The AAEON BOXER-6643-TGU is an Intel 11th Gen fanless industrial computer powered by an Intel® SoC processor. It features up to 64GB DDR4 RAM, supports high-speed NVMe storage, and offers multiple expansion options including M.2 2280 and M.2 3052 B Key for 5G. With TPM 2.0 onboard, dual Ethernet ports, and a wide operating temperature range of -20°C to 60°C, this rugged device is designed for demanding industrial applications.
Key Features
Extreme Computing Power with Intel® SoC Processor
DDR4 slot x2, up to 64GB
TPM 2.0 onboard
Support High Speed NVMe storage (M.2 2280)
GbE LAN x 1 (Intel I219) + 2.5GbE LAN x 1 (Intel I225)
M.2 2280 M Key NVMe Slot x1 (PCIex4), 2.5″ SATA Drive Bay x1
Ethernet
RJ-45 x 2 for 1G/2.5GbE LAN (i219x1, i225x1)
I/O
HDMI 2.0 x 2, RJ-45 x 2 for 1G/2.5GbE LAN, USB Type-A x3 for USB3.2 Gen2, USB Type-A x1 for USB 2.0, DB-9 x2 for RS-232/422/485, DB15 x1 for DIO 8-channel
Expansion
M.2 3052 B Key x 1 (for 5G module), Full-Size Minicard x1 (PCIe + USB / SATA), SIM Slot x 1
OS Support
Windows® 10 IoT 64-bit, Windows 10 Pro, Linux Ubuntu 20.04.2
Power Requirement
DC-in 9-36V x1 for 3-pin Terminal Block
Mounting
Wallmount
Dimensions
9.84” x 5.62” x 2.03” (250 x 143 x 51.5) with bracket, 7.87” x 5.62” x 1.75” (200 x 143 x 44.5) without bracket
Gross Weight
4.4 lb (2.0 kg)
Net Weight
3.3 lb (1.5 kg)
Operating Temperature
-4°F ~ 140°F (-20°C ~ 60°C), according to IEC68-2 with 0.5 m/s AirFlow (w/ Industrial wide Temp. SSD/RAM)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
Storage Humidity
5 ~ 95% @ 40°C, non-condensing
Anti-Vibration
3 Grms/ 5 ~ 500Hz/ operation (with SSD)
Anti-Shock
50G, IEC 68-2-27, half sine, 11 ms duration (with SSD)
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.
Porting, customized OS development, and mass-deployment services.
Windows, Linux & Android Image Capture
Custom Golden Master Image Creation
Mass OS Deployment Services
Custom BIOS & Firmware Configuration
OS Lifecycle & Update Management
Driver Integration & Compatibility Validation
ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
Testing
Materials Management
Logistics and Tracking
External Manufacturing
• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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