ASRock Industrial IMB-1314 14th/13th/12th Gen Micro ATX Motherboard

  • Product Name: Asrock IMB-1314
  • Motherboard Form Factor: Micro ATX
  • CPU: Intel® 14th/13th/12th Gen (Raptor Lake-S/Alder Lake-S) Core™ Processors with Q670 chipset
  • RAM: 4 x 288-pin Long-DIMM DDR4 3200 MHz, up to 128GB (32GB per DIMM)
  • Expansion: 1 x PCIex16 (Gen4), 1 x PCIex8 (Gen4), 2 x PCIex4 (Gen4), 1 x USB3.2 Gen2x2 Type C, 5 x USB 3.2 Gen2, 2x USB 3.2 Gen1, 4 x USB 2.0, 1 x M.2 Key E, 2 x M.2 Key M, 1 x M.2 Key B, 6 x COM, 8 x SATA3
  • Other features: 2 x Intel 2.5 Gigabit LAN, Support Quad display, 1 x HDMI2.0b, 1 x DP 1.4a, 1 x VGA, 1 x LVDS, TPM2.0 on board IC, Supports Intel® vPro, AMT, VMD RAID 0/1/5/10, ATX PWR (24+8 Pin)
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Description

 

ASRock Industrial 14th Gen Boards

 

Introducing the ASRock Industrial IMB-1314 Micro ATX Motherboard – a powerhouse designed to elevate your computing experience. Engineered to support Intel® 14th/13th/12th Gen Core™ Processors with the Q670 chipset, this motherboard offers a perfect blend of performance and versatility.

With 4 x 288-pin Long-DIMM DDR4 slots running at 3200 MHz, the IMB-1314 boasts a remarkable capacity of up to 128GB (32GB per DIMM), ensuring seamless multitasking and efficient data processing. The PCIex16 (Gen4), PCIex8 (Gen4), and 2 x PCIex4 (Gen4) slots, along with a variety of USB ports, including 1 x USB3.2 Gen2x2 Type C, provide extensive connectivity options for high-speed data transfer.

Featuring 2 x Intel 2.5 Gigabit LAN ports, the IMB-1314 ensures a fast and reliable network connection. Immerse yourself in a Quad display setup through 1 x HDMI2.0b, 1 x DP 1.4a, 1 x VGA, and 1 x LVDS, delivering stunning visual experiences across multiple screens.

Enhanced security features include the onboard TPM2.0 IC, while support for Intel® vPro, AMT, and VMD RAID 0/1/5/10 ensures advanced management and storage capabilities. The ATX PWR (24+8 Pin) configuration optimizes power delivery for stability and efficiency, making the IMB-1314 the ideal choice for high-performance Micro ATX computing.

Key Features

  • Intel® 14th/13th/12th Gen (Raptor Lake-S/Alder Lake-S) Core™ Processors with Q670 chipset
  • 4 x 288-pin Long-DIMM DDR4 3200 MHz, up to 128GB (32GB per DIMM)
  • 1 x PCIex16 (Gen4), 1 x PCIex8 (Gen4), 2 x PCIex4 (Gen4), 1 x USB3.2 Gen2x2 Type C, 5 x USB 3.2 Gen2, 2x USB 3.2 Gen1, 4 x USB 2.0, 1 x M.2 Key E, 2 x M.2 Key M, 1 x M.2 Key B, 6 x COM, 8 x SATA3
  • 2 x Intel 2.5 Gigabit LAN
  • Support Quad display, 1 x HDMI2.0b, 1 x DP 1.4a, 1 x VGA, 1 x LVDS
  • TPM2.0 on board IC
  • Supports Intel® vPro, AMT, VMD RAID 0/1/5/10
  • ATX PWR (24+8 Pin)

Specification

Form Factor
Dimensions Micro-ATX (9.6-in x 9.6-in x 1.4-in)
Processor System
CPU Intel® 14th/13th/12th Gen (Raptor Lake-S/Alder Lake-S) Core™ Processors , up to 125W
Chipset Intel® Q670
Socket LGA 1700
BIOS AMI SPI 256 Mbit
Memory
Technology Dual Channel DDR4 3200 MHz
Capacity 128GB (32GB per DIMM)
Socket 4 x 288-pin Long-DIMM
Graphics
Controller Intel® Iris® Xe Graphics
HDMI HDMI 2.0b
Max resolution up to 4096 x 2160@60Hz
DisplayPort DisplayPort 1.4a, DP++
Max resolution up to 4096×2160@60Hz
VGA Max resolution up to 1920 x 1200@60Hz
LVDS Dual channel 24 bit up to 1920 x 1200@60Hz
MultiDisplay Quad Display
Expansion Slot
PCIe 2 x PCIe Gen4 Slots (PCIE1/PCIE3:single at x16(PCIE1);
dual at x8 (PCIE1) / x8 (PCIE3))
(PCIE1: Support riser card x8/x8)
2 x PCIex4 (Gen4)
M.2 1 x M.2 (Key B, 3042/3052) with PCIex1, USB 3.2 Gen1, USB 2.0 and SIM for 4G/5G
1 x M.2 (Key E, 2230) with PCIe x1, USB 2.0 and CNVi for Wireless
SIM Socket 1 x SIM socket connected to M.2 key B
Audio
Interface Realtek ALC897 HD, High Definition Audio.
Ethernet
Controller/ Speed LAN1: Intel® I225LM with 10/100/1000/2500 Mbps, supports AMT/vPro
LAN2: Intel® I225LM with 10/100/1000/2500 Mbps
Connector 2 x RJ-45
Rear I/O
HDMI 1 x HDMI2.0
DisplayPort 1 x DP 1.4a++
VGA 1
Ethernet 2 x 2.5 Gigabit LAN
USB 5 x USB 3.2 Gen2
1 x USB 3.2 Gen2x2 (20G) Type C
Audio 3 (Line-In/Line-Out/Mic-In)
Serial Port COM1, COM2 (RS-232/422/485)
Internal Connector
USB 2 x USB 3.2 Gen1 (1 x USB 3.2 header)
4 x USB 2.0 (2 x 2.54 pitch header)
COM COM3, COM4, COM5, COM6 (RS-232)
Parallel 1 (shared with GPIO)
GPIO 8 x GPI, 8 x GPO (shared with LPT header)
TPM TPM 2.0 on board IC
LVDS 1
Speaker Header 1
PS/2 1 x PS/2 header
Storage
M.2 1 x M.2 (Key M, up to 22110) with PCIex4 Gen4 for SSD
1 x M.2 (Key M, 2242/2260/2280) with PCIex4 Gen3 for SSD
SATA 8 x SATA3
RAID Intel® SATA RAID 0/1/5/10
Watchdog Timer
Output From Super I/O to drag RESETCON#
Interval 256 Segments, 0, 1, 2, …255sec
Power Requirements
Input PWR ATX PWR (24+8-pin)
Power On AT/ATX Supported
– AT : Directly PWR on as power input ready
– ATX : Press button to PWR on after power input ready
Environment
Operating Temp 0ºC ~ 60ºC
Storage Temp -40° C ~ 85° C
Operating Humidity 5% ~ 90%
Storage Humidity 5% ~ 90%

Datasheet

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BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.

Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Manufacturer : Asrock

Motherboard

  • Form Factor : Micro ATX

CPU

  • Powered By : Intel
  • CPU Family : iCore
  • CPU Generation : Alder Lake
  • CPU Model : i3 Support, i5 Support, i7 Support

Memory

  • Memory Installed :
  • Memory Slots : 4
  • Memory Type : 3200Mhz DDR4

I/O and Expansion

  • Expansion Slots : M.2, PCIe, SATA
  • LAN Ports : 2
  • Serial Ports : 6
  • USB 2 Ports : 4
  • USB 3 Ports :
  • USB 3.X / USB C / USB 4.0 Ports :
  • Video Output : DisplayPort, HDMI, LVDS
  • Multi Display : Quad Display

Operating System

  • OS : Windows

Certifications

  • Certifications :

Features

  • 5G-4G-GPS : Yes
  • Artificial Intelligence Use : Artificial Intelligence, Edge Computing, Machine Learning, Machine Vision
  • IP Rating :
  • Rugged :
  • System Type :
  • Wide Temp :

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