Case Study: CubeSat Programme Hardware Supply

Introduction

Space may be unforgiving, but the challenges of building technology often begin long before launch day. When a new CubeSat project came to light with a mission-critical satellite solutions provider, BVM were excited to take on the challenge. Drawing on our expertise in high reliability computing systems, we were ready to help the customer find the right solution for their application.

The project required a compact motherboard capable of operating in the harsh conditions of Low Earth Orbit. The team faced a familiar challenge: finding reliable hardware that could meet demanding environmental requirements without slowing the project schedule.

The Challenge: Demands of the Space Environment

In space, there’s no room for compromise especially when it comes to reliability. As the project gained momentum, the pressure was on to identify a motherboard that could meet both the technical requirements and the project’s tight schedule. The solution needed to be compact enough for a CubeSat platform while offering reliable operation across a wide temperature range in the demanding conditions of Low Earth Orbit.

The core challenge was to provide a solution that could balance:

• High-performance computing requirements
• Space-grade reliability and durability
• Fast production and integration timelines

The Solution: Rugged Motherboard Computing

To meet the project’s requirements, BVM recommended a rugged embedded computing platform built around the DFI 770-ALF511-400G and AAEON de next-TGU8 A10-0001.

AAEON’s de next-TGU8 is a compact single board computing platform built around an on-board Intel® Core™-i level processor, delivering high performance within a significantly reduced footprint. Designed for applications such as CubeSats —small, standardised satellites used for cost-effective missions and technology deployment in Low Earth Orbit—this form factor is critical where space, weight, and power constraints are tightly limited. Despite its size, the board retains a strong I/O set, flexible expansion options, and industrial-grade performance, making it suitable for edge AI, robotics, and smart transport applications where space and efficiency are critical constraints.

Selected for their compact form factors, industrial-grade reliability, and wide operating temperature ranges, these platforms provided a dependable solution for the CubeSat application while helping the project remain on schedule.

Why These Platforms?

• Compact designs suitable for CubeSat integration
• Operating temperature ranges of -20°C to +70°C (DFI) and -40°C to +85°C (AAEON)
• Power efficient designs featuring DDR4 memory and onboard eMMC storage
• Industrial-grade reliability for demanding environments
• Fast availability to support a tight project timeline

Outcome

By supplying a rugged, aerospace-ready motherboard within a short timeframe, BVM helped the customer maintain project momentum and avoid delays to integration activities.

The solution met the environmental requirements of the mission while supporting continued development ahead of the planned launch schedule.

BVM: Your Expert Partner for Embedded Computing

Facing size constraints or ruggedisation challenges in your next project?

With over 30 years of experience in industrial and embedded computing, BVM helps deliver reliable, practical solutions for demanding applications. From custom NUCs and rugged SBCs through to full system design, we support projects from specification to deployment.