Computer-On-Modules (COM/SOM) are ideal for applications where product time to market and longevity are critical. Today’s COM modules mainly come in 3 main formats; COM Express Mini, Compact and Basic.

Plugged into carrier boards, they can be upgraded to newer, backwards-compatible versions as processor technology progresses. COM modules are typically used in Industrial, military, aerospace, medical and transportation.

Why use a COM module? What are the Benefits?
COMe vs Qseven vs SMARC: A Comparison of Modular Embedded Computing Standards
An Introduction to COM-HPC
Custom Carrier Board Design Service
A Comprehensive Guide to Computer-on-Modules

  • COM Express Compact

    COM Express Compact (17)

    COM Express Compact modules are designed with computing capability and cost efficiency in a footprint size of 95 x 95 mm and are a good option for transportation and defence applications. Compact modules are mainly available with COM Express pin-out Type 6 – but we also have availability in Type 2 – and are available in low powered Intel Atom, AMD G-Series and the latest Intel i-core generation processor solutions.
  • COM Express Mini

    COM Express Mini (11)

    COM Express Mini modules deliver high performance in a small 55 x 84 mm footprint.  They’re  ideal for space-limited, power-saving, and mobile applications. Our solutions are available in Type 10 COM Express pin out formats, selectable in Atom E3800 and E3900 processor formats - through to AMD Ryzen and the latest Intel Core Series.
  • COM Express Basic

    COM Express Basic (16)

    COM Express Basic modules provide high-level processing performance and high-speed interfaces for a wide range of demanding computing applications such as medical and industrial automation. Our Basic modules are compatible with COM Express pin-out Type 2, Type 6, and Type 7 – selectable in wide range of Intel Core Series and AMD Ryzen solutions. We also can provide standard operational temperature modules (0°C to +60°C) and wide temperature (-40°C to +85°C).

    COM-HPC (2)

    COM-HPC, or Computer-on-Module High-Performance Computing, is a standardized form factor for high-performance computing solutions. Developed by PICMG, it separates the processor module from the carrier board, offering flexibility in system design and upgrades. The modular approach accommodates diverse computing needs, with different size options and pinouts defined by the standard. COM-HPC modules integrate powerful processors, memory, storage and I/O, making them suitable for applications like edge computing and industrial automation. • An Introduction to COM-HPC: High-Performance Computer-on-ModulesFrom HPC to AI: How CXL is Transforming Computing Performance
  • Qseven Modules

    Qseven Modules (9)

    Qseven modules are equipped with fast serial interfaces in a ultra-small form factor of just 70 x 70 mm. Qseven modules are much smaller than other system-on-modules which make them an ideal solution for space-limited and low power applications. BVM provide Qseven solutions available in low powered Intel Atom, Celeron (15 year CPU life cycle support) and ARM (iMX6) processor formats – and on standard and wide temperature (-40°C to +85°C) platforms.
  • SMARC Modules

    SMARC Modules (7)

    Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices. SMARC defines two module sizes: • 82 mm × 50 mm for extremely compact low-power designs • 82 mm × 80 mm for SoCs with higher performance and with increased space and cooling requirement
  • Carrier Boards

    Carrier Boards (22)

    Carrier boards (baseboards) offer the customisable engineering platforms for COM Express Type and Qseven modules to competently function – providing for your exact choice and physical location of i/o. BVM have a long history of designing & manufacturing custom carrier boards to meet applications needs in industrial automation, audio visual and medical healthcare, aiding our customers product development phases and bringing successive generations of their products to market, faster.
  • Smart Display Modules

    Smart Display Modules (1)

    Intel Smart Display Modules for next generation commercial AIO displays and visual IoT devices. An Intel SDM provides the primary compute building block and requires an interface board on the displays or host system to complete the platform implementation and provide standard end user physical interface.