DFI TWLF51 1.8″ Intel N Series Industrial Pi SBC

  • DFI TWLF51: Compact 1.8″ SBC
  • Form Factor: Ultra-small 1.8″ SBC ideal for embedded and edge deployments
  • CPU:Intel Atom X Series and Intel N Series processors (Amston Lake / Twin Lake)
  • RAM: Onboard single-channel LPDDR5 memory with up to 8GB capacity
  • Expansion: 1 x M.2 E Key slot with optional I2C/SMBus support
  • Other Features: HDMI 2.0 supporting up to 4K @ 60Hz, 1 x Intel GbE LAN, 1 x COM, 2 x USB 3.2 Gen 2, 2 x USB 2.0, Micro HDMI, and DIO support

Description

The DFI TWLF51 is a compact and highly efficient 1.8″ industrial single board computer, purpose-built for embedded and space-constrained applications. Designed around Intel’s latest Atom X Series and N Series processors (Amston Lake / Twin Lake), it delivers reliable performance and power efficiency for edge computing, automation, and IoT deployments. With its ultra-small 1.8″ form factor, the TWLF51 is ideal for integration into systems where space is at a premium, without compromising on functionality. It features onboard LPDDR5 memory with up to 8GB capacity, providing fast data processing and improved system responsiveness for demanding embedded workloads.

Despite its size, the board offers flexible expansion via an M.2 E Key slot, with optional I2C/SMBus support, enabling easy integration of wireless modules and additional functionality. A rich selection of I/O interfaces ensures seamless connectivity, including Intel Gigabit Ethernet, multiple USB ports, COM support, and digital I/O for industrial control applications. For display capabilities, the TWLF51 includes HDMI 2.0 with support for resolutions up to 4K at 60Hz, making it suitable for high-quality visual output in applications such as digital signage, HMI systems, and monitoring solutions.

Combining compact design, modern connectivity, and reliable performance, the DFI TWLF51 is an excellent solution for developers and system integrators building next-generation embedded and industrial systems.

Key Features

  • Intel Atom Processor X Series / N Series (Code Name : Amston Lake/Twin Lake)
  • Small form factor 1.8″ SBC for space-limited applications
  • Single Channel LPDDR5 memory down up to 8GB
  • HDMI 2.0 resolution supports up to 4096×2160 @ 60Hz
  • Expansions: 1 M.2 E key, 1 I2C/SMBus (Opt.)
  • Rich I/O: 1 Intel GbE, 1 COM, 2 USB 3.2 Gen 2, 2 USB 2.0, 1 Micro HDMI, 1 DIO

Specification

Category Specification
System  
Processor Intel® Processor N Series (Twin Lake): N355 (8C, 1.8–3.9GHz, 15W), N150 (4C, 1.0–3.6GHz, 6W); Intel Atom® X Series (Amston Lake): x7835RE (8C, 1.3–3.6GHz, 12W), x7433RE (4C, 1.5–3.4GHz, 9W), x7211RE (2C, 1.0–3.2GHz, 6W)
Memory LPDDR5 onboard up to 8GB, single-channel 4800MHz
BIOS AMI SPI 256Mbit
Graphics  
Controller Intel® UHD Graphics
Features OpenGL 4.6, DirectX 12.1, OpenCL 3.0; HW Decode: HEVC, VP9, AV1, AVC; HW Encode: HEVC, VP9, AVC
Display 1 x Micro HDMI, HDMI 2.0 up to 4096×2160 @ 60Hz
Storage  
eMMC Default 64GB, up to 128GB
Expansion  
Interface 1 x M.2 E Key 2230 (PCIe Gen3 x1 / USB 2.0)
Ethernet  
Controller 1 x Intel® i210IT (10/100/1000Mbps)
Rear I/O  
Ethernet 1 x GbE (RJ-45)
USB 2 x USB 3.2 Gen2 (Type-A, 10Gbps)
Display 1 x Micro HDMI (HDMI 2.0)
Internal I/O  
DIO 1 x 8-bit DIO
I2C I2C/SMBus (Optional)
Watchdog Timer  
Output & Interval Software reset, programmable from 1 to 655,535 seconds
Security  
TPM dTPM 2.0
Power  
Type Single 12V ±5% DC
Connector 2-pin terminal block
Consumption Typical: 4.68W; Max: 39.96W (x7835RE with cooler)
RTC Battery CR2032 coin cell
OS Support  
Microsoft Windows 11 IoT Enterprise
Linux Linux
Environment  
Temperature Operating: -5 to 65°C / -20 to 70°C; Storage: -40 to 85°C
Humidity Operating: 5–90% RH; Storage: 5–90% RH
MTBF Up to 693,447 hrs @ 25°C (Telcordia Issue 4, GB/GC)
Mechanism  
Dimensions 84mm x 55mm (1.8″ SBC form factor)
Height PCB: 1.60mm; Top: 16.35mm; Bottom: 4.00mm
Certifications CE, FCC, RoHS, UKCA
Packing List 1 x TWLF51 board; Cooler (-20 to 70°C) or Heatsink (-5 to 65°C)
Country of Origin Taiwan

Ordering Information

Model Name Part Number Description
TWLF51-BT-86N35 770-TWLF511-000G Intel® Core™ 3 N355, 8C, 15W, 8GB LPDDR5, 64GB eMMC, Micro HDMI, 1 GbE, 1 RS-232/422/485, 2 USB 3.2 Gen2, 2 USB 2.0, 12V DC, Fanless, -5~65°C
TWLF51-BT-86N15 770-TWLF511-100G Intel® N150, 4C, 6W, 8GB LPDDR5, 64GB eMMC, Micro HDMI, 1 GbE, 1 RS-232/422/485, 2 USB 3.2 Gen2, 2 USB 2.0, 12V DC, Fanless, -5~65°C
TWLF51-ET-86X78 770-TWLF511-200G Intel Atom® x7835RE, 8C, 12W, 8GB LPDDR5, 64GB eMMC, Micro HDMI, 1 GbE, 1 RS-232/422/485, 2 USB 3.2 Gen2, 2 USB 2.0, 12V DC, Fanless, -20~70°C
TWLF51-ET-86X74 770-TWLF511-300G Intel Atom® x7433RE, 4C, 9W, 8GB LPDDR5, 64GB eMMC, Micro HDMI, 1 GbE, 1 RS-232/422/485, 2 USB 3.2 Gen2, 2 USB 2.0, 12V DC, Fanless, -20~70°C
TWLF51-ET-86X72 770-TWLF511-400G Intel Atom® x7211RE, 2C, 6W, 8GB LPDDR5, 64GB eMMC, Micro HDMI, 1 GbE, 1 RS-232/422/485, 2 USB 3.2 Gen2, 2 USB 2.0, 12V DC, Fanless, -20~70°C

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

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Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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