ASRock Industrial iEPF-9500S-EW7 High-Performance Edge AI Platform

  • Product Name: ASRock Industrial iEPF-9500S-EW7
  • System Type: High-performance expandable Edge AIoT platform
  • CPU: Intel Core Series 2 Processors (Bartlett Lake-S/12P) and Intel R680E chipset.
  • RAM: Up to 192GB DDR5 5600MHz ECC U-DIMM.
  • Expansion: Multiple PCIe Gen5 and Gen4 slots with support for dual GPUs up to 600W, plus M.2 and SATA storage expansion.
  • Other Features: Triple 2.5GbE LAN, multiple USB and COM ports, 8 DI/DO, triple-display support, optional OOB management, and operation from -40°C to 55°C.

Description

Preliminary Product Information
This product page contains preliminary information and specifications that are subject to change without notice. Full technical details, documentation, and configuration options will be published as they become available. Please contact us for the latest product information, availability, and project-specific requirements.

 

The ASRock Industrial iEPF-9500S-EW7 is a high-performance Edge AI platform engineered for demanding industrial AI, machine vision, and data-intensive edge computing applications. Powered by Intel Core Series 2 Processors with P-cores (Bartlett Lake-S/12P) and the Intel R680E chipset, it delivers exceptional processing capability, long-term platform availability, and industrial-grade reliability. Supporting up to 192GB of DDR5 5600MHz ECC memory, the system is designed to handle advanced AI inference, real-time analytics, and complex automation workloads. Extensive expansion capabilities include PCIe Gen5 and Gen4 slots, enabling support for dual high-performance GPUs up to 600W, frame grabbers, accelerator cards, and other specialised peripherals.

The platform offers versatile storage and connectivity options, including M.2 and SATA interfaces, triple-display support, three Intel 2.5GbE LAN ports, multiple USB 3.2 ports, COM interfaces, and integrated digital I/O. Optional expansion modules such as Out-of-Band (OOB) management, 10BASE-T1S networking, isolated DIO, and isolated COM modules provide additional flexibility for industrial deployments.

Designed for harsh environments, the iEPF-9500S-EW7 features a robust thermal architecture, wide 9-36V DC input, and reliable operation from -40°C to 55°C. Its rugged design makes it ideal for smart manufacturing, autonomous systems, transportation, surveillance, and advanced industrial AI applications where performance and scalability are critical.

Key Features

  • Intel Core Processors (Series 2) with R680E Chipset
  • 4 x 288-pin DDR5 U-DIMM up to 192GB (48GB per DIMM)
  • 1 x PCIe x16 (PCIe Gen5) or 2 x PCIe x8 (PCIe Gen5),1 x PCIe x 4 (PCIe Gen4), 4 x PCIe x 1 (Gen4)
  • 2 x M.2 Key M, 2 x M.2 Key B, 1 x M.2 Key E
  • 6 x USB 3.2 Gen2x1
  • 4 x COM, 4 x SATA3, 8 x DI, 8 x DO
  • 3 x Intel 2.5G LAN (LAN1 support vPro)
  • 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA
  • Optional Kit: 10BASE-T1S function card, 8DIO card
  • (w/ Isolation Protection), 4COM card (w/ Isolation Protection), OOB function card
  • Powerful Edge AI acceleration enabled by the most flexible mechanical, thermal,
  • and power design, with support for 75mm x 360 mm x 194 mm (W x D x H) max.
  • for one 600W graphic card and 58mm x 360 mm x 194 mm (W x D x H) max. for
  • dual 600W graphic card

Specification

Processor System  
   
CPU Intel® Core™ Processors (Series 2)
Chipset Intel® R680E
Socket LGA 1700
Memory  
   
Technology Dual Channel DDR5 5600MHz
(ECC memory supported by R680E + Selected CPU)
Capacity 192 GB (48GB per DIMM)
Socket 4 x 288-pin U-DIMM
Graphics  
   
Controller Intel® UHD Graphics
DisplayPort DisplayPort 1.4a , DP++
Max resolution up to 4096×2160@60Hz
HDMI HDMI 2.0b
Max resolution up to 4096×2160@60Hz
VGA Max resolution up to 1920×1200@60Hz
Expansion Slot  
   
PCIe 1 x PCIe Gen5 x16 (single x16 or dual x8),   
1 x PCIe Gen5 x8 (shared with dual x8)
1 x PCIe Gen4 x4
4 x PCIe Gen4 x1
RF& Antenna 8 x SMA connector hole reserved
M.2 1 x M.2 (Key E, 2230) with CNVI/PCIe Gen3 x1 and USB 2.0 for Wi-Fi/BT module
1 x M.2 (Key B1, 2280/3042/3052) with PCIe Gen3 x1 / USB3.2 Gen1x1 and USB 2.0 for 4G / 5G
1 x M.2 (Key B2, 3042/3052) with PCIe Gen3 x1 / USB3.2 Gen1x1 and USB 2.0 for 4G / 5G
SIM Socket 2 x Nano SIM Card slot
(2 connected to M.2 Key B)
Audio  
   
Interface Realtek ALC897, High Definition Audio.
Ethernet  
   
Controller/ Speed 3 x Intel® i226-IT (LAN1 supports vPro)
Connector 3 x RJ45
Front I/O  
   
DisplayPort 1
HDMI 1
VGA 1
Ethernet 3 x Intel 2.5G LAN1~ LAN3
USB 6 x USB 3.2 Gen2x1
Audio 1 x Mic-in, 1 x Line-out
COM 2 x RS232, 2 x RS232/422/485
DIO 8DIs/8DOs
Storage  
   
M.2 1 x M.2 (Key M1, 2242/2260/2280/22110/25110) with Gen4 x4 for NVMe SSD
1 x M.2 (Key M2, 2242/2260/2280) with Gen4 x4 for NVMe SSD
SATA 4 x SATA3 (6Gb/s), support RAID 0/1/5/10
Accommodate up to 4 x 2.5″ HDD/SSD Tray (Default 1 piece, additional HDD trays are available as optional parts for order)
Watchdog Timer  
   
Output From Super I/O to drag RESETCON#
Interval 256 Segments, 0, 1, 2, …255sec
Power Requirements  
   
Input PWR 9V~36V DC
Environment  
   
Operating Temp 45W CPU w/ dual 600W GPU: – 40°C ~ 55°C (-40°F ~ 131°F)
65W CPU w/ dual 600W GPU: – 40°C ~ 50°C (-40°F ~ 122°F)
(with FAN inside) (w/ air flow 0.5~0.8 m/s)
Storage Temp -40°C~85°C ( -40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Shock MIL-STD-810H, Method 516.8, Procedure I
Vibration MIL-STD-810H, Method 514.8
ESD Contact +/-4kV, Air +/-8kV
EMC EN61000-6-4/-2, CE & FCC Class A
Safety LVD
Mechanical  
   
Construction Aluminum heatsink + Metal chassis
Mounting Desk Mount
Dimensions 288mm (W) x 450.3mm (D) x 250mm (H) (11.34″ x 17.73″ x 9.84″)
Net Weight 13kg
Others  
   
OS Support Windows 11 & Windows 10 & Linux
TPM TPM 2.0
Real-Time Enablement

TSN, TCC support under YOCTO

 

ASRock Industrial Intel Bartlett Lake Edge AI Platforms Comparison

Scalable Edge AI Computing Solutions for Industrial Applications

Choosing the right Edge AI platform depends on the performance requirements, expansion needs, available installation space, and future scalability of your application. The iEPF-9500S-EW7, iEPF-9040VS Series, and iEP-9040VE Series all leverage Intel® Core™ Series 2 Processors with P-cores (Bartlett Lake-S/12P), delivering reliable industrial computing performance for AI, machine vision, automation, and Industrial IoT deployments.

The iEPF-9500S-EW7 is the flagship high-performance platform, designed for demanding AI inference and GPU-accelerated workloads requiring extensive PCIe expansion and support for dual discrete GPUs. The iEPF-9040VS Series provides a balanced solution, combining strong performance and expansion flexibility in a more compact and cost-effective design. For applications where installation space is limited, the iEP-9040VE Series offers the same modern processor architecture in a compact chassis optimised for distributed edge computing, industrial control, and real-time networking applications.

  iEPF 9500S EW7 1 iEPF 9040VS EW2 1 iEP 9040VE 1
Feature iEPF-9500S-EW7 iEPF-9040VS Series iEP-9040VE Series
Platform Type High-Performance Edge AI Platform Balanced Edge AI Platform Compact Edge AI Platform
Processor Support Intel® Core™ Series 2 (Bartlett Lake-S/12P) Intel® Core™ Series 2 (Bartlett Lake-S/12P) Intel® Core™ Series 2 (Bartlett Lake-S/12P)
Chipset Intel® R680E Intel® R680E / H610 Intel® R680E / H610
Memory Up to 192GB DDR5 ECC U-DIMM Up to 96GB DDR5 SO-DIMM Up to 96GB DDR5 SO-DIMM
GPU Support Dual GPUs up to 600W Expansion cards up to 75W No dedicated GPU expansion
PCIe Expansion 1x Gen5 x16 or 2x Gen5 x8, 1x Gen4 x4, 4x Gen4 x1 2x PCIe Gen4 x8 Compact platform with limited expansion
Storage 3x M.2, 4x SATA3 1x M.2, 2x SATA3 RAID 1x M.2, 2x SATA3 RAID
Ethernet 3x Intel® 2.5GbE 2x Intel® Gigabit LAN 2x Intel® Gigabit LAN
USB Ports 6x USB 3.2 Gen2 Multiple USB 3.2 Gen2 4x USB 3.2 Gen2
COM Ports 4x COM Multiple COM 2x COM
Digital I/O 8 DI / 8 DO 4 DI / 4 DO 4 DI / 4 DO
Display Outputs DP, HDMI 2.0b, VGA 1x DP, 2x HDMI 2.0b DisplayPort and HDMI support
Optional Expansion OOB, 10BASE-T1S, Isolated DIO, Isolated COM PoE, OOB, 10BASE-T1S PoE, OOB, 10BASE-T1S
Operating Temperature -40°C to 55°C -40°C to 55°C -40°C to 55°C
Power Input 9-36V DC Industrial DC Input 9-36V DC
Dimensions (W × D × H) 288 × 450.3 × 250 mm 187 × 231.1 × 200 mm 200 × 230 × 93 mm
Ideal Applications AI Inference, Machine Vision, GPU Computing, Autonomous Systems Industrial Automation, Vision Systems, Edge Analytics Distributed Edge Computing, Industrial Control, TSN Networks

Which Platform is Right for Your Application?

  • Choose the iEPF-9500S-EW7 when maximum processing power, GPU acceleration, and expansion flexibility are required for advanced AI and machine vision deployments.
  • Choose the iEPF-9040VS Series when you need a balance of performance, expansion capability, and value for industrial automation and edge computing projects.
  • Choose the iEP-9040VE Series when compact size, reliable operation, and distributed edge deployment are the primary requirements.

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

Build to Order Banner

Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs, Panel PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Android image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images
  • Custom BIOS

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.