Computer-On-Modules

COM/SOM modules are ideal for applications where product time to market and longevity of solution are critical to your business. Today’s COM modules mainly come in two main formats; COM Express (COMe) in Mini, Compact, Basic and Qseven.

Plugged into carrier boards (baseboard), they can be upgraded to newer, backwards-compatible versions as processor technology capability progresses. COM/SOM modules are typically used in Industrial, military, aerospace, gaming, medical and transportation.

• Why use a Computer-on-module? What are the Benefits?
• COM Express vs Qseven vs SMARC: A Comparison of Modular Embedded Computing Standards
• An Introduction to COM-HPC

COM Express Compact (8)

COM Express Compact modules are designed with computing capability and cost efficiency in a footprint size of 95 x 95 mm and are a good option for transportation and defence applications. Compact modules are mainly available with COM Express pin-out Type 6 – but we also have availability in Type 2 – and are available in low powered Intel Atom, AMD G-Series and the latest Intel i-core generation processor solutions.
COM Express Mini (9)

COM Express Mini modules deliver high performance in a small 55 x 84 mm footprint. They’re ideal for space-limited, power-saving, and mobile applications. Our solutions are available in Type 10 COM Express pin out formats, selectable in Atom E3800 and E3900 processor formats - through to AMD Ryzen and the latest Intel Core Series.
COM Express Basic (20)

COM Express Basic modules provide high-level processing performance and high-speed interfaces for a wide range of demanding computing applications such as medical and industrial automation. Our Basic modules are compatible with COM Express pin-out Type 2, Type 6, and Type 7 – selectable in wide range of Intel Core Series and AMD Ryzen solutions. We also can provide standard operational temperature modules (0°C to +60°C) and wide temperature (-40°C to +85°C).
Qseven Modules (9)

Qseven modules are equipped with fast serial interfaces in a ultra-small form factor of just 70 x 70 mm. Qseven modules are much smaller than other system-on-modules which make them an ideal solution for space-limited and low power applications. BVM provide Qseven solutions available in low powered Intel Atom, Celeron (15 year CPU life cycle support) and ARM (iMX6) processor formats – and on standard and wide temperature (-40°C to +85°C) platforms.
SMARC Modules (1)

Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices. SMARC defines two module sizes: • 82 mm × 50 mm for extremely compact low-power designs • 82 mm × 80 mm for SoCs with higher performance and with increased space and cooling requirement
Carrier Boards (21)

Carrier boards (baseboards) offer the customisable engineering platforms for COM Express Type and Qseven modules to competently function – providing for your exact choice and physical location of i/o. BVM have a long history of designing & manufacturing custom carrier boards to meet applications needs in industrial automation, audio visual and medical healthcare, aiding our customers product development phases and bringing successive generations of their products to market, faster.
Smart Display Modules (1)

Intel Smart Display Modules for next generation commercial AIO displays and visual IoT devices. An Intel SDM provides the primary compute building block and requires an interface board on the displays or host system to complete the platform implementation and provide standard end user physical interface.