BVM Newsletters:
Showcasing the Latest Rugged, Industrial and Embedded Innovations
BVM’s newsletters don’t just keep you in the loop – they show off the most advanced cutting-edge IPC hardware sparking revolutions across a range industries.
At BVM, we take great pride in our expertise in designing, manufacturing and distributing cutting-edge rugged, industrial and embedded computing solutions for a multitude of industries and application areas. Our newsletters serve as windows into the innovative services and solutions we offer, tailored to meet the specific needs of every industry we serve.
BVM Newsletters
Rugged, Industrial and Embedded Computing Solutions
Dive into the forefront of industrial and embedded computing with our monthly newsletters, where we unveil the latest industry news and advancements in technology. From Rugged Box PCs, Touchscreen Panel PCs, Motherboards, and SBCs to high-definition TFT displays, industrial PC components and thermal printers, we design and distribute cutting-edge solutions that can be customized to the unique requirements of various industries.
Whether it’s industrial automation, transportation, military or medical sectors, we’re dedicated to providing tailored solutions that drive innovation and efficiency.
BVM News #08: Embedded Computing with ARM and x86 SMARC Modules
Stay updated with the latest industrial and embedded computing advancements. Discover the power and flexibility of SMARC modules for various applications.
Past Editions
- BVM News #01: Celebrating 35 Years of Excellence
- BVM News #02: Revolutionizing Industries with Advanced Computing Solutions
- BVM News #03: Transforming Industries with State-of-the-Art Thermal Printing Solutions
- BVM News #04: Providing Innovation with Cutting-edge Industrial Computing Solutions
- BVM News #05: Advancing Industries with DFI UL Certified Computing Solutions
- BVM News #06: Revolutionizing Thermal Printing with Seiko’s Cutting-Edge Technology
- BVM News #07: Innovating Embedded Computing with Custom Design Solutions
- BVM News #08: Embedded Computing with ARM and x86 SMARC Modules
No matter your area of expertise, our newsletters provide a monthly showcase of BVM’s newest and most exciting IPC hardware. Be part of the front row audience to the unfolding future of technology – subscribe to BVM Newsletters today.
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The Latest BVM News and Press Releases
- Neousys Nuvo-2822: Intel N97 Compact Expansion Box-PC with 2x PCIE and 2x PCI slots
- ASRock Industrial IMB-1244-WV: Mini-ITX Motherboard with Innovative Right-Angle PCIe Slot
- Seiko MP-B21L: 2″ Mobile Thermal Printer with Label Support
- Advantech SOM-C350/R: A COM-HPC Module for Modern Industrial Computing
- Winmate G156AD-SUIT: 15.6” Rugged Control Station Pelicase PC for Robotics and UAV
- ASRock Industrial DSF-A6000: An Embedded Box PC for Modern Business Applications
- Neousys POC-751VTC: Ultra-compact In-Vehicle Computer with 4x PoE+, SocketCAN and mPCIe
- Winmate Edge AI Panel PCs: Discover the Power of Edge AI
- Winmate FM08E: 8″ IP65 Rugged Vehicle Mounted Computer with QWERTY Keyboard
- Advantech SOM-7533 COM Express Mini: Performance and Efficacy in a Compact Module
The BVM Embedded Technology Blog
- UK-Based COM/SOM Carrier Board Design Service: Experience Excellence with BVM
- Integrating an Electronic Device into a Rugged Portable Peli Case with BVM
- BVM Ltd are Proud to Announce Our Partnership With Advantech
- BVM ODM Service: Design, Development and Manufacturing
- BVM Custom Design Services: Crafting Unique Industrial and Embedded Computing Solutions
- BVM Ltd – Celebrating 35 Years of Solution – Provider Excellence !
- BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
- BVM Computing Solutions: Rugged, Industrial and Embedded Systems for OEMs
- BVM Rugged Industrial Peli Case PCs: Built to Your Requirements
- BVM Accelerate Your Product Development with Our Rapid Prototyping Service