Technical applications involved with defence, aerospace, and transportation (to name but a few) generally means challenging conditions and harsh environments where industrial computing solutions are concerned. Harsh environment IPC Solutions must provide reliable operation in the interests of retaining their availability for their designated function.
In support of resistance to humidity and dust – even the complexities that high altitudes can bring, BVM can provide conformal coating services. We additionally have experience in helping customers in implementing product life simulation around temperature, vibration and humidity stress testing to help uncover operational vulnerabilities during the design phase.
Case Study: Aerospace – Portable Electrical Test System
Here at BVM, we work on a wide range of projects, applying a range of expertise. Here we discuss our design and manufacture of a Peli case system, highlighting the challenge and our solution
BVM can provide industrial-grade motherboards in terms of protecting customers’ devices, providing electrostatic discharge (ESD) protection for all I/O ports. In alignment with the IEC 61000-4-2 regulations (IEC Association), specific motherboard solutions available from BVM will not be affected by a random ESD event – ensuring your product remains dependable in uncontrolled circumstances. With products under-going strict ESD testing, including rigorous voltage and frequency testing, I/O ports are able to withstand a transient voltage of 8kV.
Embedded Motherboards and SBCs
Industrial Grade Motherboards provide the backbone for Industrial PC Systems, they are revision controlled and are available for a longer time scale compared to commercial motherboard’s and typically operate over a wider temperature range than their commercial equivalents.
Long Life Industrial and Embedded Mini-ITX Motherboards. A Mini-ITX Motherboard is a solution that offers performance with low power and long-life availability. Mini-ITX is a specification for a motherboard measuring 170 x 170 mm with a conventional I/O shield as used on larger scale motherboards.
Case Study: PCIe Mini-card Carrier Module
Working with a long-term customer, BVM were ask to produce a custom PCB carrier design housing & utlising twelve PCIe mini-cards in combination with a mid-range graphics card
BVM’s portfolio of module solutions provide for the countering of environments containing elements such as moisture, salt, dust and the presence of chemicals. With conformal coating protection applied, high-performance modules can still operate in the most of challenging environments. The coating protects circuits and components from abrasion, electrical short circuits and increases MTBF performance.
Rapid change in temperature can also be a cause of system failure – with the extremities of high and low temperatures being reached. To function properly, systems and components need to be able to operate under a wide variety of those environmental conditions. BVM can offer modules based on the diversity of Intel’s 8th generation core (Whiskey Lake) through to the Atom E3900 series – able to sustain ‘up time’ in the temperature range of -40°C to +85°C. Fanless module solutions are targeted at power-efficient systems that require higher MTBF performance.
And System-On-Module products are the ideal solution for many space-constrained applications where the build-up of heat within the operating environment can become an issue.
COM Express, Qseven, Pico-ITX and SMARC are industry standard formats available from a number of different manufacturers. These are mezzanine formats intended to simplify the implementation of a PC within a larger piece of equipment. COM Express, Qseven and SMARC are industry standard formats available from a number of different manufacturers.
System PCs and All in One Panel PCs
- with industrial-grade components
- mindful of thermal management
- with robust enclosures,
- with extended power input voltage
- with extended operating temperature support.
Before release, our solutions undergo stringent test programs during the product development phase to ensure compliance where system failure isn’t an option. Testing includes shock, vibration, drop testing, humidity, electromagnetic sensitivity, power, thermal shock, burn-in, performance testing, available up time / reliability.
Heavy industrial applications must be able to survive and operate in critical environments inclusive of extreme temperatures, rain, moisture, salt, fog, vibration and the effects of shock. Embedded computers used in these environments must be designed to withstand these type of conditions present.
With fanless designs in both Atom and Core Series supporting extended operating temperatures of -20°C to 70°C, BVM system PC’s systems offer high-performance computing for essential data processing within the field.
Rugged PCs and Embedded Systems
Rugged Industrial Computers and Embedded Systems specifically designed to operate reliably in harsh usage environments and conditions, such as strong vibrations, extreme temperatures and wet or dusty conditions. Available with Intel i3 / i5 / i7 / Celeron and AMD Ryzen Embedded CPU’s.
In addition, our Rugged Panel PC products provide for IP6X-rated enclosures, protecting the system against anything from the occasional random splashing of water, detergents and high pressure jet washing.
Case Study: Ruggedised Vehicle Satellite Navigational Unit
BVM’s design challenge that used a Pico ITX to create a ruggedised vehicle satellite navigational unit