Industrial and Embedded Products
Showing 49–96 of 125 results
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DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Embedded System
• DFI EC510-CS/EC511-CS | 8th/9th Gen Intel Core | 5G | AI accelerator card | PoE | Coffee Lake | Fanless Embedded System | High-Performance | Modular-Designed
• 8th/9th Generation Intel® Core™ with Intel® Q370/H310
• Supports DDR4 SODIMM up to 64GB
• Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
• Support 4 PoE (EC51x-CS6G86E-Q)
• 1 PCIe and 3 M.2 slots support NVMe
• Support 5G Communication
• Operating Temperature: -20 to 70°C
• 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap) -
DFI EC543-CS 8th/9th Gen 5G Fanless Embedded System
• DFI EC543-CS | 8th/9th Gen Intel Core | 5G | AI accelerator card | PoE | Coffee Lake | Fanless Embedded System | High-Performance | Modular-Designed
• 8th/9th Generation Intel® Core™ with Intel® Q370
• Supports DDR4 SODIMM up to 64GB
• Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
• Support 4 PoE (EC543-CS6G86E-Q configuration)
• 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
• Support 5G communication
• Operating temperature: -20 to 70°C
• 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap) -
DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System
• DFI EC500-CS | 8th/9th Gen Intel Core | 5G | Coffee Lake | Fanless Embedded System | High-Performance | Modular-Designed
• 8th/9th Generation Intel® Core™ with Intel® Q370/H310
• Supports DDR4 SODIMM up to 64GB
• Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection)
• Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only)
• 3 M.2 slots support NVMe
• Support 5G Communication
• Operating Temperature: -20 to 70°C
• 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap) -
DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System
• DFI EC90A-GH | AMD Ryzen R1000 Series | Ulrta Small Mini PC | Fanless Embedded System
• AMD Ryzen™ Embedded R1000 Series
• Ultra Small Size: 110 x 80mm x 60mm (W x H x D)
• Expansion Options of 2 serial ports or LTE or WiFi
• User friendly of installing SIM card design
• I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI
• 10-Year CPU Life Cycle Support Until Q1′ 30 (Based on AMD Roadmap) -
DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC
• DFI ECX700-AL | Ruggedized | Outdoor | IoT | IP67 | Fanless Embedded System
• Intel® Atom® Processor E3900 Series
• Ruggedized IPC67 Grade Box PC
• Outdoor IoT Gateway Application
• 4GB DDR3 onboard, 64G eMMC
• Operating temperature: -40° to 70° C
• 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap) -
DFI EC100-XNX NVIDIA Jetson Xavier NX PoE Embedded System
• DFI’s EC100-XNX NVIDIA Jetson Industrial PC – PoE Embedded System powered by NVIDIA Jetson Xavier NX
• Fully support NVIDIA® Jetson Xavier™ NX
• 8 x 10/100 MbE with PoE
• Fanless chassis technology
• 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
• 1 x HDMI 2.0a/b Type-A supports 4K@60Hz -
DFI AL553 Intel Atom E3900 3.5″ SBC
• DFI AL553 Intel Atom E3900 3.5″ SBC
• Intel® Atom® E3900 3.5″ SBC
• 1 DDR3L SODIMM up to 8GB
• Three independent displays: VGA + LVDS + HDMI
• Multiple expansion: 1 M.2 B Key, 1 M.2 E Key, Mini PCIe
• Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 4 USB 2.0
• 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap) -
DFI AL551 Intel Atom E3900 3.5″ SBC
• DFI AL551 Intel Atom E3900 3.5″ SBC
• Intel Atom® E3900 3.5″ SBC
• 1 DDR3L SODIMM up to 8GB
• Three independent displays: VGA + LVDS + DP++
• Wireless communication: mini PCIe
• Rich I/O: 2 Intel GbE, 2 COM, 2 USB 3.0, 4 USB 2.0
• 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap) -
DFI AL700 Intel Atom E3900 Qseven
• DFI AL700 Intel Atom E3900 Qseven
• Intel Atom® E3900 Series
• Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0
• Multiple expansions: 4 PCIe x1
• 1 DDI*, 1 LVDS*/(eDP + DDI) Supports triple displays: eDP+2DDI
• 4GB/8GB DDR3L Dual Channel Memory Down
• 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap) -
DFI AL701 Intel Atom E3900 Qseven
• DFI AL701 Intel Atom E3900 Qseven
• 4GB/8GB LPDDR4 Dual Channel Memory Down
• 1 DDI*, 1 LVDS*/(eDP + DDI)；Supports triple displays: eDP+2DDI
• DP++ resolution supports up to 4096×2160 @ 60Hz
• Multiple expansions: 4 PCIe x1
• Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap) -
DFI AL968 Intel Atom E3900 COM Express Compact
• DFI AL968 Intel Atom E3900 COM Express Compact
• Intel Atom® E3900 Series
• Dual channel DDR3L 1600MHz SODIMM up to 8GB
• Three independent displays: VGA*/DDI + LVDS*/eDP + DDI
• Multiple expansion: 4 PCIe x1, 1 LPC, 1 I2C, 1 SMBus, eMMC
• Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0, 2 SATA 3.0
• 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap) -
DFI AL9A8 Intel Atom E3900 COM Express Mini
• DFI AL9A8 Intel Atom E3900 COM Express Mini
• Intel Atom® E3900 Processor Series
• Multiple expansions: 4 PCIe x1
• Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0
• 1 LVDS/eDP, 1 DDI (HDMI/DP++) Supports dual displays: DDI + LVDS/eDP
• Dual Channel LPDDR4-2400MHz Memory Down up to 8GB
• 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap) -
DFI AL9A2 Intel Atom E3900 COM Express Mini
• DFI AL9A2 Intel Atom E3900 COM Express Mini
• Intel Atom® E3900 Processor Series
• Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0
• Multiple expansions: 4 PCIe x1
• 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP) Supports dual displays: DDI + LVDS/eDP
• Dual Channel DDR3L 1600MHz Memory Down up to 8GB
• 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap) -
DFI AL9A3 Intel Atom E3900 COM Express Mini
• DFI AL9A3 Intel Atom E3900 COM Express Mini
• Intel Atom® E3900 Processor Series
• Multiple expansions: 4 PCIe x1
• Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0
• 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP) Supports dual displays: DDI + LVDS/eDP
• Dual Channel DDR3L 1600MHz Memory Down up to 8GB
• 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap) -
DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC
• DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC
• AMD® Ryzen™ V1000/R1000 Series
• 1 DDR4 2400MHz SODIMM up to 16GB
• Multiple displays: max. 4 DP++/3 DP++ + LVDS
• Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
• Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0
• 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap) -
DFI ALF51 1.8″ Board with Intel Atom X5 or Celeron CPU
• DFI ALF51 1.8″ Board with Intel Atom X5 or Celeron CPU
• Intel Atom® Processor E3900 Series
• 2GB/4GB LPDDR4 Memory Down
• 1 Mini DP++
• Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0
• 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap) -
DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC
• DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC
• 8th/9th Generation Intel® Core™ Processors
• 4 x 802.3af POE Ports
• AI Accelerated: Up to 110W GPU MXM Module Supported
• Multiple Expansion Slots for 3G/LTE/5G Cellular Support
• Extended Operating Temperature: -25°C to 70°C
• Support 5G Communication
• 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap) -
DFI ALF51-ET Intel Atom X5 / Celeron 1.8″ SBC – Extended Temp
• DFI ALF51-ET Intel Atom X5 / Celeron 1.8″ SBC – Extended Temp
• Intel Atom® Processor E3900 Series
• 2GB/4GB LPDDR4 Memory Down
• 1 Mini DP++
• Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0
• 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap) -
DFI ALF51-WT Intel Atom X5 / Celeron 1.8″ SBC – Wide Temp
• DFI ALF51-WT Intel Atom X5 / Celeron 1.8″ SBC – Wide Temp
• Intel Atom® Processor E3900 Series
• 2GB/4GB LPDDR4 Memory Down
• 1 Mini DP++
• Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0
• 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap) -
DFI KU968 Kaby Lake 7th Gen Intel iCore COM Express Compact
• DFI KU968 Kaby Lake 7th Gen Intel iCore COM Express Compact
• 7th Gen Intel® Core™
• Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
• Multiple expansion: 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
• Three independent displays: VGA*/DDI + LVDS*/eDP + DDI
• Dual channel DDR4 2133MHz memory down up to 16GB
• 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap) -
DFI COM101-BAT Mini-ITX – COMe Basic/Compact Carrier Board
• DFI COM101-BAT Mini-ITX – COMe Basic/Compact Carrier Board
• COM Express® R2.1, Pin-out Type 6
• Supports Compact/Basic modules
• Multiple displays: 1 DP, 1 LVDS, 1 VGA
• Rich I/O: 1 GbE, 6 USB
• Mini-ITX form factor -
DFI COM332-B(R.A) Micro-ATX – COMe Basic/Compact Carrier Board
• DFI COM332-B(R.A) Micro-ATX – COMe Basic/Compact Carrier Board
• COM Express® R2.1, Pin-out Type 6
• Supports Compact and Basic modules
• Multiple displays: VGA, LVDS, DP, eDP
• Rich I/O: 1 GbE, 4 USB 3.0, 4 USB 2.0
• microATX form factor -
DFI COM332-B(R.B1) Micro-ATX – COMe Basic/Compact Carrier Board
• DFI COM332-B(R.B1) Micro-ATX – COMe Basic/Compact Carrier Board
• COM Express® R2.1, Pin-out Type 6
• Supports Compact and Basic modules
• Multiple displays: VGA, LVDS, DP, eDP
• Rich I/O: 1 GbE, 4 USB 3.1, 4 USB 2.0
• microATX form factor -
DFI COM333-I Micro-ATX – COMe Basic/Compact Carrier Board
• DFI COM333-I Micro-ATX – COMe Basic/Compact Carrier Board
• COM Express® R3.0, Pin-out Type 7
• Supports Compact and Basic modules
• Multiple expansion: 8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0
• Rich I/O: 2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM
• microATX form factor -
DFI RC-300-CS AI-Enabled 5G MXM Railway System
• DFI RC-300-CS AI-Enabled 5G MXM Railway System
• 8th/9th Generation Intel® Core™ Processors
• 4 x M12 X-coded PoE Ports at 15W
• AI Accelerated: Up to 110W GPU MXM Module Supported
• Multiple Expansion Slots for 3G/LTE/5G Cellular Support
• Extended Operating Temperature: -25°C to 70°C Operation without Active Fan
• Support 5G Communication
• 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap) -
DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC
• DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC
• 9th/8th Gen Intel® Core™ with Intel® C246
• 1 DDR4 SODIMM up to 32GB
• Three independent displays: LVDS + DP++ + DP++
• DP++ resolution up to 4096×2304 @ 60Hz
• Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
• Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0
• 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap) -
DFI VC230-AL Intel Atom E3900 Series In-Vehicle PC
• DFI VC230-AL Intel Atom E3900 Series Anti-vibration In-Vehicle PC
• Anti-vibration and fanless In-Vehicle computer
• Supports ignition delay on/off function
• 1 mSATA, eMMC (optional)
• GPS Onboard, 3 SIM Slots Onboard
• Supports Wi-Fi, 3G, and GPRS application
• 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap) -
DFI F8700 NXP i.MX8X Qseven
• DFI F8700 NXP i.MX8X Qseven
• 4GB LPDDR4 Memory Down
• Supports dual displays: 1 HDMI, 1 LVDS
• Multiple expansions: 1 PCIe x1, 1 SDIO x4 bit
• Rich I/O: 1 GbE, 3 USB 3.0, 1 USB 2.0 OTG
• 15-Year CPU Life Cycle Support Until Q1′ 29 (Based on NXP Roadmap) -
DFI EC300-CS AI-Enabled 5G MXM PoE High Performance System
- Product Name: DFI EC300-CS
- System Type: AI-Enabled 5G MXM PoE High Performance System
- CPU: 8th/9th Generation Intel® Core™ Processors
- RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
- Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
- Other features: 4 x RJ45 type PoE ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
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DFI Q7A-551 Qseven Carrier Board
• DFI Q7A-551 Qseven Carrier Board
• Qseven R1.2
• Supports Qseven modules
• Multiple displays: 1 LVDS, 1 HDMI
• Rich I/O: 1 GbE, 2 USB 2.0, 3 COM
• 190 x 102mm (7.48″ x 4.02″) -
DFI Q7X-151(R.A) Mini-ITX – Qseven Carrier Board
• DFI Q7X-151(R.A) Mini-ITX – Qseven Carrier Board
• Qseven R2.0
• Supports Qseven modules
• Multiple displays: 1 DP, 1 LVDS
• Rich I/O: 1 GbE, 1 USB 3.0, 6 USB 2.0, 2 COM
• Mini-ITX form factor -
DFI Q7X-151(R.D1) Mini-ITX – Qseven Carrier Board
• DFI Q7X-151(R.D1) Mini-ITX – Qseven Carrier Board
• Qseven R2.1
• Supports Qseven modules
• Multiple displays: 2 DP, 1 LVDS, 1 eDP
• Rich I/O: 1 GbE, 3 USB 3.0, 8 USB 2.0, 2 COM
• Mini-ITX form factor -
DFI SDML-WL 8th Gen Intel iCore Smart Display Module
• DFI SDML-WL 8th Gen Intel iCore Smart Display Module
• 2 DDR4 2400MHz SODIMM up to 32G
• Multiple expansion: 1 M.2 E Key, 1 M.2 M Key, 1 M.2 B Key
• 1 HDMI resolution up to 4096 x 2160 @ 60Hz Display port resolution up to 4096 x 2304 @ 60Hz
• Rich I/O: 1 Intel GbE, 4 USB3.1, 1 USB3.1 Type C
• 15-Year CPU Life Cycle Support Until Q3′ 34 (Based on Intel IOTG Roadmap) -
DFI WL551 Intel 8th Gen Whiskey Lake iCore 3.5″ SBC
• DFI WL551 Intel 8th Gen Whiskey Lake iCore 3.5″ SBC
• 8th Gen Intel® Core™ Processor 3.5″ SBC
• Dual independent displays: DP + HDMI, 1 LVDS or eDP (opt.)
• 4K High Resolution: Supports 4K/2K resolution
• Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
• Rich I/O 1: 3 Intel GbE, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap) -
DFI WL968 Whiskey Lake 8th Gen Intel iCore COM Express Compact
• DFI WL968 Whiskey Lake 8th Gen Intel iCore COM Express Compact
• 8th Generation Intel® Core™ Processor COM Express® Compact
• DDR4 2400/2133MHz SODIMM up to 64GB
• VGA/DDI + LVDS/eDP + DDI
• DP++ supports 4K x 2K resolution
• Multiple expansion: 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
• Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap) -
DFI AL053 Intel Atom Processor E3900 Pico-ITX
• DFI AL053 – Fanless, Intel Atom X5-E3930 / X5-E3940 / 7-E3950 / N3350, 0 to 60°C Pico-ITX Motherboard
• Intel Atom® Processor E3900
• 1 DDR3L SODIMM up to 8GB
• Two independent displays: LVDS + Mini DP++
• Expansion and Storage: 1 Mini PCIe, 1 M.2, 1 SMBus
• Rich I/O: 1 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 2 USB 2.0
• 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap) -
DFI TGU968 Tiger Lake 11th Gen Intel iCore COM Express Compact
• DFI TGU968 Tiger Lake 11th Gen Intel iCore COM Express Compact
• 11th Generation Intel® Processor COM Express® Compact
• DDR4 3200MHz SODIMM up to 64GB
• VGA/DDI + LVDS/eDP + DDI
• DP++ supports 4K x 2K resolution
• Multiple expansion: 8 PCIe x1, 1 I2C, 1 SMBus
• Rich I/O: 1 Intel 2.5GbE, 4 USB 3.1, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap) -
DFI WL9A3 Whiskey Lake 8th Gen Intel iCore COM Express Mini
• DFI WL9A3 Whiskey Lake 8th Gen Intel iCore COM Express Mini
• Intel® Core™ 8th Gen Processor
• Dual Channel LPDDR3 2133MHz；Memory Down up to 16GB
• 1 LVDS/eDP, 1 DDI (HDMI/DP)；Supports dual displays: DDI + LVDS/eDP
• Multiple expansions: 4 PCIe x1
• Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap) -
DFI EC700-AL Fanless Wide Temp Embedded Ultra Compact PC
• DFI EC700-AL Fanless Wide Temp Embedded Ultra Compact PC
• DDR3L-1866 memory onboard + 1 SODIMM up to 8GB
• Displays: 1 DP/HDMI combo + 1 DP/VGA
• Supports 2 Mini PCIe and 1 M.2 slots
• Rich I/O ports: up to 4 Intel GbE, 4 COM, 4 USB
• Extended operating temperature: -40 to 70°C
• 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap) -
DFI TGU9A2 Tiger Lake 11th Gen Intel COM Express Mini
• DFI TGU9A2 Tiger Lake 11th Gen Intel COM Express Mini
• 11th Generation Intel® Processor COM Express® Mini
• Dual Channel LPDDR4X 4266MHz
• 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP++) , Dual Display：DDI + LVDS/eDP
• DP++ supports 4K x 2K resolution
• Multiple expansion: 1 PCIe x4, 2 I2C, 1 SMBus
• Rich I/O: 1 Intel GbE, 2 USB 3.2, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap) -
DFI WL051 8th Gen Intel CoreTM Processor 2.5″ Pico-ITX
• DFI WL051 – 8th Gen Intel Core i7-8665UE / i5-8365UE / i3-8145UE / Celeron 4305UE, Fanless, 0 to 60°C Pico-ITX Motherboard
• 8th Gen Intel® CoreTM Processor 2.5″ Pico-ITX
• 8th Gen Intel® CoreTM Processor 2.5″ Pico-ITX
• Triple independent displays: DP++ + HDMI + eDP
• Expansion and Storage: 1 M.2 E key, 2 M.2 B key
• Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 2, 2 USB 2.0 -
DFI WL053 8th Gen Intel CoreTM Processor 2.5″ Pico-ITX
- Product Name: DFI WL053
- Motherboard Form Factor: 2.5″ Pico-ITX
- CPU: 8th Gen Intel Core Processor
- RAM: 1 DDR4 SODIMM slot, up to 32GB
- Expansion: 1 M.2 E key, 2 M.2 B key
- Other features: Small form factor suitable for space-limited applications, Dual independent displays: DP++ + HDMI, Rich I/O including 1 Intel GbE, 1 COM, 2 USB 3.1 Gen 2, 2 USB 2.0, 15-Year CPU Life Cycle Support Until Q2’35 (Based on Intel IOTG Roadmap)
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DFI AL051 Intel Atom / Pentium / Celeron Processor E3900 Pico-ITX
• DFI AL051 – Fanless, Intel Atom X5-E3930 / X5-E3940 / 7-E3950 / N3350, -40 to 85°C Pico-ITX Motherboard
• Intel® Atom™/Pentium®/Celeron® Processor E3900
• 1 DDR3L SODIMM up to 8GB
• Triple independent displays: VGA + Mini DP++ + LVDS
• Expansion and Storage: 1 Mini PCIe, 1 M.2, 1 SMBus
• Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 2 USB 2.0
• 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap) -
DFI AL05P Intel Celeron / Atom Processor Pico-ITX + PoE
• DFI AL05P – Fanless, Intel Atom X5-E3930 / X5-E3940 / N3350 / X5-E3930, 0 to 60°C Pico-ITX Motherboard
• Intel® Pentium®/Celeron®/Atom® Processor E3900
• Support LPDDR4 memory down up to 4GB
• Rich I/O: 1 LAN, 1 COM, 2 USB 3.0, 2 USB 2.0
• Expansion and Storage: 1 Mini PCIe, 1 SMBus, 1 eMMC
• PoE single board solution support PoE PD 48VDC
• 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap) -
DFI GM341-GHF V1000/R1000 Gaming Embedded System
• DFI GM341-GHF – Gaming Embedded System R1000
• AMD Ryzen Embedded V1000/R1000 processors
• High performance Radeon VEGA series graphics
• 4 DP++ 4K monitor support (V1000)
• Comprehensive gaming features
• 5 COM, 6 USB, 2 LAN and M.2 support
• 12V DC single input
• 10-Year CPU Life Cycle Support -
DFI EC70A Fanless Embedded BOX PC Gen i3 / i5 / i7
• DFI EC70A-SU4041-668 – Embedded BOX PC Core – 6th Generation Intel Core Fanless Embedded System
• 6th Generation Intel Core Fanless Embedded System
• 4GB/8GB DDR4 memory onboard
• 1x 2.5″ SATA 3.0 drive bay
• Supports 2 Mini PCIe for wireless application
• Rich I/O ports: 2 Intel GbE, 4 COM, 4 USB 3.0
• 15-Year CPU Life Cycle Support -
DFI VC230-BT E3845 Fanless In-Vehicle PC System
• DFI VC230-BT3051-454 – VC230-BT Fanless In-Vehicle System
• Anti-vibration and fanless In-Vehicle computer
• Supports ignition delay on/off function
• 1 mSATA, eMMC (optional), microSD (optional)
• Supports Wi-Fi, 3G, and GPRS application
• 15-Year CPU Life Cycle Support -
DFI VC70B-KU Fanless 7th Gen i3 / i5 / i7 In-Vehicle PC
• DFI VC70B-KU – Fanless In-Vehicle System
• Compact and Fanless In-Vehicle System
• 4GB/8GB DDR4 memory onboard
• 1x 2.5″ SATA 3.0 Drive Bay
• Supports 2 Mini PCIe for Extension Modules
• Rich I/O ports: 2 Intel GbE, 6 COM, 4 USB 3.0, 2 USB 2.0
• 15-Year CPU Life Cycle Support