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DFI GH9A3 AMD Ryzen R1000 Series COM Express Mini

  • Product Name: DFI GH9A3
  • Module Form Factor: COM Express Mini
  • CPU: AMD Ryzen R1000 Series Processor
  • RAM: Single Channel LPDDR4 2400MHz; Memory Down up to 8GB
  • Expansion: Multiple expansions: 3 PCIe x1
  • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP); Supports dual displays: DDI + LVDS/eDP; Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)
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Description

  • AMD® Ryzen™ R1000 Series Processor
  • Single Channel LPDDR4 2400MHz；Memory Down up to 8GB
  • 1 LVDS/eDP, 1 DDI (HDMI/DP)；Supports dual displays: DDI + LVDS/eDP
  • Multiple expansions: 3 PCIe x1
  • Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0
  • 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)

 

GH9A3 Specification

System
 
Processor
AMD® Ryzen™ Embedded R1606G, Dual Core, 1MB Cache, 3 CU, 2.6GHz (3.5GHz), 12W
AMD® Ryzen™ Embedded R1505G, Dual Core, 1MB Cache, 3 CU, 2.4GHz (3.3GHz), 12W
AMD® Ryzen™ Embedded R1000 series
Memory
4GB/8GB Memory Down
Single Channel LPDDR4 2400MHz
BIOS
SPI 64Mbit (default supports fTPM2.0)
Graphics
 
Controller
Radeon™ Vega 3 Graphics
Feature
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
Display
1 x DDI (HDMI/DP++)
1 x LVDS/eDP
LVDS: single channel 24-bit, resolution up to 1366×768 @ 60Hz
HDMI: resolution up to 4096×2160 @ 24Hz
DP++: resolution up to 3840×2160 @ 60Hz
eDP: resolution up to 3840×2160 @ 60Hz
Dual Displays
DDI + LVDS
DDI + eDP
Expansion
 
Interface
3 x PCIe x1 (Gen 3)
1 x SDIO
1 x LPC
2 x I2C
1 x SMBus
1 x SPI
2 x UART (TX/RX)
Audio
 
Interface
HD Audio
Ethernet
 
Controller
1 x Intel® I210 (10/100/1000Mbps)
I/O
 
USB
2 x USB 3.1
8 x USB 2.0
SATA
2 x SATA 3.0 (up to 6Gb/s)
GPIO
1 x 8-bit GPIO
Watchdog Timer
 
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
 
TPM
BIOS default support FTPM, TPM2.0 by request.
Power
 
Type
12V~20V, 5VSB, VCC_RTC (ATX mode)
12V~20V, VCC_RTC (AT mode)
Consumption
TBD
OS Support
 
OS Support (UEFI Only)
Windows 10 IoT Enterprise 64-bit
Linux
Environment
 
Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
 
Dimensions
COM Express® Mini
84mm (3.30″) x 55mm (2.16″)
Compliance
PICMG COM Express® R3.0, Type 10
Country of Origin
 
Country of Origin
Taiwan

Datasheet

Download(778 KB)

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If you’re unable to find an off-the-shelf carrier board that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing carrier board to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the carrier board not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

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BVM has been designing custom carrier boards and embedded electronics for over 30 years, delivering reliable solutions from concept through to production. Our experience spans legacy 16-bit systems to today’s high-speed PCIe, x86, and ARM-based platforms. Whether you’re developing with COM Express, SMARC, Qseven, OSM, NVIDIA Jetson, Raspberry Pi, BeagleBone, Arduino, or another embedded platform, we can design a custom carrier board tailored to your application and ready for long-term deployment.

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