System Type: Ultra-compact, AI-powered in-vehicle compact PC designed for smart mobility and fleet applications
CPU: Intel Core Ultra processor platform optimised for edge AI and in-vehicle computing
RAM: Integrated LPDDR5-6400 high-speed memory for reliable, low-power operation
Expansion: Multiple M.2 slots including M.2 M-Key, M.2 B-Key, and M.2 E-Key for storage and wireless connectivity
Other Features: Triple display support (HDMI, DP, USB-C DP Alt Mode), rich I/O with 2× 2.5GbE, 1× GbE, USB 3.2/2.0, multiple COM ports, dual CAN-FD, built-in 9-axis sensor, and out-of-band remote management support
This product has multiple variants. The options may be chosen on the product page
System Type: Rugged in-vehicle embedded PC (IP67-rated, fanless design)
CPU: Intel Core Ultra processor platform
RAM: LPDDR5-6400 onboard soldered memory
Expansion: Vehicle I/O expansion via PoE (2 × GbE or 1 × GbE + 1 × 2.5GbE)
Other Features: 2 × CAN FD, 2 × RS232 via IP67-rated connector, built-in 9-axis sensor for driver monitoring, wide 9–36V DC vehicle power input with ACC/IGN support, and extended operating temperature range from -40°C to 70°C for harsh automotive environments
This product has multiple variants. The options may be chosen on the product page
Expansion: Support M.2 B key 3042/3052 5G-NR module
Other features: Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz), Up to 4 LAN or 6 USB, 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)
This product has multiple variants. The options may be chosen on the product page
System Type: AMD Ryzen 8000 Series Fanless Embedded System
CPU: AMD Ryzen 8000 Series Processor
RAM: Up to 2 SO-DIMM DDR5-5600 modules, up to 128GB, ECC supported
Expansion: M.2 B Key 3042/3052 for 5G-NR module, micro SD, Nano SIM
Other features: Dual displays (HDMI 4K@30Hz + DP++ 4K@60Hz), rich I/O including 2 LAN, 2 USB 3.2 Gen2, 1 USB 2.0, 1 USB Type-C, 4 COM ports, remote power on/off and BIOS update support
This product has multiple variants. The options may be chosen on the product page
Other Features: Quad independent displays (4 × DP++), rich I/O including 2 × 2.5GbE, 5 × COM + 2 × MicroFit (ccTalk), multiple USB ports, audio I/O, advanced security (Secure Boot, TPM 2.0), and NVRAM up to 16MB with 5-year data retention without power
This product has multiple variants. The options may be chosen on the product page
Other Features: Dual 2.5GbE ports, USB 3.2 Gen 2, Onboard TPM 2.0, 9 ~ 36V DC input, -20°C ~ 70°C wide temperature range, optional Hailo-8 AI Accelerator support
This product has multiple variants. The options may be chosen on the product page
Expansion: M.2 2280 for NVMe storage, M.2 3052 B Key for 5G module
Other features: TPM 2.0 onboard, 1x GbE LAN, 1x 2.5GbE LAN, Wide Range 9-36V DC input, -20~60°C Operating Temperature
This product has multiple variants. The options may be chosen on the product page
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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