The DPRC-230-ULT5 is an ultimate fanless box PC with high-performance Intel® Whiskey Lake Core™ CPU. It’s IEI’s first DIN-rail box PC with modular design.
ASRock Industrial has developed the powerful iEPF-9000S and iEP-9000E Series which are ruggedized, Edge AIoT industrial computing platforms.
The RC300-CS has a powerful performance, a rich mixture of I/O interfaces, GPU expandability brought about by MXM, a wide voltage input and cellular 5G networking.
At BVM we take the time to work with you to truly understand the requirement and limitations. Whether you are at the initial idea stage or have a partly designed concept, our design process can take your project idea from concept to manufacture, on budget, and in the minimum time.
15”, 15.6”, 17”, 18.5” Panel PCs with Intel Whiskey Lake Core i5-8365U and Intel Celeron 4305UE CPU. Low power consumption, fanless design and IP66-rated front panel for water and dust resistance.
DFI extends its own Pi-size industrial single-board computers, ALF51 and GHF51, to the first PoE (Power over Ethernet) compact single-board solution, AL05P, to challenge the deployment of existing computing devices inside and outside factories and buildings.
A Mobile PCI Express Module (MXM) is an interconnect standard for GPUs in laptops and embedded computers using PCI Express.
Sometimes known as ‘MDT’s’ (Mobile Data Terminals), in vehicle PC’s need to be robust enough to withstand just about anything that can be thrown at them, inclusive of the extremes of temperature where storage is concerned, frequent & high levels of vibration – and be operational via the electrical supply of the vehicle which are typically ‘dirty’ in its format in regard to voltage spikes and electrical noise.
The main advantage of Power over Ethernet (PoE) is delivery of data AND power over one Cat5e/Cat6 Ethernet cable
DFI’s high-performance system series is based on powerful platforms with advanced graphics and computing performance and extensive I/O.