COM-HPC, or Computer-on-Module High-Performance Computing, is a standardized form factor for high-performance computing solutions. Developed by PICMG, it separates the processor module from the carrier board, offering flexibility in system design and upgrades.

The modular approach accommodates diverse computing needs, with different size options and pinouts defined by the standard. COM-HPC modules integrate powerful processors, memory, storage, and interfaces, making them suitable for applications like edge computing and industrial automation.

An Introduction to COM-HPC: High-Performance Computer-on-Modules

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  • RPS9HC 1

    DFI RPS9HC Intel Raptor Lake S COM-HPC

    • DFI RPS9HC Intel Raptor Lake S COM-HPC
    • 13th Gen Intel Core with Intel R680E/Q670E/H610E Chipset
    • 4 DDR5 SODIMM 3600MHz up to 128GB
    • Quad Displays: eDP + 3 DDI
    • DDI supports up to 8K
    • Multiple Expansion: 1 PCIe x16, 4 PCIe x4, 2 PCIe x1
    • Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0
    • Typically supports 10-Year CPU Life Cycle Until Q1’ 38