DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC

• DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC
• AMD® Ryzen™ V1000/R1000 Series
• 1 DDR4 2400MHz SODIMM up to 16GB
• Multiple displays: max. 4 DP++/3 DP++ + LVDS
• Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
• Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0
• 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)

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Description

  • AMD® Ryzen™ V1000/R1000 Series
  • 1 DDR4 2400MHz SODIMM up to 16GB
  • Multiple displays: max. 4 DP++/3 DP++ + LVDS
  • Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
  • Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0
  • 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)

Specification

System
Processor
AMD® Ryzen™ Embedded V1605B, 4C/8T, 2MB Cache, 8 CU, 2.0GHz (3.6GHz), 15W
AMD® Ryzen™ Embedded V1202B, 2C/4T, 1MB Cache, 3 CU, 2.3 GHz (3.2GHz), 15W
AMD® Ryzen™ Embedded V1404I, 4C/8T, 2MB Cache, 8 CU, 2.0GHz (3.6GHz), 15W (Coming soon)
AMD® Ryzen™ Embedded R1606G, 2C/4T, 3 CU, 2.6GHz (3.5GHz), 15W
AMD® Ryzen™ Embedded R1505G, 2C/4T, 3 CU, 2.4GHz(3.3GHz),15W
Memory
1 x 260-pin SODIMM up to 16GB
Single Channel DDR4 up to 2400MHz
BIOS
AMI SPI 64Mbit
Graphics
Controller
AMD® Radeon™ Vega Graphics
Feature
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
Display
V1000: 4 x DP++ (1 x LVDS opt.)
R1000: 3 x DP++(1 x LVDS opt.)
DP++: resolution up to 4096×2160 @ 120Hz
LVDS: resolution up to 1920×1200 @ 60Hz
Quad Displays
V1000: 4 x DP++ (1 x LVDS opt.)
R1000: 3 x DP++(1 x LVDS opt.)
Expansion
Interface
1 x Full-size mini-PCIe (PCIe/USB 2.0, opt.: USB 3.1 Gen 1)
1 x M.2 2280/2242 M key (Support SATA/PCIe SSD)
1 x Nano SIM slot (opt.)
Audio
Audio Codec
Realtek ALC262
Ethernet
Controller
3 x Realtek® RTL8111HN/RTL8119I (10/100/1000Mbps)
Rear I/O
Ethernet
3 x GbE (RJ-45)
USB
2 x USB 3.1 Gen2
1 x USB 2.0
Display
V1000: 4 x DP++
R1000: 3 x DP++
Internal I/O
Serial
1 x RS-232/422/485 (2.0mm pitch)
RS485 support auto flow control
USB
1 x USB 2.0 (2.0mm pitch)
Display
1 x LVDS LCD Panel Connector
1 x Backlight Power
Audio
1 x Mic-in
1 x Line-out
1 x Speaker-out (2 x 3W, 8ohm)
SATA
1 x SATA 3.0 (up to 6Gb/s)
1 x SATA Power
DIO
1 x 8-bit DIO
SMBus
1 x SMBus
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
fTPM2.0 (default)
dTPM2.0 (opt.)
Power
Type
Single 12V DC
Connector
4-pin Right Angle Type Connector (default)
DC Jack (available upon request)
4-pin Vertical Type Connector (available upon request)
Consumption
Typical: V1605B:12V @ 1.35A (16.2Watt)
Max.: V1605B:12V @ 2.37A (28.44Watt)
RTC Battery
CR2032 coin cell
Environment
Temperature
Operating: -5 to 65°C, -30 to 80°C
Storage: -40 to 85°C
Humidity
Operating: 10 to 90% RH
Storage: 10 to 90% RH
MTBF
TBD
Mechanism
Dimensions
3.5″ SBC Form Factor
146mm (5.75″) x 102mm (4.02″)
Height
PCB: 1.6mm
Top Side: 15.5mm, Bottom Side: 4.0mm
Packing List
Packing List
1 GH551 board
1 COM cable (2P ports, Length: 250mm) 332-753040-000G
SATA cable (Length: 500mm) 332-553001-005G
SATA power cable (Length: 250mm) A81-004041-016G
Heatsink (Height: 35.00mm) V series: A71-008136-010G/R series: A71-008136-000G
Note: The items are subject to change before mass production.
Country of Origin
Country of Origin
Taiwan

Ordering Information

Model Name Part Number Description
GH551-BCI-V1605B 770-GH5511-000G AMD® Ryzen™ Embedded V1605B, 1 DDR4, 3 LAN, 4 DP++, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C
GH551-BCI-V1202B 770-GH5511-100G AMD® Ryzen™ Embedded V1202B, 1 DDR4, 3 LAN, 3 DP++, 1 LVDS, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C
GH551-BCI-R1606G 770-GH5511-300G AMD® Ryzen™ Embedded R1606G, 1 DDR4, 3 LAN, 3 DP++, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C
GH551-BCI-R1505G 770-GH5511-400G AMD® Ryzen™ Embedded R1505G, 1 DDR4, 3 LAN, 2 DP++, 1 LVDS, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C

Datasheet

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BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.

Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Manufacturer : DFI

Motherboard

  • Form Factor : 3.5 SBC

CPU

  • Powered By : AMD
  • CPU Family : AMD Ryzen
  • CPU Generation : Ryzen R-Series, Ryzen V-Series
  • CPU Model : R1505G, R1606G, V1202B, V1404I, V1605B
  • CPU Speed : 2.0Ghz, 2.3Ghz, 2.4Ghz, 2.6Ghz
  • CPU Cores :

Memory

  • Memory Installed :
  • Memory Slots : 1
  • Memory Type : 2400Mhz DDR4

I/O and Expansion

  • Expansion Slots : M.2, Mini PCIe, SATA
  • LAN Ports : 3
  • Serial Ports :
  • USB 2 Ports : 1
  • USB 3 Ports :
  • USB 3.1 Ports : 2
  • Video Output : DP++, LVDS
  • Multi Display : Quad Display
  • Wireless Connectivity :

Operating System

  • OS :

Certifications

  • Certifications :

Industry

  • Industry : Industrial Automation and Control, Medical, Military, Transport - Air, Transport - Road, Transport and Smart City

Features

  • 24/7 Use :
  • 4G-GPS :
  • Artificial Intelligence Use : Artificial Intelligence, Machine Learning, Machine Vision
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT : Yes
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays : Quad
  • NUC :
  • Other Features : GPIO
  • PoE :
  • Rugged : Yes
  • Ryzen : Yes
  • System Type : SBC
  • Touchscreen :
  • Whiskey Lake :
  • Wide Temp : Yes

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