Computer-On-Modules
Computer-On-Modules (COM/SOM) are ideal for applications where product time to market and longevity are critical. Today’s COM modules mainly come in 3 main formats; COM Express Mini, Compact and Basic.
Plugged into carrier boards, they can be upgraded to newer, backwards-compatible versions as processor technology progresses. COM modules are typically used in Industrial, military, aerospace, medical and transportation.
• COMe vs Qseven vs SMARC: A Comparison of Modular Computing Standards
• Why use a COM module? What are the Benefits?
• An Introduction to COM-HPC
• BVM Custom Carrier Board Design Service
• A Comprehensive Guide to COM Modules
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COM Express Compact (17)
Dimensions: 95mm x 95mm COM Express Compact is ideal for mobile applications, the COM Express Compact module features Intel Core i and Intel Atom processors. It combines powerful performance with a compact design. • Advantech Computer On Modules: Explore the Power of Modular Computing -
COM Express Mini (12)
Dimensions: 84mm x 55mm The COM Express Mini modules includes entry-level processors and Intel Atom technology. They support memory and onboard storage for rugged industrial applications. • Advantech Computer On Modules: Explore the Power of Modular Computing -
COM Express Basic (16)
Dimensions: 125mm x 95mm COM Express Basic is equipped with the latest CPUs, providing high-speed interfaces such as HDMI / DisplayPort, PCIe, SATA, and USB 3.0. It also supports legacy applications with LVDS, PCI and IDE interfaces. • Advantech Computer On Modules: Explore the Power of Modular Computing -
COM-HPC (4)
COM-HPC, or Computer-on-Module High-Performance Computing, is a standardized form factor for high-performance computing solutions. Developed by PICMG, it separates the processor module from the carrier board, offering flexibility in system design. The modular approach accommodates diverse computing needs, with different size options and pinouts defined by the standard. COM-HPC modules integrate powerful processors, memory, storage and I/O, making them suitable for applications like edge computing and industrial automation. • An Introduction to COM-HPC: High-Performance Computer-on-Modules • From HPC to AI: How CXL is Transforming Computing Performance -
Qseven Modules (9)
Dimensions: 70mm x 70mm Qseven modules are equipped with fast serial interfaces in an ultra-small form factor. Qseven modules are much smaller than other system-on-modules which make them an ideal solution for space-limited and low power applications. BVM provide Qseven solutions available in low powered Intel Atom, Celeron (15 year CPU life cycle support) and ARM (iMX) processor formats – and on standard and wide temperature (-40°C to +85°C) platforms. -
SMARC Modules (7)
Dimensions: 82mm x 50mm and 82mm x 80mm Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices. • Advantech SMARC Modules: Advanced Computing with ARM and x86 ARChitectures -
Carrier Boards (21)
Carrier boards (baseboards) offer the customisable engineering platforms for COM Express Type and Qseven modules to competently function – providing for your exact choice and physical location of i/o. BVM have a long history of designing & manufacturing custom carrier boards to meet applications needs in industrial automation, audio visual and medical healthcare, aiding our customers product development phases and bringing successive generations of their products to market, faster. • Custom Carrier Board Design Service • COM/SOM Carrier Board Design Service -
Smart Display Modules (1)
Intel Smart Display Modules for next generation commercial AIO displays and visual IoT devices. An Intel SDM provides the primary compute building block and requires an interface board on the displays or host system to complete the platform implementation and provide standard end user physical interface.
