LEX PALM-3A100DW-V AMD Ryzen Embedded Computer

  • Product Name: Lex PALM-3A100DW-V
  • System Type: AMD Ryzen Embedded Computer
  • CPU: AMD Ryzen Embedded V1000 Series SoC
  • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
  • Expansion: 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2
  • Other features: With Independent Four 4K Display

Description

The Lex PALM-3A100DW-V is a high-performance AMD Ryzen Embedded industrial computer engineered for advanced edge computing and multi-display applications. Powered by the AMD Ryzen Embedded V1000 Series SoC, it delivers strong CPU and GPU performance with excellent efficiency for demanding industrial workloads.

It supports up to 32GB of DDR4 2400MHz memory via two SODIMM slots and provides extensive expansion options, including dual M.2 slots, Mini PCIe, and dual SIM support for flexible wireless connectivity. The system offers rich I/O with four independent 4K display outputs via HDMI and DisplayPort, three Gigabit Ethernet ports, USB interfaces, COM ports, and 8DI/8DO for industrial automation and control. With its rugged embedded design and powerful multi-display capability, the Lex PALM-3A100DW-V is ideal for smart manufacturing, control systems, and high-end edge visualization applications.

Key Features

  • AMD Ryzen Embedded V1000 Series SoC With Independent Four 4K Display
  • 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO
  • 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2

PALM-3A100DW-V Specification

MODEL PALM-3A100DW-V
Motherboard 3A100DW-V
System Dimension(WxDxH) 180W x 150D x 70H mm
Weight(Incl.M/B) 1.35 kg
Mounting Wall Mount *
CPU AMD® Ryzen™ Embedded V1000 Series SoC
V1807B 3.35 GHz up to 3.8 GHz (Quad Core), TDP 35-54 Watt
V1605B 2.0 GHz up to 3.6 GHz (Quad Core), TDP12-25 Watt
Chipset AMD® Ryzen™ Embedded V1000 Series SoC
Memory 2 x DDR4 2400 MHz SODIMM, Max. 32GB
(V1878B CPU supports single bank 3200 MHz memory)
Storage 2 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s), optional to 2 x mSATA
Expansion slots 1 x M.2 M Key, Type 2280 (PCIe x 4), Support NVMe
1 x M.2 B Key, Type 3042 (PCIe / mSATA / USB)
1 x mini card socket (PCIe / mSATA / USB)
1 x Nano SIM, 1 x SIM
I/O ports Network 3 x Intel GbE
USB 2 x USB 3.0, 2 x USB 2.0
Serial ports 2 x RS232 / 422 / 485
Display 2 x DP, 2 x HDMI
Audio Line-out, Mic-in
GPIO &SIM DI / DO (Option)
Optional Modules
& Accessory
GPS, Bluetooth, PoE, WiFi, 4G LTE, Isolated COM, battery UPS, Video Input, *SATA Kit, Wall Mount Kit
Power DC input : +12V~24V
AC input : External adapter 100 / 240V
Operating Temp.
(100 % CPU usage)
-20°C to +60°C with mSATA / SSD
0°C to +50°C with HDD
Storage Temp. -20°C to +70°C
Relative Humidity 95% @ 40°C, non-condensing
Certification CE / FCC class A
OS Support Windows® 10 IOT (64bit), Ubuntu 18.04.2 above, Fedora 29 above

LEX System Ryzen Embedded Computers

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

Build to Order Banner

Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs, Panel PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Android image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images
  • Custom BIOS

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.