ASRock Industrial iEP-9040VE Compact Edge AI Platform

  • Product Name: ASRock Industrial iEP-9040VE
  • System Type: Compact Edge AIoT platform
  • CPU: Intel Core Series 2 Processors (Bartlett Lake-S/12P) and Intel R680E or H610 chipsets.
  • RAM: Up to 96GB DDR5 5600MHz dual-channel SO-DIMM memory.
  • Expansion: M.2 Gen4 x4 NVMe storage, SATA RAID support, and optional PoE, OOB, and 10BASE-T1S expansion modules.
  • Other Features: TSN and TCC support, dual Gigabit LAN, USB 3.2 connectivity, digital I/O, 9-36V DC input, and extended temperature operation from -40°C to 55°C.

Description

Preliminary Product Information
This product page contains preliminary information and specifications that are subject to change without notice. Full technical details, documentation, and configuration options will be published as they become available. Please contact us for the latest product information, availability, and project-specific requirements.

 

The ASRock Industrial iEP-9040VE Series is a compact and versatile Edge AI platform designed for distributed industrial computing, automation control, and intelligent edge applications where space is limited. Available in the iEP-9040VE and iEP-9042VE models, the platform combines Intel Core Series 2 Processor performance with a compact, rugged industrial design. Supporting up to 96GB of DDR5 5600MHz memory, the system delivers the processing power required for real-time control, machine monitoring, data acquisition, and industrial IoT applications. High-speed storage is provided through NVMe SSD and SATA interfaces with RAID support, ensuring reliable operation and flexible data management.

The platform integrates a comprehensive range of industrial I/O, including USB 3.2 ports, Gigabit Ethernet, serial communications, digital I/O, and support for high-resolution 4K displays. Optional PoE, OOB management, and 10BASE-T1S expansion modules further enhance networking and remote management capabilities.

Engineered for deployment in harsh industrial environments, the iEP-9040VE Series operates from -40°C to 55°C and supports a wide 9-36V DC power input range. Support for Time-Sensitive Networking (TSN) and Time Coordinated Computing (TCC) enables deterministic communications and reliable real-time performance, making the platform ideal for smart factories, industrial automation, transportation systems, and distributed edge computing applications.

Key Features

  • Intel Core Processors (Series 2) with R680E or H610 Chipset
    • iEP-9040VE – R680E
    • iEP-9042VE – H610
  • 2 x 262-pin DDR5 SO-DIMM up to 96GB (48GB per DIMM)
  • 1 x M.2 Key M
  • 4 x USB 3.2 Gen2x1, 2 x Internal USB 3.2 Gen2x1 (Optional)
  • 2 x Intel 1G LAN (LAN1 supports vPro)
  • 2 x COM, 2 x SATA3, 4 x DI, 4 x DO
  • 1 x Displayport, 2 x HDMI 2.0b
  • Optional Kit: PoE function card, 10BASE-T1S function card, OOB function card

Specification

Processor System  
   
CPU Intel® Core™ Processors (Series 2)
Chipset Intel® R680E
Socket LGA 1700
Memory  
   
Technology Dual Channel DDR5 5600MHz
(ECC memory supported by R680E + Selected CPU)
Capacity 96 GB (48 GB per DIMM)
Socket 2 x 262-pin SO-DIMM
Graphics  
   
Controller Intel® UHD Graphics
DisplayPort DisplayPort 1.4a , DP++
Max resolution up to 4096×2160@60Hz
HDMI HDMI 2.0b
Max resolution up to 4096×2160@60Hz
Audio  
   
Interface Realtek ALC897, High Definition Audio.
Ethernet  
   
Controller/ Speed 1 x Intel® i219LM (vPro Support)
1 x Intel® i210IT
Connector 2 x RJ45
Front I/O  
   
DisplayPort 1
HDMI 2
Ethernet 2 x Intel 1G LAN
USB 4 x USB 3.2 Gen2x1, 2 x Internal USB 3.2 Gen2x1 (Optional)
Audio 1 x Line-in, 1 x Line-out
COM 2 x RS232/422/485
DIO 4DIs/4DOs
Storage  
   
M.2 1 x M.2 (Key M, 2242/2260/2280/22110/25110) with
Gen4 x4 for NVMe SSD
SATA 2 x SATA3 (6Gb/s), R680E: support RAID 0/1
CFast 1 x Type II socket (Shared with SATA3)
Watchdog Timer  
   
Output From Super I/O to drag RESETCON#
Interval 256 Segments, 0, 1, 2, …255sec
Power Requirements  
   
Input PWR 9V~36V DC
OVP, UVP, OCP and reverse protection for MB Power Input.
Ignition Power Input w/ 13-mode condition.
Environment  
   
Operating Temp 45W CPU: – 40°C ~ 55°C (-40°F ~ 131°F)
65W CPU: – 40°C ~ 50°C (-40°F ~ 122°F)
(w/ air flow 0.5~0.8 m/s)
Storage Temp -40°C~85°C ( -40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock MIL-STD-810H, Method 516.8, Procedure I
Vibration MIL-STD-810H, Method 514.8
ESD Contact +/-4kV, Air +/-8kV
EMC EN61000-6-4/-2, CE & FCC Class A
Safety LVD
Mechanical  
   
Construction Aluminum heatsink + Metal chassis
Mounting Desk Mount
Dimensions 200mm (W) x 230mm (D) x 93mm (H) (7.87″ x 9.06″ x 3.66″)
Net Weight 6kg
Others  
   
OS Support Windows 11 & Windows 10 & Linux
TPM TPM 2.0
Real-Time Enablement TSN, TCC support under YOCTO

 

ASRock Industrial Intel Bartlett Lake Edge AI Platforms Comparison

Scalable Edge AI Computing Solutions for Industrial Applications

Choosing the right Edge AI platform depends on the performance requirements, expansion needs, available installation space, and future scalability of your application. The iEPF-9500S-EW7, iEPF-9040VS Series, and iEP-9040VE Series all leverage Intel® Core™ Series 2 Processors with P-cores (Bartlett Lake-S/12P), delivering reliable industrial computing performance for AI, machine vision, automation, and Industrial IoT deployments.

The iEPF-9500S-EW7 is the flagship high-performance platform, designed for demanding AI inference and GPU-accelerated workloads requiring extensive PCIe expansion and support for dual discrete GPUs. The iEPF-9040VS Series provides a balanced solution, combining strong performance and expansion flexibility in a more compact and cost-effective design. For applications where installation space is limited, the iEP-9040VE Series offers the same modern processor architecture in a compact chassis optimised for distributed edge computing, industrial control, and real-time networking applications.

  iEPF 9500S EW7 1 iEPF 9040VS EW2 1 iEP 9040VE 1
Feature iEPF-9500S-EW7 iEPF-9040VS Series iEP-9040VE Series
Platform Type High-Performance Edge AI Platform Balanced Edge AI Platform Compact Edge AI Platform
Processor Support Intel® Core™ Series 2 (Bartlett Lake-S/12P) Intel® Core™ Series 2 (Bartlett Lake-S/12P) Intel® Core™ Series 2 (Bartlett Lake-S/12P)
Chipset Intel® R680E Intel® R680E / H610 Intel® R680E / H610
Memory Up to 192GB DDR5 ECC U-DIMM Up to 96GB DDR5 SO-DIMM Up to 96GB DDR5 SO-DIMM
GPU Support Dual GPUs up to 600W Expansion cards up to 75W No dedicated GPU expansion
PCIe Expansion 1x Gen5 x16 or 2x Gen5 x8, 1x Gen4 x4, 4x Gen4 x1 2x PCIe Gen4 x8 Compact platform with limited expansion
Storage 3x M.2, 4x SATA3 1x M.2, 2x SATA3 RAID 1x M.2, 2x SATA3 RAID
Ethernet 3x Intel® 2.5GbE 2x Intel® Gigabit LAN 2x Intel® Gigabit LAN
USB Ports 6x USB 3.2 Gen2 Multiple USB 3.2 Gen2 4x USB 3.2 Gen2
COM Ports 4x COM Multiple COM 2x COM
Digital I/O 8 DI / 8 DO 4 DI / 4 DO 4 DI / 4 DO
Display Outputs DP, HDMI 2.0b, VGA 1x DP, 2x HDMI 2.0b DisplayPort and HDMI support
Optional Expansion OOB, 10BASE-T1S, Isolated DIO, Isolated COM PoE, OOB, 10BASE-T1S PoE, OOB, 10BASE-T1S
Operating Temperature -40°C to 55°C -40°C to 55°C -40°C to 55°C
Power Input 9-36V DC Industrial DC Input 9-36V DC
Dimensions (W × D × H) 288 × 450.3 × 250 mm 187 × 231.1 × 200 mm 200 × 230 × 93 mm
Ideal Applications AI Inference, Machine Vision, GPU Computing, Autonomous Systems Industrial Automation, Vision Systems, Edge Analytics Distributed Edge Computing, Industrial Control, TSN Networks

Which Platform is Right for Your Application?

  • Choose the iEPF-9500S-EW7 when maximum processing power, GPU acceleration, and expansion flexibility are required for advanced AI and machine vision deployments.
  • Choose the iEPF-9040VS Series when you need a balance of performance, expansion capability, and value for industrial automation and edge computing projects.
  • Choose the iEP-9040VE Series when compact size, reliable operation, and distributed edge deployment are the primary requirements.

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

Build to Order Banner

Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs, Panel PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Android image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images
  • Custom BIOS

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.