULT6-C-R10 Thin Mini-ITX SBC supports Intel® 11th Gen Tigerlake-UP3 Mobile Celeron® 6305E Proccessor,

9~36V DC input, Quadruple Independent Display, HDMI, DP, eDP, SATA 6Gb/s, Dual Intel® 2.5GbE, USB 3.2 Gen 2, M.2, HD audio and RoHS

 

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

Datasheet

Download

BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.

Manufacturer : IEI

Motherboard

  • Form Factor : Mini-ITX

CPU

  • Powered By : Intel
  • CPU Family : Celeron
  • CPU Generation : Tiger Lake
  • CPU Model : 6305E

Memory

  • Memory Installed :
  • Memory Slots : 2
  • Memory Type : 3200Mhz DDR4

I/O and Expansion

  • Expansion Slots : M.2, PCIe, SATA
  • LAN Ports : 2
  • Serial Ports : 6
  • USB 2 Ports : 4
  • USB 3 Ports :
  • USB 3.X / USB C / USB 4.0 Ports :
  • Video Output : DisplayPort, eDisplayPort, HDMI, LVDS
  • Multi Display : Quad Display

Operating System

  • OS :

Certifications

  • Certifications :

Features

  • 5G-4G-GPS :
  • Artificial Intelligence Use : Artificial Intelligence
  • IP Rating :
  • Rugged : Yes
  • System Type : SBC
  • Wide Temp : Yes

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