This guide details selecting industrial motherboards and SBC form factors, emphasizing reliability, I/O requirements, environmental resilience, and application-specific constraints for optimal system design.
Generative AI and LLMs are set to enhance embedded systems, transforming them into smart, adaptive devices while addressing challenges in resource constraints, power consumption, and real-time needs.
AI is transforming DNA sequencing, enhancing speed and accuracy. GPUs are preferred for AI applications due to their efficiency in processing genetic data compared to CPUs.
Time-Sensitive Networking (TSN) enhances Ethernet for real-time communication, offering benefits like determinism and interoperability across industries.
Intel’s upcoming Bartlett Lake processors, launching in 2025, promise significant performance enhancements and cost-effective upgrades, featuring both P-core only and hybrid models compatible with LGA1700 socket.
Microsoft has announced Windows 10’s end-of-life dates, emphasizing the need for users and businesses to upgrade to Windows 11 or plan for IoT device transitions to maintain security and compliance.
Designing military-grade PCBs involves overcoming challenges like harsh environments, compliance with strict standards, EMI protection, security risks, and long-term component availability, requiring specialized engineering expertise.
MIL-STD-810 is a U.S. military standard ensuring equipment durability under extreme conditions. The updated MIL-STD-810H offers superior testing protocols compared to 810G, vital for rugged PCs across various industries.
ATEX and C1D2 are safety certification standards for industrial computers used in hazardous environments. ATEX applies in Europe, while C1D2 is relevant in North America, each with distinct classification systems.
USB4 and Thunderbolt 4 are advanced connectivity standards essential for industrial applications, offering up to 40 Gbps data transfer. Thunderbolt excels in low latency, while USB4 provides broader compatibility and flexibility.
Discover the different types of AI accelerators – CPUs, GPUs, and NPUs – and learn how they can enhance performance and efficiency in industrial and embedded computing environments.
Unlock unrivaled performance with Intel Arrow Lake processors. Discover how these processors combine advanced architecture and graphics capabilities for demanding applications.
Unlock the possibilities of MXM GPU modules for Edge AI computing. Discover how these compact interfaces revolutionize graphics and computational power in embedded systems.
Discover the power of Intel’s Luna Lake series processors of mobile computing. Experience enhanced speed and optimized power consumption for seamless performance.
Additive vs subtractive manufacturing: understand the differences and choose the right approach for your projects. Discover the benefits and limitations of both methods.