Computer-On-Modules
Computer-On-Module (COM/SOM modules) are ideal for applications where product time to market and longevity are critical to your business. Today’s COM modules mainly come in two main formats; COM Express (COMe) in Mini, Compact, Basic and Qseven.
Plugged into carrier boards, they can be upgraded to newer, backwards-compatible versions as processor technology capability progresses. COM/SOM modules are typically used in Industrial, military, aerospace, gaming, medical and transportation.
• Why use a Computer-on-module? What are the Benefits?
• COM Express vs Qseven vs SMARC: A Comparison of Modular Embedded Computing Standards
• An Introduction to COM-HPC
Showing all 3 results
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ASRock Industrial COM-1001 Elkhart Lake COM Express Mini
- Product Name: ASRock Industrial COM-1001
- Motherboard Form Factor: COM Express Module
- CPU: Intel® Elkhart Lake SoC Processors
- RAM: 4 x 4GB IBECC onboard LPDDR4/4x 3200 MHz
- Expansion: 4 x PCIe x1 (Gen3), 2 x USB 3.2 Gen2, 8 x USB 2.0, 2 x UART, 2 x SATA3
- Other features: 1 x Intel 2.5 Gigabit LAN, Supports Dual Display, 2 x DDI, 1 x eDP, 1 x DP or HDMI, TPM 2.0 onboard IC (optional), ATX: 12V±5%/5Vsb±5%, AT: 9~20V±5%
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DFI EHL700 Intel Elkhart Lake Celeron / Atom Qseven
- Product Name: DFI EHL700
- Motherboard Form Factor: Intel Elkhart Lake Celeron / Atom Qseven
- CPU: Intel Elkhart Lake Celeron / Atom
- RAM: 4GB/8GB LPDDR4 Single Channel Memory Down
- Expansion: Multiple expansions: 4 PCIe x1
- Other features: 1 DDI*, 1 LVDS*/eDP, DP++ resolution supports up to 4096×2160 @ 60Hz, Rich I/O: 1 Intel GbE, 3 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
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DFI EHL9A2 Intel Elkhart Lake COM Express Mini
- Product Name: DFI EHL9A2
- Motherboard Form Factor: COM Express Mini – COM Express Type 10
- CPU: Intel® Atom® Processor Elkhart Lake Series
- RAM: Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
- Expansion: Multiple expansions: 4 PCIe x1
- Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP++); Supports dual displays: DDI + LVDS/eDP, Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap).