Industrial and Embedded Products

Showing 97–140 of 140 results

  • AL051F070706RAw420

    DFI AL051 Intel Atom / Pentium / Celeron Processor E3900 Pico-ITX

    • DFI AL051 – Fanless, Intel Atom X5-E3930 / X5-E3940 / 7-E3950 / N3350, -40 to 85°C Pico-ITX Motherboard
    • Intel® Atom™/Pentium®/Celeron® Processor E3900
    • 1 DDR3L SODIMM up to 8GB
    • Triple independent displays: VGA + Mini DP++ + LVDS
    • Expansion and Storage: 1 Mini PCIe, 1 M.2, 1 SMBus
    • Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 2 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)

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  • ALO5PF071009w600

    DFI AL05P Intel Celeron / Atom Processor Pico-ITX + PoE

    • DFI AL05P  – Fanless, Intel Atom X5-E3930 / X5-E3940 / N3350 / X5-E3930, 0 to 60°C Pico-ITX Motherboard
    • Intel® Pentium®/Celeron®/Atom® Processor E3900
    • Support LPDDR4 memory down up to 4GB
    • Rich I/O: 1 LAN, 1 COM, 2 USB 3.0, 2 USB 2.0
    • Expansion and Storage: 1 Mini PCIe, 1 SMBus, 1 eMMC
    • PoE single board solution support PoE PD 48VDC
    • 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)

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  • GM341 GHF

    DFI GM341-GHF V1000/R1000 Gaming Embedded System

    • DFI GM341-GHF – Gaming Embedded System R1000
    • AMD Ryzen Embedded V1000/R1000 processors
    • High performance Radeon VEGA series graphics
    • 4 DP++ 4K monitor support (V1000)
    • Comprehensive gaming features
    • 5 COM, 6 USB, 2 LAN and M.2 support
    • 12V DC single input
    • 10-Year CPU Life Cycle Support

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  • EC70A SU

    DFI EC70A Fanless Embedded BOX PC Gen i3 / i5 / i7

    • DFI EC70A-SU4041-668 – Embedded BOX PC Core – 6th Generation Intel Core Fanless Embedded System
    • 6th Generation Intel Core Fanless Embedded System
    • 4GB/8GB DDR4 memory onboard
    • 1x 2.5″ SATA 3.0 drive bay
    • Supports 2 Mini PCIe for wireless application
    • Rich I/O ports: 2 Intel GbE, 4 COM, 4 USB 3.0
    • 15-Year CPU Life Cycle Support

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  • EC700 BTV

    DFI VC230-BT E3845 Fanless In-Vehicle PC System

    • DFI VC230-BT3051-454 – VC230-BT Fanless In-Vehicle System
    • Anti-vibration and fanless In-Vehicle computer
    • Supports ignition delay on/off function
    • 1 mSATA, eMMC (optional), microSD (optional)
    • Supports Wi-Fi, 3G, and GPRS application
    • 15-Year CPU Life Cycle Support

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  • VC70B KU

    DFI VC70B-KU Fanless 7th Gen i3 / i5 / i7 In-Vehicle PC

    • DFI VC70B-KU – Fanless In-Vehicle System
    • Compact and Fanless In-Vehicle System
    • 4GB/8GB DDR4 memory onboard
    • 1x 2.5″ SATA 3.0 Drive Bay
    • Supports 2 Mini PCIe for Extension Modules
    • Rich I/O ports: 2 Intel GbE, 6 COM, 4 USB 3.0, 2 USB 2.0
    • 15-Year CPU Life Cycle Support

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  • GH960 w600

    DFI GH960-R1505G Ryzen Embedded Com Express Basic Module

    • DFI Ryzen Embedded Com Express Module – GH960-R1505G
    • Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default);Supports up to four independent displays
    • DP++ resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x8, 7 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap)

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  • GH960 w600

    DFI GH960-R1606G Ryzen Embedded Com Express Basic Module

    • DFI Ryzen Embedded Com Express Module – GH960-R1606G
    • Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default);Supports up to four independent displays
    • DP++ resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x8, 7 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap)

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  • GH960 w600

    DFI GH960-V1202 Ryzen Embedded Com Express Basic Module

    • DFI Ryzen Embedded Com Express Module – GH960-V1202
    • Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default);Supports up to four independent displays
    • DP++ resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x8, 7 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap)

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  • GH960 w600

    DFI GH960-V1605 Ryzen Embedded Com Express Basic Module

    • DFI Ryzen Embedded Com Express Module – GH960-V1605
    • Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default);Supports up to four independent displays
    • DP++ resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x8, 7 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap)

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  • GH960 w600

    DFI GH960-V1756 Ryzen Embedded Com Express Basic Module

    • DFI Ryzen Embedded Com Express Module – GH960-V1756
    • Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default);Supports up to four independent displays
    • DP++ resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x8, 7 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap)

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  • GH960 w600

    DFI GH960-V1807B Ryzen Embedded Com Express Basic Module

    • DFI Ryzen Embedded Com Express Module – GH960-V1807
    • Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default);Supports up to four independent displays
    • DP++ resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x8, 7 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap)

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  • VP101 BT

    DFI VP101-BT 10.1″ Atom E3825 In-vehicle Touch Panel PC

    • DFI VP101-BT-252I – 10.1″ In-vehicle Touch Panel PC
    • 10.1″ 1280×800 TFT LCD Panel with Touch Screen
    • Supports Ignition Control and Delay On/Off Function
    • IP65 Front Panel Protection
    • VESA/Panel Mount
    • Rich I/O: 2 LAN, 5 COM, 1 USB 3.0, 3 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 28 (Based on Intel IOTG Roadmap)

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  • VP101 BT

    DFI VP101-BT 10.1″ Atom E3845 In-vehicle Touch Panel PC

    • DFI VP101-BT-454 – 10.1″ In-vehicle Touch Panel PC
    • 10.1″ 1280×800 TFT LCD Panel with Touch Screen
    • Supports Ignition Control and Delay On/Off Function
    • IP65 Front Panel Protection
    • VESA/Panel Mount
    • Rich I/O: 2 LAN, 5 COM, 1 USB 3.0, 3 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 28 (Based on Intel IOTG Roadmap)

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  • CH960 w600

    DFI HM370 i3-8100H 8th Gen Com Express Basic Module

    • DFI 8th Gen Com Express Module – HM370 – i3-8100H
    • Dual channel DDR4 2666MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
    • eDP resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)

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  • CH960 w600

    DFI QM370 Xeon E-2176M 8th Gen Com Express Basic Module

    • DFI 8th Gen Com Express Module – QM370 – Xeon E-2176M
    • Dual channel DDR4 2666MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
    • eDP resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)

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  • CH960 w600

    DFI HM370 i5-8400H 8th Gen Com Express Basic Module

    • DFI 8th Gen Com Express Module – HM370 – i5-8400H
    • Dual channel DDR4 2666MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
    • eDP resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)

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  • CH960 w600

    DFI QM370 i3-8100H 8th Gen Com Express Basic Module

    • DFI 8th Gen Com Express Module – QM370 – i3-8100H
    • Dual channel DDR4 2666MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
    • eDP resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)

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  • EC500 SD 1

    DFI EC500-KH-QM175 iCore Rugged Fanless Embedded System

    • DFI EC500-KH-QM175 iCore Rugged Fanless Embedded System
    • Supports DDR4 SODIMM up to 32GB
    • Three independent displays: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
    • Rugged and Fanless Embedded System
    • Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.0, 2 USB 2.0, 1CFast
    • Supports 2 Mini PCIe and 1 M.2 NVMe slots
    • Operating Temperature: -20 to 60°C, -40 to 70°C (optional)
    • 15-Year CPU Life Cycle Support Until Q4′ 29 (Based on Intel IOTG Roadmap)

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  • CH960 w600

    DFI QM370 i5-8400H 8th Gen Com Express Basic Module

    • DFI 8th Gen Com Express Module – QM370 – i5-8400H
    • Dual channel DDR4 2666MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
    • eDP resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)

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  • EC510 511

    DFI EC511 4xPoE PCIe Rugged Fanless Embedded System

    • DFI EC511 4xPoE PCIe Rugged Fanless Embedded System
    • 6th/7th Generation Intel® Core™ with Intel® Q170
    • Supports DDR4 SODIMM up to 32GB
    • Three independent displays: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
    • Supports 4 PoE GLAN ports and one expansion slot
    • 2 Mini PCIe slots support mSATA and Wi-Fi modules
    • 15-Year CPU Life Cycle Support Until Q4′ 29 (Based on Intel IOTG Roadmap)

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  • CH960 w600

    DFI QM370 i7-8850H 8th Gen Com Express Basic Module

    • DFI 8th Gen Com Express Module – QM370 – i7-8850H
    • Dual channel DDR4 2666MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
    • eDP resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)

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  • EC510 511

    DFI EC510 4xPoE PCI Rugged Fanless Embedded System

    • DFI EC510 4xPoE PCI Rugged Fanless Embedded System
    • 6th/7th Generation Intel® Core™ with Intel® Q170
    • Supports DDR4 SODIMM up to 32GB
    • Three independent displays: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
    • Supports 4 PoE GLAN ports and one expansion slot
    • 2 Mini PCIe slots support mSATA and Wi-Fi modules
    • 15-Year CPU Life Cycle Support Until Q4′ 29 (Based on Intel IOTG Roadmap)

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  • CH960 w600

    DFI QM370 i7-8850H 8th Gen Com Express Basic Module – Wide Temp

    • DFI 8th Gen Com Express Module Wide Temp – QM370 – i7-8850H
    • Dual channel DDR4 2666MHz SODIMM up to 32GB
    • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
    • eDP resolution supports up to 4096×2304 @ 60Hz
    • Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    • 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)

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  • EC510 511

    DFI EC511 6xGbE PCIe Rugged Fanless Embedded System

    • DFI EC511 6xGbE PCIe Rugged Fanless Embedded System
    • 6th/7th Generation Intel® Core™ with Intel® Q170
    • Supports DDR4 SODIMM up to 32GB
    • Three independent displays: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
    • Supports 4 PoE GLAN ports and one expansion slot
    • 2 Mini PCIe slots support mSATA and Wi-Fi modules
    • 15-Year CPU Life Cycle Support Until Q4′ 29 (Based on Intel IOTG Roadmap)

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  • DFI EC531 532 KH 1

    DFI EC531-KH-CM238 Xeon Rugged Fanless Embedded System

    • DFI EC531-KH-CM238 Xeon Rugged Fanless Embedded System
    • Supports DDR4 SODIMM up to 32GB
    • Three independent displays: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
    • Rugged and Fanless Embedded System
    • Rich I/O connectivity: 2 GbE, 8 COM, 8 USB 3.0, 2 USB 2.0, 1 M.2 NVMe slots
    • 3 expension slots: PCIe + PCI
    • 15-Year CPU Life Cycle Support Until Q4′ 29 (Based on Intel IOTG Roadmap)

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  • EC70B SU

    DFI EC70B Fanless Embedded BOX PC 6th Gen i3 / i5 / i7

    • DFI EC70B-SU6864E-668 – Embedded BOX PC – 6th Generation Intel Core Fanless Embedded System
    • 6th Generation Intel Core Fanless Embedded System
    • 4GB/8GB DDR4 memory onboard
    • 1x 2.5″ SATA 3.0 drive bay
    • Supports 2 Mini PCIe for wireless application
    • Rich I/O ports: 2 Intel GbE, 4 COM, 4 USB 3.0
    • 15-Year CPU Life Cycle Support

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  • EC800 AL

    DFI EC800 Atom E3930 Embedded BOX PC

    • DFI EC800-AL552THV-E3930-2 – Embedded BOX PC
    • Intel Atom Processor E3900
    • 2GB/4GB/8GB LPDDR4-2400 memory onboard
    • Triple independent displays: 1 VGA/DVI-D + 2 DP/HDMI
    • Supports 1 Mini PCIe and 2 M.2 slots
    • Rich I/O ports: 2 Intel GbE, 2 COM, 4 USB
    • 15-Year CPU Life Cycle Support

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  • EC510 511

    DFI EC510 6xGbE PCI Rugged Fanless Embedded System

    • DFI EC510 6xGbE PCI Rugged Fanless Embedded System
    • 6th/7th Generation Intel® Core™ with Intel® Q170
    • Supports DDR4 SODIMM up to 32GB
    • Three independent displays: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
    • Supports 4 PoE GLAN ports and one expansion slot
    • 2 Mini PCIe slots support mSATA and Wi-Fi modules
    • 15-Year CPU Life Cycle Support Until Q4′ 29 (Based on Intel IOTG Roadmap)

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  • DFI EC531 532 KH 1

    DFI EC531-KH-QM175 iCore Rugged Fanless Embedded System

    • DFI EC531-KH-QM175 iCore Rugged Fanless Embedded System
    • Supports DDR4 SODIMM up to 32GB
    • Three independent displays: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
    • Rugged and Fanless Embedded System
    • Rich I/O connectivity: 2 GbE, 8 COM, 8 USB 3.0, 2 USB 2.0, 1 M.2 NVMe slots
    • 3 expension slots: PCIe + PCI
    • 15-Year CPU Life Cycle Support Until Q4′ 29 (Based on Intel IOTG Roadmap)

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  • EC532 KD AI 1

    DFI EC532-KD-AI H110 iCore Rich I/O Embedded PC

    • DFI EC532-KD-AI H110 iCore Rich I/O Embedded PC
    • Rich I/O connectivity
    • 15-Year CPU Life Cycle Support Until Q4′ 29 (Based on Intel IOTG Roadmap)
    • 3 expansion slots: PCIe x16 + PCIe x4 (PCIe x1 signal)
    • Front accessible storage slots
    • Two independent displays: 1 VGA + 1 DVI/HDMI
    • Supports DDR4 SODIMM up to 32GB

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  • EC533 KD AI 1

    DFI EC533-KD-AI Q170 iCore PoE Rich I/O Embedded PC

    • DFI EC533-KD-AI Q170 iCore PoE Rich I/O Embedded PC
    • 15-Year CPU Life Cycle Support Until Q4′ 29 (Based on Intel IOTG Roadmap)
    • Supports DDR4 SODIMM up to 32GB
    • Three independent displays: 1 VGA + 1 DVI/HDMI + 1 HDMI/DP
    • 3 expansion slots: PCIe x16 + PCIe x4 (PCIe x1 signal)
    • Rich I/O connectivity
    • Front accessible storage slots

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  • VC653

    DFI VC653-BT Fanless 6th Gen i3 / i5 / i7 In-Vehicle System

    • DFI VC653-SU668 – Fanless In-Vehicle System
    • ULT-based Fanless In-Vehicle System
    • 2 x SATA 3.0 External Drive Bay
    • Rich I/O ports: 1 Intel GbE, 4 COM, 1 USB 3.0, 3 USB 2.0
    • Supports 3 Mini PCIe, 1 M.2, 2 SIM
    • Extended operating temperature: -30 to 70°C
    • 15-Year CPU Life Cycle Support

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  • EC700 BTV

    DFI VC230-BT E3825 Fanless In-Vehicle System

    • DFI – VC230-BT3051-252 – VC230-BT Fanless In-Vehicle System
    • Anti-vibration and fanless In-Vehicle computer
    • Supports ignition delay on/off function
    • 1 mSATA, eMMC (optional), microSD (optional)
    • Supports Wi-Fi, 3G, and GPRS application
    • 15-Year CPU Life Cycle Support

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  • GM330 BFF 1

    DFI GM330 AMD Ryzen G-Series GX-217GI Embedded Gaming System

    • DFI GM330-BFF-217GI AMD G-Series Dual Core 1.7GHz GX-217GI Embedded Gaming System
    • AMD® Embedded G-Series Processor
    • Comprehensive gaming features
    • 2 DP++, 5 COM, 7 USB, 2 LAN and M.2 support
    • 12V DC single input
    • Stereo audio amp output

    Compare
  • GM330 BFF 1

    DFI GM330 AMD Ryzen G-Series GX-220IJ Embedded Gaming System

    • DFI GM330-BFF-220IJ AMD G-Series Dual Core 2.0GHz GX-220IJ Embedded Gaming System
    • AMD® Embedded G-Series Processor
    • Comprehensive gaming features
    • 2 DP++, 5 COM, 7 USB, 2 LAN and M.2 support
    • 12V DC single input
    • Stereo audio amp output

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  • GM330 BFF 1

    DFI GM330 AMD Ryzen G-Series GX-224IJ Embedded Gaming System

    • DFI GM330-BFF-224IJ AMD G-Series Dual Core 2.4GHz GX-224IJ Embedded Gaming System
    • AMD® Embedded G-Series Processor
    • Comprehensive gaming features
    • 2 DP++, 5 COM, 7 USB, 2 LAN and M.2 support
    • 12V DC single input
    • Stereo audio amp output

    Compare
  • VC653

    DFI VC653-BT454 Fanless In-Vehicle System E3845

    • DFI VC653-BT454 – Fanless In-Vehicle System
    • Atom-based Fanless In-Vehicle System
    • 2 x SATA 2.0 External Drive Bay
    • Rich I/O ports: 4 COM, 1 USB 3.0, 3 USB 2.0
    • Supports 3 Mini PCIe, 1 M.2, 2 SIM
    • Extended operating temperature: -30 to 70°C
    • 15-Year CPU Life Cycle Support

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  • COM331 B

    DFI COM331-B COM Express – Micro-ATX Carrier Board

    • DFI – COM331-B – COM Express – Micro-ATX Carrier Board
    • COM Express® R2.0, Pin-out Type 6
    • Supports Compact/Basic modules
    • Multiple displays: 1 LVDS, 1 VGA, 2 DP
    • Rich I/O: 1 GbE, 4 USB 3.0, 4 USB 2.0, 4 COM
    • microATX form factor

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  • BT9A3

    DFI COM Express Mini – Intel Atom E3800 Series CPU Module – BT9A3

    • DFI – BT9A3 – COM Express Mini – Intel Atom E3800 Series CPU Module
    • Intel Atom® E3800 Processor Series
    • Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0
    • Multiple expansions: 3 PCIe x1, 2 SATA 2.0
    • 1 LVDS, 1 DDI (HDMI/DVI/DP)
    • Single Channel DDR3L 1333MHz ECC Memory Down up to 4GB
    • 15-Year CPU Life Cycle Support Until Q4′ 28 (Based on Intel IOTG Roadmap)

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  • CR908 B

    DFI CR908-B COM Express Compact – iCore QM77 CPU Module

    • DFI – CR908-B – COM Express Compact – Intel Core QM77 CPU Module
    • 3rd/2nd Gen Intel® Core™, Intel® QM77 Chipset
    • Rich I/O: 1 Intel GbE, 4 USB 3.0, 4 USB 2.0
    • Multiple expansion: 1 PCIe x16, 4 SATA, 1 LPC, 1 I2C, 1 SMBus
    • 1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
    • Dual channel DDR3L 1600MHz SODIMM up to 8GB
    • 7-Year CPU Life Cycle Support Until Q3′ 18 (Based on Intel IOTG Roadmap)

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  • COM100 B

    DFI COM100-B COM Express Mini – Mini-ITX Carrier Board

    • DFI – COM100-B – COM Express Mini – Mini-ITX Carrier Board
    • Mini-ITX form factor
    • Multiple displays: 1 DP, 1 LVDS
    • Supports Mini modules
    • COM Express® R2.1, Pin-out Type 10
    • Rich I/O: 1 GbE, 6 USB, 2 COM

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  • BT700

    DFI BT700 Qseven – Intel Atom E3800 Series CPU Module

    • DFI – BT700 – Qseven – Intel Atom E3800 Series CPU Module
    • Intel Atom® E3800 Series
    • Rich I/O: 1 Intel GbE, 1 USB 3.0, 6 USB 2.0
    • Multiple expansions: 3 PCIe x1
    • 1 DDI (DP/HDMI/DVI), 1 LVDS
    • 2GB/4GB DDR3L Single Channel Memory Down
    • 15-Year CPU Life Cycle Support Until Q4′ 28 (Based on Intel IOTG Roadmap)

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  • Q7X 151 1

    DFI Q7X-151 Qseven – Mini-ITX Carrier Board

    • DFI – Q7X-151 – Qseven – Mini-ITX Carrier Board
    • Qseven R2.0
    • Supports Qseven modules
    • Multiple displays: 1 DP, 1 LVDS
    • Rich I/O: 1 GbE, 1 USB 3.0, 6 USB 2.0, 2 COM
    • Mini-ITX form factor

    Compare