Rugged Industrial Computers | Box PCs

Showing 41–57 of 57 results

  • CB103 1

    Kingdy Intel 11th Gen Rugged Fanless Box PC

    • Product Name: Kingdy Intel 11th Gen Rugged Fanless Box PC
    • System Type: Fanless Box PC
    • CPU: 11th Gen Intel Core Celeron 6305E i3 1115G4E / i5 1145G7E / i7 1185G7E
    • RAM: 2 x 260-pin DDR4 3200MHz SODIMM up to 64 GB
    • Expansion: 1 x M.2 M Key, 1 x M.2 B Key, 1 x M.2 E key
    • Other features: 4 x USB 3.2, 2 x USB 2.0, 4 x RS232 / RS422 / RS485, 2 x GLAN, 1 x HDMI, 1 x DP, GPIO 16 bits, Wall Mount / DIN Rail installation, IIoT gateway, Wide Temperature (optional)
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  • DRPC 240 TGL U 1

    IEI DRPC-240-TGL-U Tiger Lake Fanless DIN-Rail Embedded System

    • Product Name: IEI DRPC-240-TGL-U
    • System Type: Fanless DIN-Rail Embedded System
    • CPU: Supported CPUs: Intel® Celeron® 6305/6305E, i5-1145G7E, i7-1185G7E
    • RAM: 2 x SO-DIMM DDR4 3200 MHz (8 GB pre-installed) (up to 64GB)
    • Expansion: 4 x 2.5GbE ports, supporting PoE (optional), 2 x RS-232 & 2 x RS-422/485 (with 2.5kV isolation)
    • Other features: CE/FCC compliant
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  • HBJC38AZ02 Front

    Jetway HBJC38AZ02 Tiger Lake Rugged Expandable Box PC

    • Product Name: Jetway HBJC38AZ02
    • System Type: Rugged Expandable Box PC
    • CPU: Intel Tiger lake-UP3 11th Gen Processor
    • RAM: 3,200 MHz DDR4
    • Expansion: Supports up to 10 x COM, 10 x LAN, 12 x USB or 32bit GPIO
    • Other features: Fanless, Rugged and Cable-less Design, Triple Independent Display Support, Operating Temperature: -20 ~ 50°C, 12-24V DC-in power supply
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  • IEP 5000G 1

    ASRock Industrial iEP-5000G Elkhart Lake Rugged IoT Controller

    • Product Name: Asrock iEP-5000G
    • System Type: Rugged Industrial IoT Controller
    • CPU: Latest and Powerful Intel Atom x6000E Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
    • Expansion: Most Flexible IOs and Expansion for Industrial Applications
    • Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
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  • IEP 5000G 1

    ASRock Industrial iEP-5002G Elkhart Lake Rugged IoT Controller

    • Product Name: Asrock iEP-5002G
    • System Type: Rugged Industrial IoT Controller
    • CPU: Latest and Powerful Intel Atom x6000E Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
    • Expansion: Most Flexible IOs and Expansion for Industrial Applications
    • Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
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  • ED700 EHL side

    DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System

    • Product Name: DFI ED700-EHL
    • System Type: Elkhart Lake 5G Fanless Embedded System
    • CPU: Intel Atom Processors X Series
    • RAM: One 260 pin DDR4 SODIMM up to 3200MHz
    • Expansion: Support 5G Sub-6 module, Support WiFi 6 module, Support Isolated COM & DIO
    • Other features: 4 LAN: Support 1 x 2.5GbE TSN, 3 x GbE LAN, Wide Operating Temperature: Support up to -40 ~ 70°C, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
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  • N11 Front45D

    Jetway N11 Series 11th Gen Tiger Lake NUC PC

    • Product Name: Jetway N11 Series
    • System Type: 11th Gen Tiger Lake NUC PC
    • CPU: Intel 11th Gen Tiger Lake-UP3 SoC Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM up to 64GB
    • Expansion: 1 x M.2 M-key 2242/2280 PCIe4.0 x4/SATAIII interface for NVMe functionality, 1 x  2.5” SATA drive bay, 3 x internal M.2 expansion slots for various applications
    • Other features: 1 x Intel i219-LM GbE, 1 x Intel i225-V 2.5GbE, 2 x HDMI 2.0b, 2 x DP1.4, Rich and complete connection interface, supports 4 sets of 4K HDR output, Supports Windows 11 and Linux
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  • EC70A TGU 5

    DFI EC70A-TGU Tiger Lake Fanless Embedded System

    • Product Name: DFI EC70A-TGU
    • System Type: Tiger Lake Fanless Embedded System
    • CPU: 11th Gen Intel Core i7/i5/i3 Processors
    • RAM: On board memory 8GB and 1 SO-DIMM DDR4
    • Expansion: Support M.2 B key 3042/3052 5G-NR module
    • Other features: Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz), Up to 4 LAN or 6 USB, 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)
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  • HBFDF05 Front45D com

    Jetway HBFDF05 Series Tiger Lake Embedded Box PC

    • Product Name: Jetway HBFDF05
    • System Type: Tiger Lake Embedded Box PC
    • CPU: Intel® Tiger Lake-UP3 SoC Processor (TDP 15W)
    • RAM: 2* SO-DIMM DDR4-3200MHz up to 64GB
    • Expansion: 2* USB2.0, 4* USB3.2, 2* HDMI, 2* DP, 2* RJ45, 1Audio
    • Other features: Support 4 4K HDR Displays or 1* 8K SDR Displays, DC-12V_60W Adapter
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  • FA30SB3 210 1

    Winmate FA30SB3-210 NXP i.MX6 Dual Core ARM Box PC

    • Product Name: Winmate FA30SB3-210
    • System Type: Dual Core ARM Box PC
    • CPU: NXP i.MX6 Dual Core, 1GHz (Optional Quad Core)
    • RAM: Up to 2 GB LPDDR3
    • Expansion: 16GB eMMC
    • Other features: 1 x RS-232/422/485, 1 x CANBus, 1 x USB A-Type, 1 x RJ45 (Optional PoE), Micro HDMI, Optional DIDO
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  • DRPC 330 A7K 1

    IEI DRPC-330 Marvell ARMADA Fanless DIN-Rail Embedded System

    • Product Name: IEI DRPC-330
    • System Type: Marvell ARMADA Fanless DIN-Rail Embedded System
    • CPU: Marvell® ARMADA® 88F7040
    • RAM: 1 x On-board DDR4 2400 (4GB pre-installed)
    • Expansion: Multiple expansion slots
    • Other features: Supporting 10GbE SFP+, Multiple COM Ports with isolation, Wide power input 9~36V
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  • PALM 3A100DW R 1

    LEX PALM-3A100DW-R AMD Ryzen Embedded Computer

    • Product Name: Lex PALM-3A100DW-R
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded R1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 1 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 1 x M.2
    • Other features: With Independent Three 4K Display
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  • PALM 3A100DW V 1

    LEX PALM-3A100DW-V AMD Ryzen Embedded Computer

    • Product Name: Lex PALM-3A100DW-V
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded V1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2
    • Other features: With Independent Four 4K Display
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  • APOLLO RS 3I370DW 1

    LEX APOLLO-RS 3I370DW 8th/9th Gen Fanless Embedded Computer

    • Product Name: Lex APOLLO-RS 3I370DW
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: DIO (optional), 1 x M.2 B Key, 1 x Mini PCIe, 2 x PCIe slot
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1, 2~4 x COM
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  • APOLLO S 3I370DW 1

    LEX APOLLO-S 3I370DW 8th/9th Gen Fanless Embedded Computer

    • Product Name: Lex APOLLO-S 3I370DW
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: DIO (optional), 1 x M.2 B Key, 1 x Mini PCIe
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1, 2~4 x COM
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  • TINOL CI370D 1

    LEX TINO CI370D 8th/9th Gen Fanless Embedded Computer

    • Product Name: Lex TINO CI370D
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: 1 x M.2 B Key, 2 x SIM, 2 x Mini PCIe
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 9 x Intel GbE LAN, 2 x SFP Fiber, 4 x USB 3.1, 2 x COM
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  • EC500 CSSide200824 w600

    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC500-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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