AAEON BOXER-6649-RAP 13th Gen Fanless Computer

Product Name: AAEON BOXER-6649-RAP
System Type: 13th Gen Fanless Industrial Computer
CPU: Intel Core i3/i5/i7 Processor (28W TDP) with Intel Iris Xe Graphics
RAM: Dual-Channel DDR5 SO-DIMM, up to 96GB
Expansion: Dual HDMI video output, 5 x 2.5G LAN (IEEE 802.3 at PSE x4)
Other Features: Wide 9~36V DC input with protection circuit, wide operating temperature (-25°C ~ 60°C), TPM 2.0 onboard

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SKU: BOXER-6649-RAP Categories: AIoT | Edge AI Computers, ALL INDUSTRIAL AND EMBEDDED COMPUTERS, Fanless Industrial Mini PCs, Rugged Computing Solutions, Rugged Industrial Mini PCs Tags: 2.5GbE, 9~36V, DDR5, Fanless, Intel Raptor Lake, Multi Display - Dual, NVMe, OS: Windows, OS: Windows 11, PoE, Powered by Intel, Rugged, TPM 2.0, Wide Temp Brand: AAEON Technology Inc

Description

The AAEON BOXER-6649-RAP is a high-performance, fanless industrial computer engineered to deliver reliable computing in the most demanding environments. Powered by 13th Gen Intel Core i3, i5, or i7 processors with integrated Intel Iris Xe graphics, this system provides exceptional processing power for industrial automation, edge computing, and embedded applications. Its dual-channel DDR5 SO-DIMM memory support of up to 96GB ensures smooth multitasking and rapid data handling, while dual HDMI outputs allow 4K resolution for advanced visual applications.

Designed for versatility, the BOXER-6649-RAP features five 2.5G LAN ports (IEEE 802.3 at PSE x4) and a wide 9–36V DC input with a protection circuit, making it ideal for complex networked environments. The fanless design ensures silent operation, and a wide operating temperature range of -25°C to 60°C guarantees dependable performance even in harsh conditions. Additional features such as onboard TPM 2.0 provide enhanced hardware-level security, making this system a robust solution for industrial, medical, transportation, and IoT applications.

Key Features

Intel Core 13th i3/i5/i7 Processor (28W TDP)
Intel Iris Xe Graphics
Dual-Channel DDR5 SODIMM up to 96GB
Dual HDMI video output
Support 2.5G LAN x5 (IEEE 802.3 at PSE x4)
Wide Range 9~36V DC input with protection circuit
Wide Operating Temperature -25~60°C
TPM 2.0 onboard

Specification

Category	Specification
System	AAEON BOXER-6649-RAP Fanless Industrial PC
CPU	Intel® 13th Gen Core™ i3/i5/i7 Processor (28W TDP) – i3-1320PE – i5-1340PE – i7-1370PE
Chipset	Intel® SoC
System Memory	DDR5 SODIMM x 2, up to 96GB
Display Interface	HDMI x 2
Storage Device	2.5” SATA Drive Bay x 1 M.2 2280 NVMe Slot x 1 (PCIe Gen4x4)
Ethernet	RJ-45 for 2.5GbE LAN i226-LM x 5 IEEE802.3 at PoE PSE x 4 PoE total support 20W while DC input < 12V, 60W while DC input ≥ 12V
I/O	USB3.2 Gen2 Type-A x 2 USB2.0 Type-A x 4 DB-9 RS-232/422/485 x 2 Mic in / Line out DB15 DIO 8-bit Power Button with LED x 1
Expansion	M.2 E key 2230 x 1 (PCIe) M.2 B Key 3052 x 1 (USB 3.2 / USB 2.0) SIM slot x 1
Indicator	System Power
OS Support	Windows® 10 IoT Enterprise LTSC 2021 Windows® 11 PRO Windows® 11 IoT Enterprise LTSC 2024 Ubuntu 24.04 and above
Power Requirement	DC-in 9~36V via 3-pin terminal block with protection circuit
Mounting	Wallmount, DIN Rail (optional)
Dimensions (W x H x D)	9.5″ x 6.6″ x 2.1″ (242mm x 167mm x 53mm) without brackets
Gross Weight	7.1 lb (3.2 Kg)
Net Weight	5.3 lb (2.4 Kg)
Operating Temperature	-13°F ~149°F (-25°C ~ 60°C), IEC60068-2 with 0.7 m/s airflow, wide-temp memory/storage
Storage Temperature	-40°F ~ 176°F (-40°C ~ 80°C)
Storage Humidity	5 ~ 95% @ 40°C, non-condensing
Anti-Vibration	SSD: Random, 3Grms, 5~500Hz
Anti-Shock	SSD: 50G @ wallmount, Half-sine, 11ms
Certification	CE/FCC Class A

Ordering Information

PART NUMBER	BOXER-6649-RAP-A1-1010	BOXER-6649-RAP-A2-1010	BOXER-6649-RAP-A3-1010
Part Number	BOXER-6649-RAP-A1-1010	BOXER-6649-RAP-A2-1010	BOXER-6649-RAP-A3-1010
CPU	Intel® Core™ i3-1320PE	Intel® Core™ i5-1340PE	Intel® Core™ i7-1370PE
PCH	SoC	SoC	SoC
LAN	2.5GbE LAN x 5 (IEEE802.3 at PoE PSE x 4)	2.5GbE LAN x 5 (IEEE802.3 at PoE PSE x 4)	2.5GbE LAN x 5 (IEEE802.3 at PoE PSE x 4)
USB 3.2	2	2	2
USB 2.0	4	4	4
RS232/422/485	2	2	2
Storage	M.2 2280 M Key Slot x 1 (NVMe SSD) 2.5″ SATA Drive Bay x 1	M.2 2280 M Key Slot x 1 (NVMe SSD) 2.5″ SATA Drive Bay x 1	M.2 2280 M Key Slot x 1 (NVMe SSD) 2.5″ SATA Drive Bay x 1
Display	HDMI x 2	HDMI x 2	HDMI x 2
Expansion	M.2 E key 2230 x 1 (PCIe) M.2 B Key 3052 x 1 (USB3.2/USB2.0) SIM slot x 1	M.2 E key 2230 x 1 (PCIe) M.2 B Key 3052 x 1 (USB3.2/USB2.0) SIM slot x 1	M.2 E key 2230 x 1 (PCIe) M.2 B Key 3052 x 1 (USB3.2/USB2.0) SIM slot x 1
Mounting	Wallmount,DIN Rail (optional)	Wallmount,DIN Rail (optional)	Wallmount,DIN Rail (optional)
Power	9~36V DC in	9~36V DC in	9~36V DC in
Operation Temp.	-13°F ~149°F (-25°C ~ 60°C), IEC60068-2 with 0.7 m/s AirFlow, with wide temp. memory/storage	-13°F ~149°F (-25°C ~ 60°C), IEC60068-2 with 0.7 m/s AirFlow, with wide temp. memory/storage	-13°F ~149°F (-25°C ~ 60°C), IEC60068-2 with 0.7 m/s AirFlow, with wide temp. memory/storage

AAEON Boxer Fanless Computers

Datasheet

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BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

FREE Pre-design / Pre-sales advise
Prototyping
- Custom PC Design
- Custom Panel PC
- Custom Racks and Towers
- Custom Peli Case PCs
Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
Custom PCB / Board Design
- COM Express, Qseven, SMARC
  Jetson, Raspberry Pi
Custom Chassis Design
- Metal
- Plastic
Custom Cables
Custom Back Panels and Faceplates
Custom Cooling
Custom Metal Work (internal brackets, mounting brackets)
Touchscreen Integration and Display Enhancements
- Custom LCD Displays
- Integration of touch technologies
- Optical Bonding
- Anti-reflective and anti-glare coatings
All products are Designed for Manufacture
Software – Custom OS Image

Build to Order: Computer Design and Customisation Services

Take an existing system and we can:

Custom specification (CPU, RAM, I/O, Industrial Storage, RAID)
Chassis customisation and branding
Custom BIOS
Long Term Availability
Software – Custom OS Image
Custom Packaging and branding
Integrating newly designed or existing hardware into a larger system

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

Windows image capture from customers HDD
Linux image capture from customers HDD
Android image capture from customers HDD
Windows / Linux Deployment from customers image
Custom Windows images, create and deploy
Update management
Custom Linux and Android images
Custom BIOS

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing	Materials Management	Logistics and Tracking	External Manufacturing
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test	• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System	• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels	• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test