Case Study: Enhancing Edge Processing for our Customers Advanced Radar System

Enhancing Edge Processing for our Customers Advanced Radar System

Choosing the Right SBC to Enhance Edge Processing in
Advanced Radar Systems
A BVM Case Study

Client Overview

Our customer is a leader in providing award-winning radar solutions that leverage innovative technology to solve complex real-world problems. Their expertise spans multiple industry sectors, including security surveillance, industrial automation, and traffic safety.

The Challenge – Finding the Perfect SBC to Enhance Edge Processing

  • Requirement Analysis: The customer approached BVM with a critical requirement: they needed support in developing edge processing capabilities. To achieve this, they aimed to evaluate a range of compact, cutting-edge Intel and AMD Single Board Computers (SBCs) to determine the best fit for their project requirements.
  • Size and Expansion: The primary challenge was to select a compact size motherboard (3.5” or below) that could fit in the customer’s existing chassis and had sufficient expansion capabilities.
  • Wide Temperature Range: The SBC needs to operate outdoors in extended temperature environments of -30 to 80℃.
  • Cold Start Capability: Due to the location the board would be installed, the cold start element of the solution was key.

Our Approach

  • Collaboration with DFI: BVM quickly identified a selection of SBCs that aligned with the customer’s specifications.
  • Initial Testing: These were presented to the customer, and samples were provided for testing with their application.
  • Component Selection: The customer selected two AMD solutions (GH551-ECI-V1404I & GH551-ECI-R1606G) that met both the performance and temperature criteria.
  • In-house Testing: Further testing was done by both BVM in our in-house thermal testing chambers.
  • Specification Confirmation: This testing allowed us to confidently specify memory and storage that was compatible with the customer’s demanding application.

The Solution – DFI GH551 3.5″ Single Board Computer

After a thorough review, our customer honed in on one model of SBC that ticked all the boxes, and their in-house and field testing began. This included:

  • CPU Performance: Ensuring the processing power met the demands of advanced radar applications.
  • CAD Modelling: Checking for physical compatibility with the customer’s chassis design.
  • Mean Time Between Failures (MTBF): Assessing the reliability and longevity of the SBCs in operational conditions.
  • Thermal Management: Evaluating how well the SBCs managed heat in varying environmental conditions.

Result – the Perfect SBC to Enhance Edge Processing

The final solution, GH551-ECI-R1606G, is now a crucial component in the next generation of the customer’s radar products, delivering enhanced performance and reliability in diverse and challenging environments. Based on the 10-Year CPU Life Cycle Support until Q1′ 31 (based on AMD Roadmap), the customer can now focus on other products confidently, knowing this board will be available for many more years.


This successful collaboration highlights BVM’s commitment to providing tailored, high-performance solutions that meet the specific needs of our clients. By leveraging our expertise and strong partnerships, we enabled our customer to advance their radar technology and maintain their leadership in the industry.

The customer has since taken their product through compliance (CE, FCC) as well as temperature qualification, confident that the SBC is up to the task. The customer expects rapid growth of their solution and is projected to reach 200 units per annum in 2024.

DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC: Key Features

  • CPU: AMD Ryzen V1000/R1000 Series
  • RAM: 1 DDR4 2400MHz SODIMM up to 16GB
  • Multiple displays: max. 4 DP++/3 DP++ + LVDS
  • Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
  • Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0
  • 10-Year CPU Life Cycle Support Until Q1′ 31
  • Operating Temperature: -5 to 65°C, -30 to 80°C
GH551 - Enhancing Edge Processing

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