COM Express vs COM-HPC: Choosing the Right Computer-on-Module Platform
When designing an embedded or industrial computer system, choosing the right processing architecture is an important early decision. For many applications, a Computer-on-Module (COM) provides an effective balance between high-performance computing, application-specific design flexibility and long-term product lifecycle management. Two of the leading standards are COM Express and the newer COM-HPC. Both provide a modular approach to embedded computing, combining a high-performance computer module with a dedicated carrier board designed around the specific requirements of the application.
But which platform is right for your system? At BVM, we supply Advantech COM Express and COM-HPC products, while our engineering team can also design custom carrier boards to provide the exact interfaces, connectivity and functionality required for your application.
What Is a Computer-on-Module
A Computer-on-Module separates the core computing platform from the application-specific hardware. The COM typically contains the key computing elements, including:
- Processor: Handles computations and runs applications efficiently.
- Memory: Stores data temporarily for quick access during operation.
- Graphics: Renders visuals, images, and video smoothly.
- High-speed interfaces: Enable fast communication with connected devices.
- Core system functionality: Manages essential operations and coordinates the system’s components.
The module is then connected to a carrier board, which provides the application-specific interfaces, peripherals and power architecture. This modular approach allows engineers to develop a carrier board specifically around their application while using a standardised computing module from an established manufacturer.
Both COM Express and COM-HPC follow this same fundamental architecture. The module provides the processor, memory and core computing functionality, while the carrier board provides application-specific peripherals and power. The standardised mechanical dimensions, mounting arrangements and connector pin assignments also make it possible to upgrade or replace the computing module without redesigning the entire application-side hardware.
For OEMs and equipment manufacturers, this can offer significant advantages in terms of development time, product flexibility and long-term lifecycle management.
COM Express: A Proven Standard for Embedded and Industrial Systems
COM Express has been widely adopted across industrial and embedded computing applications and remains one of the most established Computer-on-Module standards. The standard is particularly well suited to applications requiring a strong balance of processing performance, I/O capability, availability and development efficiency.
COM Express is available in several module sizes and pin configurations, supporting applications ranging from compact, low-power embedded systems through to more powerful industrial and edge computing platforms. Current COM Express designs can provide features including:
- PCI Express connectivity enables high-speed communication with expansion cards and peripherals.
- USB and USB 4 interfaces support fast data transfer and versatile device connectivity.
- SATA storage connectivity provides reliable connections for hard drives and solid-state drives.
- Ethernet delivers stable, high-speed wired network access.
- Display interfaces connect monitors and other visual output devices.
- GPIO enables direct control and monitoring of external hardware components.
- Audio and other embedded interfaces support sound, sensors, and specialized system peripherals.
Depending on the module type, COM Express supports PCIe Gen 4 and a wide range of interfaces, making it suitable for many modern industrial applications. The standard also supports legacy and specialist interfaces that may remain important in long-life equipment designs.
Why Choose COM Express?
COM Express is often an excellent choice where:
- Sufficient PCIe Gen 4 performance: The application requires reliable data transfer rates without the need for the higher bandwidth of newer standards.
- Proven, mature technology: Established components are preferred to reduce technical risk and simplify long-term support.
- Development time and cost: The solution should minimise engineering effort and keep overall project costs under control.
- Compatibility with existing COM Express designs: The new platform must integrate easily with current modules, carrier boards, and system architectures.
- Continued support for legacy interfaces: Existing peripherals and equipment must remain compatible with the updated design.
- Minimal carrier board space: The design should use a compact layout to maximise available space and simplify system integration.
Because COM Express has been established for many years, a wide range of reference designs, development tools and compatible technologies are available.
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Its connectors can also make carrier board development less complex than higher-performance alternatives. For many industrial and embedded applications, COM Express continues to provide an excellent combination of performance, flexibility and cost-effectiveness.
COM-HPC: Designed for Higher Performance and Greater Bandwidth
COM-HPC (Computer-on-Module for High-Performance Computing) is a newer PICMG standard designed to support the increasing bandwidth and processing requirements of modern embedded systems. While COM Express remains highly capable, COM-HPC has been developed to address applications requiring significantly higher I/O bandwidth, faster interfaces and greater computing performance.
COM-HPC supports high-performance connectors capable of data rates up to 32 Gbit/s, enabling technologies such as PCIe Gen 5. The standard also supports substantially higher power levels and increased numbers of high-speed interfaces compared with traditional COM Express platforms. COM-HPC is available in different versions designed for different applications:
COM-HPC Client
Designed for high-performance embedded applications requiring powerful processing, graphics and high-speed connectivity.
COM-HPC Server
Designed for demanding edge server and high-performance computing applications requiring extensive I/O and networking capability.
COM-HPC Mini
Designed for applications where space is more limited but modern high-speed connectivity and processing capability are still required.
COM Express vs COM-HPC: What’s the Difference?
The biggest difference between COM Express and COM-HPC is generally performance and available bandwidth. COM-HPC is designed to support higher-speed interfaces, including PCIe Gen 5, more PCIe lanes and greater networking capability. This makes it particularly suitable for applications involving high-performance computing, artificial intelligence, advanced networking and data-intensive edge systems.
COM Express, meanwhile, remains a highly capable and cost-effective solution for applications where these additional levels of bandwidth are not required. In practical terms, the decision often comes down to the requirements of the final application.
Choose COM Express when:
- PCIe Gen 4 provides sufficient performance
- I/O bandwidth requirements are moderate
- Cost is an important consideration
- Fast and efficient development is required
- Existing COM Express infrastructure needs to be maintained
- Legacy interfaces are required
- A smaller carrier board is beneficial
Choose COM-HPC when:
- PCIe Gen 5 is required
- Large numbers of high-speed PCIe lanes are needed
- High-speed networking is required
- USB 4 and other advanced interfaces are important
- The application requires significantly greater computing performance
- The system is expected to scale towards higher-performance computing in the future
Advantech’s comparison highlights I/O bandwidth, input power, development effort, legacy compatibility, pin count, available space, cost and future expansion as key factors when choosing between the two standards.
Advantech COM Express and COM-HPC Solutions from BVM
As an industrial and embedded computing specialist, BVM supplies Advantech Computer-on-Module solutions for customers developing specialist equipment and application-specific systems. Advantech offers a wide range of COM Express and COM-HPC modules, providing options for different processing, graphics, I/O and environmental requirements.
For example, the Advantech SOM-5885 provides a COM Express Type 6 platform, while the SOM-A350 provides a COM-HPC Client solution. The comparison between these platforms demonstrates how the same generation of processor technology can be deployed through different COM standards depending on the required interfaces and system architecture. This allows equipment manufacturers to select the computing platform that best suits the performance and lifecycle requirements of their product.
Custom Carrier Board Design from BVM
Selecting the Computer-on-Module is only part of the system design. The carrier board is where the platform is tailored to the specific requirements of the final application. BVM can design custom carrier boards for COM Express and COM-HPC platforms, providing the interfaces and functionality required for your equipment.
Depending on the application, a custom carrier board can incorporate:
- Application-specific I/O: Connects specialized sensors, actuators, and peripherals.
- Ethernet and high-speed networking: Enables fast wired communication.
- USB interfaces: Supports peripherals, data transfer, and charging.
- PCI Express expansion: Connects add-in cards and specialized hardware.
- Display connectivity: Connects monitors and other visual output devices.
- Storage interfaces: Communicates with SSDs, hard drives, and memory cards.
- Wireless connectivity: Provides Wi-Fi, Bluetooth, and mobile communication.
- GPS: Supplies location and timing information.
- Specialist interfaces: Supports vehicles, industrial systems, and specialized equipment.
- Power supply and power management: Delivers and monitors system power.
- Custom connectors and cabling: Provides tailored physical connections.
- Additional electronics and application-specific functionality: Adds specialized circuits and features.
Rather than designing the entire computer architecture from the ground up, a COM-based approach allows the computing technology to be combined with a carrier board designed specifically around the equipment. This can help OEMs create highly specialised products while benefiting from the ongoing development and availability of standardised computing modules.
From Concept to Finished Embedded System
BVM can support projects beyond the supply of the COM module itself. Our engineering and integration capabilities allow us to work with customers to develop complete application-specific solutions, including:
- Module selection: Helping identify the most suitable Advantech COM Express or COM-HPC platform for performance, connectivity and lifecycle requirements.
- Carrier board design: Developing custom carrier boards around the exact interfaces, expansion options and functionality required for each application.
- System integration: Combining the computing platform with storage, displays, communications, power supplies and other essential peripherals.
- Manufacturing and testing: Supporting the production, assembly, quality inspection and functional testing of finished industrial and embedded computer systems.
- Long-term lifecycle support: Helping customers manage component availability, product revisions and technology changes throughout the life of their product.
Which Platform Is Right for Your Application?
There is no single answer.
- COM Express remains an excellent choice for a wide range of industrial and embedded applications, particularly where PCIe Gen 4 and moderate I/O bandwidth provide all the performance required.
- COM-HPC provides a route to significantly higher bandwidth and performance, making it particularly attractive for demanding applications involving AI, high-speed networking, edge servers and data-intensive processing.
The most important factor is selecting the platform that matches the requirements of your application — without adding unnecessary complexity or cost. At BVM, we can help you evaluate your requirements, select the appropriate Advantech Computer-on-Module platform and design the custom carrier board and complete system architecture required for your product.
Talk to BVM About Your COM Project
Whether you are developing a new embedded system, upgrading an existing COM Express design or evaluating COM-HPC for a high-performance application, BVM can provide engineering support from initial concept through to a finished solution. Speak to our technical team about Advantech COM Express and COM-HPC modules, custom carrier board design and complete embedded computing solutions.
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