Wincomm WLPM-V24 24″ AMD Ryzen Modular Industrial Panel PC

  • Product Name: Wincomm WLPM-V24
  • Screen Size: 24″
  • CPU: AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W
  • RAM: Dual Channel DDR4 2400 MHz (V1605B/ V1202B), 32 GB
  • Expansion: Optional Expansion Slot PCIex8
  • Other features: Modular Design with Panel Size 23.8”, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed

Description

  • AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W
  • Modular Design with Panel Size 23.8”
  • Front IP66 Waterproof and Dustproof, Panel Mount
  • Fanless with Smart Thermal Control
  • Full Flat Design with Resistive or P-cap Touch
  • CE, FCC, VCCI Class B Passed
  • Optional Expansion Slot PCIex8

Specification

Model WLPM-V24
Main System
CPU / Chipset AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W / SoC
Graphic AMD Radeon™ Vega 8 Graphics
RAM Dual Channel DDR4 2400 MHz (V1605B/ V1202B) , 32 GB
OS Support Win 10 (64 bit)
Storage 1 x 2.5” SATA SSD
1 x M.2 M.Key 2242/2260/2280 PCIex2 and SATA for SSD
Expansion 1 x M.2 Key E 2230 w/ PCIex1, share USB2.0 for Wireless
1  x mini-PCIe for Full/Half w/ PCIex1
1 x PCIex8 (25W max.)
Display Size 23.8” 16:9
Display 1920 x 1080 (FHD),  178(H) / 178(V), 250 nits (Typ. Center point), CR: 3000 : 1 (Typ)
Touch Screen Full Flat Projective Capacitive Touch Panel / Light Transmission: >=85% / Hardness: >=7H pencil / Life: 100M times
I.O. Ports
USB 2 x USB 3.2 GenII, 2 x USB 2.0    
COM 2 x RS232/RS422/RS485    
LAN 2 x RJ-45    
Audio 2 x 3.5mm phone jack connector (Line-out,  Mic-in)    
Video 3 x DP1.2a    
Control Keys Rear bottom: Power on/off
Mechanical and Environmental
Cooling Fanless
Power Input 1 x DC-in(Jack with locker), DC19V~28V
Power Adapter 150W (PSU with PSE)
Temperature Operating Temperature: 19V DC Input 0~50℃ (air flow cooling)
Storage Temperature: -20~60℃
Humidity Operating & Storage:10% ~ 90%, non-condensing
IP & IK Rating / Housing IP66 at front, IK05 / Front bezel is Aluminum, others are SECC with black coating
Dimensions (Net) 653.7 mm (H) x 412 mm (V) x 121.4 mm (T)
Weights (Net) TBD kg (w/o power adapter)
Mounting Panel mount (by clamp), VESA (75×75)
Certification FCC/CE/VCCI Class B

Ordering Information

Item Touch Description
WLPM-V22-MBKFT Full Flat Resis. touch 21.5” V1605B, QC, 2GHz/ DDR4 4G RAM/ 128G SSD/ Fanless
WLPM-V22-MBKPT Full Flat P-cap. touch 21.5” V1605B, QC, 2GHz/ DDR4 4G RAM/ 128G SSD/ Fanless
WLPM-V24-MBKPT Full Flat P-cap. touch 23.8” V1605B, QC, 2GHz/ DDR4 4G RAM/ 128G SSD/ Fanless

 

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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