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COM Express Mini

Dimensions: 84mm x 55mm

The COM Express Mini modules includes entry-level processors and Intel Atom technology. They support memory and onboard storage for rugged industrial applications.

• Advantech Computer On Modules: COM Express Mini

  • SOM 7583 1

    Advantech SOM-7583 Intel 11th Gen Tiger Lake COM Express Mini Type 10

    • Product Name: Advantech SOM-7583
    • Module Form Factor: COM Express Mini Module Type 10
    • CPU: Intel Tiger Lake UP3 processors
    • RAM: 16GB LPDDR4X 4266MT/s, IBECC support
    • Expansion: USB4 compliance supported by carrier board design, NVMe SSD
    • Other Features: Operating temperatures: Standard 0 ~ 60 °C (32 ~ 140 °F) or Extended -40 ~ 85 °C (-40 ~ 185 °F), Supports SUSI, DeviceOn, and Edge AI Suite
  • SOM 7532 1

    Advantech SOM-7532 Intel x6000 Series Elkhart Lake COM Express Mini Type 10

    • Product Name: Advantech SOM-7532
    • Module Form Factor: COM Express R3.0 Mini Module Type 10
    • CPU: Intel Pentium/Celeron and Atom x6000 Series (Elkhart Lake) Processors
    • RAM: Dual Channel up to 16GB LPDDR4 3200MT/s, IBECC supported by specific SKUs
    • Expansion: Supports onboard eMMC storage (optional) and 2.5GbE
    • Other Features: Supports iManager, WISE-DeviceOn, and Embedded Software APIs
  • SOM 7533 1

    Advantech SOM-7533 Intel Alder Lake-N/Amston Lake COM Express Mini Type 10

    • Product Name: Advantech SOM-7533
    • Module Form Factor: COM Express R3.1 Mini Module Type 10
    • CPU: Intel Core i3, N series and Atom x7000 Series Processors (Alder Lake-N/Amston Lake)
    • RAM: Single-CH LPDDR5 4800MT/s, up to 16GB, supports IBECC
    • Expansion: PCIe Gen3, USB3.2 Gen2, SATA3.0
    • Other Features: 2.5GbE with TSN support, Onboard eMMC (optional), Supports iManager, Embedded Software APIs, and Wise-DeviceOn
  • COM 1001 1

    ASRock Industrial COM-1001 Elkhart Lake COM Express Mini

    • Product Name: ASRock Industrial COM-1001
    • Module Form Factor: COM Express Module
    • CPU: Intel Elkhart Lake SoC Processors
    • RAM: 4 x 4GB IBECC onboard LPDDR4/4x 3200 MHz
    • Expansion: 4 x PCIe x1 (Gen3), 2 x USB 3.2 Gen2, 8 x USB 2.0, 2 x UART, 2 x SATA3
    • Other features: 1 x Intel 2.5 Gigabit LAN, Supports Dual Display, 2 x DDI, 1 x eDP, 1 x DP or HDMI, TPM 2.0 onboard IC (optional), ATX: 12V±5%/5Vsb±5%, AT: 9~20V±5%
  • ADN9A2 1

    DFI ADN9A2 Intel Alder Lake N COM Express Mini

    • Product Name: DFI ADN9A2
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom Processor Alder Lake-N Series
    • RAM: Dual Channel LPDDR5 4800MHz, up to 16GB
    • Expansion: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC
    • Other Features: Supports dual displays (DDI + LVDS/eDP), 2 USB 3.2, 8 USB 2.0, 2.5GbE Ethernet
  • ASL9A2 1

    DFI ASL9A2 Intel Amston Lake COM Express Mini

    • Product Name: DFI ASL9A2
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom Processor Amston Lake Series
    • RAM: Dual Channel LPDDR5 4800MHz, up to 16GB
    • Expansion: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC
    • Other Features: Dual display support (DDI + LVDS/eDP), 2 USB 3.1, 8 USB 2.0, 100M/1000M/2.5Gbps Ethernet
  • EHL9A2 Top w600

    DFI EHL9A2 Intel Elkhart Lake COM Express Mini

    • Product Name: DFI EHL9A2
    • Module Form Factor: COM Express Mini – COM Express Type 10
    • CPU: Intel Atom Processor Elkhart Lake Series
    • RAM: Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP++); Supports dual displays: DDI + LVDS/eDP, Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap).
  • photo front GH9A3 R011 web

    DFI GH9A3 AMD Ryzen R1000 Series COM Express Mini

    • Product Name: DFI GH9A3
    • Module Form Factor: COM Express Mini
    • CPU: AMD Ryzen R1000 Series Processor
    • RAM: Single Channel LPDDR4 2400MHz; Memory Down up to 8GB
    • Expansion: Multiple expansions: 3 PCIe x1
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP); Supports dual displays: DDI + LVDS/eDP; Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)
  • photo front AL9A8 RA

    DFI AL9A8 Intel Atom E3900 COM Express Mini

    • Product Name: DFI AL9A8
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom E3900 Processor Series
    • RAM: Dual Channel LPDDR4-2400MHz Memory Down up to 8GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0; 1 LVDS/eDP, 1 DDI (HDMI/DP++) Supports dual displays: DDI + LVDS/eDP; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
  • AL9A2 Front Website

    DFI AL9A2 Intel Atom E3900 COM Express Mini

    • Product Name: DFI AL9A2
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom E3900 Processor Series
    • RAM: Dual Channel DDR3L 1600MHz Memory Down up to 8GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0; 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP) Supports dual displays: DDI + LVDS/eDP; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
  • WL9A3F190605 w600

    DFI WL9A3 Whiskey Lake 8th Gen Intel iCore COM Express Mini

    • Product Name: DFI WL9A3
    • Module Form Factor: COM Express Mini
    • CPU: Intel Core 8th Gen Processor
    • RAM: Dual Channel LPDDR3 2133MHz; Memory Down up to 16GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP); Supports dual displays: DDI + LVDS/eDP; Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)
  • TGU9A2 Front

    DFI TGU9A2 Tiger Lake 11th Gen Intel COM Express Mini

    • Product Name: DFI TGU9A2
    • Module Form Factor: COM Express Mini
    • CPU: 11th Generation Intel Processor
    • RAM: Dual Channel LPDDR4X 4266MHz
    • Expansion: Multiple expansion: 1 PCIe x4, 2 I2C, 1 SMBus
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP++), Dual Display: DDI + LVDS/eDP; DP++ supports 4K x 2K resolution; Rich I/O: 1 Intel GbE, 2 USB 3.2, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)