DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC

3.5″ SBC, AMD® Ryzen™ V1000/R1000 Series, 1 DDR4, 1 M.2 M key, 1 Mini PCIe, 1 LVDS, 4 DP++, 3 Intel GbE, 2 USB 3.1 Gen2, 1 USB 2.0

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Description

  • AMD® Ryzen™ V1000/R1000 Series
  • 1 DDR4 2400MHz SODIMM up to 16GB
  • Multiple displays: max. 4 DP++/3 DP++ + LVDS
  • Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
  • Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0
  • 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)

Specification

System
Processor
AMD® Ryzen™ Embedded V1605B, 4C/8T, 2MB Cache, 8 CU, 2.0GHz (3.6GHz), 15W
AMD® Ryzen™ Embedded V1202B, 2C/4T, 1MB Cache, 3 CU, 2.3 GHz (3.2GHz), 15W
AMD® Ryzen™ Embedded V1404I, 4C/8T, 2MB Cache, 8 CU, 2.0GHz (3.6GHz), 15W (Coming soon)
AMD® Ryzen™ Embedded R1606G, 2C/4T, 3 CU, 2.6GHz (3.5GHz), 15W
AMD® Ryzen™ Embedded R1505G, 2C/4T, 3 CU, 2.4GHz(3.3GHz),15W
Memory
1 x 260-pin SODIMM up to 16GB
Single Channel DDR4 up to 2400MHz
BIOS
AMI SPI 64Mbit
Graphics
Controller
AMD® Radeon™ Vega Graphics
Feature
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
Display
V1000: 4 x DP++ (1 x LVDS opt.)
R1000: 3 x DP++(1 x LVDS opt.)
DP++: resolution up to 4096×2160 @ 120Hz
LVDS: resolution up to 1920×1200 @ 60Hz
Quad Displays
V1000: 4 x DP++ (1 x LVDS opt.)
R1000: 3 x DP++(1 x LVDS opt.)
Expansion
Interface
1 x Full-size mini-PCIe (PCIe/USB 2.0, opt.: USB 3.1 Gen 1)
1 x M.2 2280/2242 M key (Support SATA/PCIe SSD)
1 x Nano SIM slot (opt.)
Audio
Audio Codec
Realtek ALC262
Ethernet
Controller
3 x Realtek® RTL8111HN/RTL8119I (10/100/1000Mbps)
Rear I/O
Ethernet
3 x GbE (RJ-45)
USB
2 x USB 3.1 Gen2
1 x USB 2.0
Display
V1000: 4 x DP++
R1000: 3 x DP++
Internal I/O
Serial
1 x RS-232/422/485 (2.0mm pitch)
RS485 support auto flow control
USB
1 x USB 2.0 (2.0mm pitch)
Display
1 x LVDS LCD Panel Connector
1 x Backlight Power
Audio
1 x Mic-in
1 x Line-out
1 x Speaker-out (2 x 3W, 8ohm)
SATA
1 x SATA 3.0 (up to 6Gb/s)
1 x SATA Power
DIO
1 x 8-bit DIO
SMBus
1 x SMBus
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
fTPM2.0 (default)
dTPM2.0 (opt.)
Power
Type
Single 12V DC
Connector
4-pin Right Angle Type Connector (default)
DC Jack (available upon request)
4-pin Vertical Type Connector (available upon request)
Consumption
Typical: V1605B:12V @ 1.35A (16.2Watt)
Max.: V1605B:12V @ 2.37A (28.44Watt)
RTC Battery
CR2032 coin cell
Environment
Temperature
Operating: -5 to 65°C, -30 to 80°C
Storage: -40 to 85°C
Humidity
Operating: 10 to 90% RH
Storage: 10 to 90% RH
MTBF
TBD
Mechanism
Dimensions
3.5″ SBC Form Factor
146mm (5.75″) x 102mm (4.02″)
Height
PCB: 1.6mm
Top Side: 15.5mm, Bottom Side: 4.0mm
Packing List
Packing List
1 GH551 board
1 COM cable (2P ports, Length: 250mm) 332-753040-000G
SATA cable (Length: 500mm) 332-553001-005G
SATA power cable (Length: 250mm) A81-004041-016G
Heatsink (Height: 35.00mm) V series: A71-008136-010G/R series: A71-008136-000G
Note: The items are subject to change before mass production.
Country of Origin
Country of Origin
Taiwan

Ordering Information

Model Name Part Number Description
GH551-BCI-V1605B 770-GH5511-000G AMD® Ryzen™ Embedded V1605B, 1 DDR4, 3 LAN, 4 DP++, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C
GH551-BCI-V1202B 770-GH5511-100G AMD® Ryzen™ Embedded V1202B, 1 DDR4, 3 LAN, 3 DP++, 1 LVDS, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C
GH551-BCI-R1606G 770-GH5511-300G AMD® Ryzen™ Embedded R1606G, 1 DDR4, 3 LAN, 3 DP++, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C
GH551-BCI-R1505G 770-GH5511-400G AMD® Ryzen™ Embedded R1505G, 1 DDR4, 3 LAN, 2 DP++, 1 LVDS, 2 USB 3.1 Gen2, 2 USB 2.0, 1 COM, 12V DC, -5 to 65°C

Datasheet

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If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

 

Design | Develop | Test | Manufacture

Here’s a selection of our design, manufacturing

& associated services: –

 

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.DesignToOrder

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:BuildToOrder

  • Custom specification (CPU, Ram, I/O, Storage)
  • Chassis customisation and branding
  • Custom BIOS
  • Software – Custom OS Image
  • Custom Packaging and branding
  • Integrating newly designed or existing hardware into a larger system

Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & DeploymentEmbeddedSoftware

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images?
  • Custom BIOS

Manufacturer : DFI

Motherboard

  • Form Factor : 3.5 SBC

CPU

  • Powered By : AMD
  • CPU Family : AMD Ryzen
  • CPU Generation : Ryzen R-Series, Ryzen V-Series
  • CPU Model : R1505G, R1606G, V1202B, V1404I, V1605B
  • CPU Speed : 2.0Ghz, 2.3Ghz, 2.4Ghz, 2.6Ghz
  • CPU Cores :

Memory

  • Memory Installed :
  • Memory Slots : 1
  • Memory Type : 2400Mhz DDR4

I/O and Expansion

  • Expansion Slots : M.2, Mini PCIe, SATA
  • LAN Ports : 3
  • Serial Ports :
  • USB 2 Ports : 1
  • USB 3 Ports :
  • USB 3.1 Ports : 2
  • Video Output : DP++, LVDS
  • Multi Display : Quad Display
  • Wireless Connectivity :

Operating System

  • OS :

Certifications

  • Certifications :

Industry

  • Industry : Industrial Automation and Control, Medical, Military, Transport - Air, Transport - Road, Transport and Smart City

Features

  • 24/7 Use :
  • 4G-GPS :
  • Artificial Intelligence Use : Artificial Intelligence, Machine Learning, Machine Vision
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT : Yes
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays : Quad
  • NUC :
  • Other Features : GPIO
  • PoE :
  • Rugged : Yes
  • Ryzen : Yes
  • System Type : SBC
  • Touchscreen :
  • Whiskey Lake :
  • Wide Temp : Yes

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