AAEON BOXER-6645U-RPL 12/13/14th Gen Fanless Computer

  • Product Name: AAEON BOXER-6645U-RPL
  • System Type: Fanless Computer
  • CPU: 12th/13th/14th Gen Intel Core LGA 1700 Socket with H610E Chipset
  • RAM: Supports up to 64GB DDR5
  • Expansion: Internal 2.5″ SSD Bay x 2, RS-232/422/485 x 2, RS-232 x 4 (Optional)
  • Other Features: HDMI x 2, USB Type-A x 6, GbE LAN x 2, Wide Operating Temperature (-25°C ~ 70°C), 10 ~ 35 VDC Power Input, TPM 2.0 Onboard

Description

The AAEON BOXER-6645U-RPL is a powerful fanless computer designed for industrial and edge computing applications. Supporting 12th, 13th, and 14th Gen Intel Core processors with the H610E chipset, it delivers exceptional performance and flexibility. With dual internal 2.5″ SSD bays, multiple I/O options including HDMI, USB Type-A, and RS-232/422/485 ports, it ensures seamless connectivity. Featuring wide operating temperature support (-25°C ~ 70°C), 10 ~ 35 VDC power input, and onboard TPM 2.0 for security, the BOXER-6645U-RPL is built to perform reliably in demanding environments.

Key Features

  • 12/13/14th Generation Intel Core LGA 1700 Socket-Type
  • Processor with Intel H610E Chipset
  • Wide Operating Temperature (-25°C ~ 70°C)
  • HDMI Output x 2
  • GbE LAN x 2
  • USB Type-A x 6
  • RS-232/422/485 x 2, RS-232 x 4 (Optional)
  • Internal 2.5″ SSD Bay x 2
  • 10 ~ 35 VDC Power Input Range
  • TPM 2.0 Onboard

Specification

Category Specification
CPU 12th/13th/14th Gen Intel® Core™ LGA 1700 socket-type Processor, Max TDP 65W
13th Gen: i9-13900TE/E, i7-13700TE/E, i5-13500TE/E, i3-13100TE/E
14th Gen: i9-14900/T, i7-14700/T, i5-14500/T, i3-14100/T
Chipset Intel® H610E
System Memory DDR5 SODIMM x 2
Max Capacity Up to 64GB
Display Interface HDMI x 2
Display Resolution 4K x 2K @30Hz
2.5″ Drive Bays SATA x 2
M.2 Storage Slot M.2 2280 M-Key x 1 (PCIe Gen 3 [x4] NVMe)
1GbE LAN Intel® I219-LM, RJ-45 x 1
2.5GbE LAN Intel® I226-LM, RJ-45 x 1
USB Ports USB 3.2 Gen 2 x 4, USB 2.0 x 2
Serial Ports DB-9 x 2 for RS-232/422/485
Audio Mic-in / Line-out
Power Controls Power Button with LED x 1
Remote Power On/Off x 1
Expansion – Storage M.2 2280 M-Key x 1
Expansion – Wi-Fi/BT M.2 2230 E-Key x 1
Mini PCIe Slot Full Size MiniPCIe x 1 (optional for mSATA)
Security Onboard TPM 2.0
System Indicators System LED, Storage LED
OS Support – Windows Windows® 10 IoT Enterprise 64-bit, Windows® 11 Pro 64-bit
OS Support – Linux Linux Ubuntu 22.04
Power Requirement 3-pin DC Input, 10~35V
Mounting Wallmount
Dimensions (W x H x D) 7.09″ x 3.04″ x 8.66″ (180mm x 77.2mm x 220mm)
With Brackets: 8.43″ x 3.31″ x 8.66″ (214mm x 84.2mm x 220mm)
Gross Weight 8.59 lb (3.9 kg)
Net Weight 6.39 lb (2.9 kg)
Operating Temp. -13°F ~ 131°F (-25°C ~ 55°C), TDP 65W CPU
Extended Temp. -13°F ~ 158°F (-25°C ~ 70°C), TDP 35W CPU
Storage Temp. -40˚F ~ 176˚F (-40˚C ~ 80˚C)
Storage Humidity 5 ~ 95% @ 40˚C, non-condensing
Anti-Vibration IEC60068-2-64, 3 Grms, 5 ~ 500Hz (with SSD)
Anti-Shock 50G, IEC60068-2-27, half sine, 11ms duration (with SSD)
Certification CE/FCC Class A

AAEON Boxer Fanless Computers

BVM Design and Manufacturing

BVM Customisation Service
Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Embedded Product Design

Turnkey solutions for brand-new concepts or maturing existing prototypes.

System Integration

Adapting and scaling proven hardware platforms to your exact use case.

Embedded Software

Porting, customized OS development, and mass-deployment services.

  • Windows, Linux & Android Image Capture
  • Custom Golden Master Image Creation
  • Mass OS Deployment Services
  • Custom BIOS & Firmware Configuration
  • OS Lifecycle & Update Management
  • Driver Integration & Compatibility Validation

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Click here to find out more.