The AAEONBOXER-8653AI is a rugged embedded AI system powered by the NVIDIA Jetson Orin NX, featuring multiple M.2 expansion slots, 4 PoE-enabled Gigabit Ethernet ports, and comprehensive I/O options including COM, CANBus, and digital I/O. It’s designed for reliable operation in industrial environments with a wide temperature range of -15°C to 60°C.
PoE-Enabled for Efficient Deployment: Both BOXER-8653AI and BOXER-8623AI feature four PoE LAN ports, allowing easy connection to IP cameras and sensors without separate power wiring—ideal for smart city and retrofit applications with reduced installation and operating costs.
Rugged, Compact, and Edge-Ready: With a compact 180mm x 136mm x 75mm design, wide temperature tolerance (-15°C to 60/65°C), and NVMe storage support, both systems are built for reliable AI performance in industrial and outdoor environments.
Versatile Connectivity for Industrial AI: Equipped with RS-232/422/485, CANBus, digital I/O, and support for 5G/Wi-Fi expansion, these systems enable robust communication with machinery and servers—maximizing the capabilities of the NVIDIA Jetson Orin NX and Nano platforms.
Key Features
NVIDIA Jetson Orin NX
GbE PoE/PSE 802.3af/at x 4 + GbE LAN x 1
M.2 2230 E-Key x 1, M.2 2280 M-Key x 1, M.2 3042/3052 B-Key x 1
COM/CANBus/DIO
Operating Temperature: -15°C ~ 60°C
Specification
Category
Specification
System
AI Accelerator: NVIDIA® Jetson Orin™ NX
CPU: 6-core or 8-core Arm® Cortex®-A78AE ARMv8.2 64-bit
System Memory: 8GB or 16GB LPDDR5
Storage Device: M.2 2280 M-Key x1
Display Interface: HDMI 2.0 (Type-A) x1
Ethernet: 1x GbE LAN RJ-45, 4x GbE PoE/PSE (802.3af/at, Max 60W) RJ-45
I/O: USB 3.2 Gen 2 (Type-A) x4, DB-9 for RS-232/RS485/CANBus, DB-15 for RS-232/422/485 and DIO x8, Micro USB for OS flash, Power & Recovery Buttons, Antenna x6
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.
Here’s a selection of our design, manufacturing & associated services: –
ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
Testing
Materials Management
Logistics and Tracking
External Manufacturing
• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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