COM-HPC
COM-HPC, or Computer-on-Module High-Performance Computing, is a standardized form factor for high-performance computing solutions. Developed by PICMG, it separates the processor module from the carrier board, offering flexibility in system design.
The modular approach accommodates diverse computing needs, with different size options and pinouts defined by the standard. COM-HPC modules integrate powerful processors, memory, storage and I/O, making them suitable for applications like edge computing and industrial automation.
• An Introduction to COM-HPC
• From HPC to AI: How CXL is Transforming Computing Performance
Showing all 4 results
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Advantech SOM-C350R Intel Raptor Lake-S/ Alder Lake-S COM-HPC Module
- Product Name: Advantech SOM-C350/R
- Module Form Factor: COM-HPC Client Size C Module
- CPU: 13th/12th Gen Intel Core processors (Raptor Lake-S/ Alder Lake-S) desktop CPU
- RAM: Dual Channel DDR5 SODIMM, max. 128GB (Both ECC & Non-ECC)
- Expansion: 16 PCIe Gen5 + 16 PCIe Gen4 + 10 PCIe Gen3 lanes
- Other Features: Up to 16 Cores, 24 Threads, 65W TDP, Supports iManager, Embedded Software APIs, and WISE-DeviceOn
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Advantech SOM-E780 AMD EPYC 7003 COM-HPC Server Size E Module
- Product Name: Advantech SOM-E780
- Module Form Factor: COM-HPC Server Size E with proprietary pinout
- CPU: Up to 64-core/225W AMD EPYC 7003
- RAM: Supports up to 512GB with 4x DDR4 long DIMM
- Expansion: 79 PCIe Gen4 lanes (14 more than COM-HPC STD)
- Other Features: Supports iManager, Embedded Software APIs, WISE-DeviceOn, and IPMB
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Advantech SOM-E781 AMD EPYC 8004 COM-HPC Server Size E Module
- Product Name: Advantech SOM-E781
- Module Form Factor: COM-HPC Server Size E with proprietary pinout
- CPU: Up to 64-core/200W AMD EPYC 8004
- RAM: Supports up to 576GB with 6x DDR5 RDIMM
- Expansion: 79 PCIe Gen5 lanes, including 48 lanes of CXL1.1
- Other Features: Multiple I/O expansion (2.5GbE, USB3.2 Gen1, SATA3.0) and supports iManager, Embedded Software APIs, DeviceOn, and IPMB
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DFI RPS9HC Intel Raptor Lake S COM-HPC
- Product Name: DFI RPS9HC
- Module Form Factor: COM-HPC
- CPU: 13th Gen Intel Core with Intel R680E/Q670E/H610E Chipset
- RAM: 4 DDR5 SODIMM 3600MHz up to 128GB
- Expansion: Multiple Expansion: 1 PCIe x16, 4 PCIe x4, 2 PCIe x1
- Other features: Quad Displays: eDP + 3 DDI; DDI supports up to 8K; Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0; Typically supports 10-Year CPU Life Cycle Until Q1’ 38