Other features: 1 LVDS/eDP, 1 VGA, 3 DDI (HDMI/DP++); Rich I/O: 1 Intel GbE, 4 USB 3.2, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 38 (Based on Intel IOTG Roadmap)
This product has multiple variants. The options may be chosen on the product page
Expansion: 1 PCIe x16, 1 M.2 M key, 1 M.2 E Key, 1 M.2 A Key
Other features: Quad Display Support: 1 DP++ + 1 HDMI + 1 VGA + M2A Display (eDP/LVDS/VGA/HDMI), Supports 4K resolution, Rich I/O Connectivity: 2 Intel 2.5GbE LAN ports, 2 COM ports, up to 6 USB 3.2 Gen2 ports, 2 USB2.0 headers, Longevity Support: Typically supports a 10-Year CPU Life Cycle Until Q1’ 38 (Based on Intel IOTG Roadmap).
This product has multiple variants. The options may be chosen on the product page
Expansion: 1 PCIe x16, 1 M.2 E Key, 1 M.2 M Key, 1 M.2 B Key
Other features: Supports 4 Independent Displays: 1 DP++, 1 HDMI, 1 USB Type C, 1 LVDS/eDP, 1 DFI Display Extension Port (DP/HDMI/VGA available), Supports up to 4K resolution, Rich I/O Connectivity: 2 Intel 2.5GbE LAN ports, 2 COM ports, 6 USB 3.2 Gen2 ports, 4 USB 2.0 ports, 2 SATA 3.0 ports, Longevity Support: Typically supports a 10-Year CPU Life Cycle Until Q1’38 (Based on Intel IOTG Roadmap).
This product has multiple variants. The options may be chosen on the product page
Other features: Quad Displays: eDP + 3 DDI; DDI supports up to 8K; Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0; Typically supports 10-Year CPU Life Cycle Until Q1’ 38
This product has multiple variants. The options may be chosen on the product page
Other Features: Dual 2.5GbE ports, USB 3.2 Gen 2, Onboard TPM 2.0, 9 ~ 36V DC input, -20°C ~ 70°C wide temperature range, optional Hailo-8 AI Accelerator support
This product has multiple variants. The options may be chosen on the product page
CPU: Intel 14th/13th/12th Gen LGA1700 Socket Processor (Max. 125W TDP)
RAM: 2 x DDR5 4800MHz UDIMM, up to 64GB
Expansion: 1 x PCI-Ex16 (Gen.4), 2 x PCI-Ex4 (Gen.3), 4 x PCI, 1 x M.2 M-key (2280, NVMe, PCI-Ex2 Interface for H6100; PCI-Ex2/PCI-Ex4 Interface for B7600), 1 x M.2 E-key (2230, CNVi Interface for H6100; CNVi/PCI-Ex1 Interface for B7600)
Other features: 1 x VGA, 1 x HDMI, 1 x DP, 1 x LVDS/EDP (Option), 1 x 2.5GbE, 1 x GbE, 6 x COM, 4 x USB 3.2 Gen.1 (H6100), 6 x USB 3.2 Gen.1 (B7600), 6 x USB 2.0, 2 x USB 2.0 Type-A (Vertical), Onboard TPM2.0 (Option), ATX Power
This product has multiple variants. The options may be chosen on the product page
CPU: Intel 12/13th Gen LGA1700 Socket (Max. 125W TDP)
RAM: 2 x DDR4 3200MHz UDIMM, up to 64GB
Expansion: 1 x M.2 M-key (2242/2280, PCI-Ex4), 1 x M.2 M-key (2242/2280, SATA), 1 x M.2 B-key (3042/3052), 1 x M.2 E-key (2230), 4 x SATAIII, 1 x PCI-Ex16 (Gen.4), 1 x PCI-Ex4 (Gen.3), 2 x PCI
Other features: 1 x VGA, 1 x HDMI, 1 x DP, 2 x 2.5GbE, 1 x GbE, 10 or 6 x COM, 3 x USB 3.2 (Gen.1), 7 x USB 2.0, 1 x USB 2.0 Type-A (Vertical), Onboard TPM2.0 (Option), ATX Power
This product has multiple variants. The options may be chosen on the product page
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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