LEX 3I160DW 16th Gen Panther Lake 3.5″ SBC with 5x 2.5 GbE LAN

  • Product Name: LEX 3I160DW
  • Motherboard Form Factor: 3.5″ SBC
  • CPU: Intel Core Ultra 300 Series (Panther Lake) processors
  • RAM: 2 × DDR5 SODIMM, up to 128GB
  • Expansion: 1 × M.2 M-Key, 2 × M.2 B-Key, 1 × PCIe x2, 2 × PCIe x4
  • Other Features: 5 × 2.5GbE LAN, 2 × HDMI, 1 × LVDS/eDP, USB 3.2/2.0, Nano SIM, 4 × COM, MIPI-CSI, HD Audio, TPM 2.0, SMBus, I2C and I2S

Description

The LEX SYSTEM 3I160DW is a high-performance 3.5″ single-board computer powered by Intel Core Ultra 300 Series (Panther Lake) processors. Designed for demanding industrial and embedded applications, it combines powerful CPU performance with an enhanced integrated GPU and dedicated NPU for AI and edge computing workloads. The compact board supports up to 128GB of DDR5 memory and provides extensive expansion options, including M.2 and PCIe interfaces. Multiple independent display outputs support flexible system configurations, while 5 × 2.5GbE LAN ports provide high-speed networking for data-intensive applications. A comprehensive range of USB, COM, MIPI-CSI and industrial I/O interfaces further enhances connectivity, making the LEX 3I160DW a versatile platform for industrial automation, machine vision, edge AI, networking and embedded computing applications.

Key Features

  • Intel Core Ultra 300 Series (Panther Lake) processors
  • Revamped iGPU and integrated NPU
  • 2 x DDR5 SODIMM, Max 128GB
  • Multiple Independent display:
    2 x HDMI®, 1 x LVDS or eDP (BIOS), 1 x Type C
  • 5 x Intel 2.5 GbE LAN, 3 x USB 3.2 Gen 1×1, 5 x USB 2.0
  • 1 x M.2 M Key, 2 x M.2 BKey, 1 x Nano SIM,
    1 x PCIe x2, 2 x PCIe x 4
  • 4 x COM, 4DI / 4DO, 3 x MIPI-CSI, HD Audio
  • TPM 2.0, SMBus, I2C, I2S

Specification

MODEL 3I160DW
CPU Intel® Core™ Ultra 300 Series (Panther Lake) processors
Graphics Intel® ArcTM B370 (Core Ultra 338H) Graphics
Intel® Graphics
System Memory 2 x DDR5 SODIMM, Max 128GB
Storage 1 x SATA ports 3.0 Data transfer rates up to 6.0 Gb/s (600 MB/s)
1 x M.2 M key Type 3080 (PCIe x 2), Support NVMe
BIOS AMI UEFI BIOS
Display 2 x HDMI® ; 1 x LVDS or eDP (BIOS) ; 1 x Type C DP ALT Mode
TPM TPM 2.0
LAN 5 x Intel 2.5GbE I226-IT (external)
Expansion Interface 1 x M.2 M key Type 3080 (PCIe x 2), Support NVMe, (OEM to Type 3042)
1 x M.2 B key Type 2242 / 3042 (USB 3.2 / USB 2.0) (OEM to Type 3052)
1 x M.2 B key Type 2242 / 3042 (PCIe x 2 / USB 2.0)
1 x Nano SIM, High Speed Connector (1*PCIe x 2, 2*PCIe x 4)
Expansion Module Converter Card : CN064: M.2 B+M Key to M.2 E Key 2230, WiFi 6 + BT
USB 3 x USB 3.2 Gen 1 (external), 1 x Type C USB 3.2 (external)
1 x USB 2.0 (external) ; 4 x USB 2.0 (internal)
Serial IO 4 x RS232 / 422 / 485 (internal)
Camera interface 3 x MIPI-CSI
Audio Mic-IN, Line-in / Line-out with AMP
SMBus / I2C / I2S 1 x SMBus ; 2 x 12C ; 1 x I2S
GPIO Hardware digital Input & Output, 4 x DI / 4 x DO
WDT Hardware Watch Dog Timer, 0~65535 sec programmable
Power Input Wide Range DC IN +9~36V (Typ: +12V)
Dimension 3.5″ Plus SBC (146 x 150 mm) ; 202g
Operation Temperature -20°C~45°C
Operation Humidity 5~95%, non-condensing
Chassis (OEM I/O Expansion by request) Box PC: HAWK
OS Support Windows 10/11 (64bit)
Linux Ubuntu 22.04 / Kernel 5.15

HAWK-3I160DWHAWK 3I160DW

The HAWK 3I160DW is a compact fanless embedded computer powered by Intel® Core™ Ultra Series 3 (Panther Lake) processors with an integrated NPU for high-performance Edge AI. It supports up to 128GB DDR5 memory and offers extensive connectivity, including dual HDMI®, USB Type-C, 5 × 2.5GbE LAN, USB 3.2, COM ports and multiple M.2 expansion slots. Designed for demanding industrial applications, it provides reliable networking, real-time data processing and flexible expansion for AIoT and edge gateway solutions.

BVM Customisation Service
Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs, Panel PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Android image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images
  • Custom BIOS

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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