COM-HPC, or Computer-on-Module High-Performance Computing, is a standardized form factor for high-performance computing solutions. Developed by PICMG, it separates the processor module from the carrier board, offering flexibility in system design and upgrades.

The modular approach accommodates diverse computing needs, with different size options and pinouts defined by the standard. COM-HPC modules integrate powerful processors, memory, storage and I/O, making them suitable for applications like edge computing and industrial automation.

An Introduction to COM-HPC: High-Performance Computer-on-Modules
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  • SOM C350R 1


    Advantech SOM-C350R Intel Raptor Lake-S/ Alder Lake-S COM-HPC Module

    • Product Name: Advantech SOM-C350/R
    • Motherboard Form Factor: COM-HPC® Client Size C Module
    • CPU: 13th/12th Gen Intel® Core™ processors (Raptor Lake-S/ Alder Lake-S) desktop CPU
    • RAM: Dual Channel DDR5 SODIMM, max. 128GB (Both ECC & Non-ECC)
    • Expansion: 16 PCIe Gen5 + 16 PCIe Gen4 + 10 PCIe Gen3 lanes
    • Other Features: Up to 16 Cores, 24 Threads, 65W TDP, Supports iManager, Embedded Software APIs, and WISE-DeviceOn