AAEON BOXER-6643-TGU 11th Gen Fanless Computer

  • Product Name: AAEON BOXER-6643-TGU
  • System Type: Intel 11th Gen Fanless Computer
  • CPU: Intel SoC Processor
  • RAM: DDR4 slot x2, up to 64GB
  • Expansion: M.2 2280 for NVMe storage, M.2 3052 B Key for 5G module
  • Other features: TPM 2.0 onboard, 1x GbE LAN, 1x 2.5GbE LAN, Wide Range 9-36V DC input, -20~60°C Operating Temperature

Description

The AAEON BOXER-6643-TGU is an Intel 11th Gen fanless industrial computer powered by an Intel® SoC processor. It features up to 64GB DDR4 RAM, supports high-speed NVMe storage, and offers multiple expansion options including M.2 2280 and M.2 3052 B Key for 5G. With TPM 2.0 onboard, dual Ethernet ports, and a wide operating temperature range of -20°C to 60°C, this rugged device is designed for demanding industrial applications.

Key Features

  • Extreme Computing Power with Intel® SoC Processor
  • DDR4 slot x2, up to 64GB
  • TPM 2.0 onboard
  • Support High Speed NVMe storage (M.2 2280)
  • GbE LAN x 1 (Intel I219) + 2.5GbE LAN x 1 (Intel I225)
  • Supports M.2 3052 B Key for 5G module
  • Wide Range 9-36V DC input
  • Wide Range -20~60 °C Operating Temperature

Specification

Feature Details
CPU Intel® Core™ i7-1185G7E, Intel® Core™ i5-1145G7E, Intel® Core™ i3-1115G4E
Chipset Intel® SoC
System Memory DDR4 3200MHz SO-DIMM x 2, max 64GB
Display Interface HDMI 2.0 x 2
Storage Device M.2 2280 M Key NVMe Slot x1 (PCIex4), 2.5″ SATA Drive Bay x1
Ethernet RJ-45 x 2 for 1G/2.5GbE LAN (i219x1, i225x1)
I/O HDMI 2.0 x 2, RJ-45 x 2 for 1G/2.5GbE LAN, USB Type-A x3 for USB3.2 Gen2, USB Type-A x1 for USB 2.0, DB-9 x2 for RS-232/422/485, DB15 x1 for DIO 8-channel
Expansion M.2 3052 B Key x 1 (for 5G module), Full-Size Minicard x1 (PCIe + USB / SATA), SIM Slot x 1
OS Support Windows® 10 IoT 64-bit, Windows 10 Pro, Linux Ubuntu 20.04.2
Power Requirement DC-in 9-36V x1 for 3-pin Terminal Block
Mounting Wallmount
Dimensions 9.84” x 5.62” x 2.03” (250 x 143 x 51.5) with bracket, 7.87” x 5.62” x 1.75” (200 x 143 x 44.5) without bracket
Gross Weight 4.4 lb (2.0 kg)
Net Weight 3.3 lb (1.5 kg)
Operating Temperature -4°F ~ 140°F (-20°C ~ 60°C), according to IEC68-2 with 0.5 m/s AirFlow (w/ Industrial wide Temp. SSD/RAM)
Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C)
Storage Humidity 5 ~ 95% @ 40°C, non-condensing
Anti-Vibration 3 Grms/ 5 ~ 500Hz/ operation (with SSD)
Anti-Shock 50G, IEC 68-2-27, half sine, 11 ms duration (with SSD)
Certification CE/FCC class A

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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