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ALL INDUSTRIAL AND EMBEDDED COMPUTERS

Showing 161–186 of 186 results

  • TANK XM811

    IEI TANK-XM811AI-RPL 13th Gen Raptor Lake-S AIoT Industrial Computer

    • Product Name: IEI TANK-XM811AI-RPL
    • System Type: 13th Gen Raptor Lake-S AIoT Developer Kit
    • CPU: Intel Core i9-13900TE (up to 5.0GHz, 24-Core (8P+16E), TDP 35W) or Intel Core i7-13700TE (up to 4.8GHz, 16-Core (8P+8E), TDP 35W)
    • RAM: 2 x SO-DIMM DDR4 3200 (8GB pre-installed) (up to 64GB)
    • Expansion: Multiple internal expansion boards for flexible selection
    • Other features: 2 x 2.5G Ethernet ports, Multiple USB ports and serial ports
    This product has multiple variants. The options may be chosen on the product page
  • IEP 5000G 1

    ASRock Industrial iEP-5000G Elkhart Lake Rugged IoT Controller

    • Product Name: Asrock iEP-5000G
    • System Type: Rugged Industrial IoT Controller
    • CPU: Latest and Powerful Intel Atom x6000E Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
    • Expansion: Most Flexible IOs and Expansion for Industrial Applications
    • Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
  • IEP 5000G 1

    ASRock Industrial iEP-5002G Elkhart Lake Rugged IoT Controller

    • Product Name: Asrock iEP-5002G
    • System Type: Rugged Industrial IoT Controller
    • CPU: Latest and Powerful Intel Atom x6000E Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
    • Expansion: Most Flexible IOs and Expansion for Industrial Applications
    • Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
  • HBFDF04 Front45D

    Jetway HBFDF04 Series Elkhart Lake Embedded Mini PC

    • Product Name: Jetway HBFDF04 Series
    • System Type: Embedded Box PC
    • CPU: Intel Elkhart Lake SoC Processor (Default: J6412)
    • RAM: Support 2 * SO-DIMM DDR4-3200MHz up to 32GB
    • Expansion: 1* M.2 B-key (3042) Support USB3.1/USB2.0 interface, 1* M.2 E-key (2230) Support USB2.0/PCIe Gen.3 x1 interface
    • Other features: All-aluminium body, produced by casting process, 12~24V DC-in
  • N11 Front45D

    Jetway N11 Series 11th Gen Tiger Lake NUC PC

    • Product Name: Jetway N11 Series
    • System Type: 11th Gen Tiger Lake NUC PC
    • CPU: Intel 11th Gen Tiger Lake-UP3 SoC Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM up to 64GB
    • Expansion: 1 x M.2 M-key 2242/2280 PCIe4.0 x4/SATAIII interface for NVMe functionality, 1 x  2.5” SATA drive bay, 3 x internal M.2 expansion slots for various applications
    • Other features: 1 x Intel i219-LM GbE, 1 x Intel i225-V 2.5GbE, 2 x HDMI 2.0b, 2 x DP1.4, Rich and complete connection interface, supports 4 sets of 4K HDR output, Supports Windows 11 and Linux
    This product has multiple variants. The options may be chosen on the product page
  • NUC BOX EHLL3 2

    ASRock Industrial NUC BOX-J6412 Intel Elkhart Lake NUC PC

    • Product Name: Asrock NUC BOX-J6412
    • System Type: Intel Elkhart Lake Celeron NUC 6000 BOX Series
    • CPU: Intel ElkHart Lake SoC Processors
    • RAM: 2 x 260-pin SO-DIMM up to 32GB DDR4 3200 MHz
    • Expansion: 4 x USB 3.2 Gen2, 1 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x SATA3
    • Other features: 2 x Realtek 1 Gigabit LAN, Supports Dual display, 1 x HDMI 2.0b, 1 x DP 1.4, TPM onboard, 19V/65W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Barebone
  • EC70A TGU 5

    DFI EC70A-TGU Tiger Lake Fanless Embedded System

    • Product Name: DFI EC70A-TGU
    • System Type: Tiger Lake Fanless Embedded System
    • CPU: 11th Gen Intel Core i7/i5/i3 Processors
    • RAM: On board memory 8GB and 1 SO-DIMM DDR4
    • Expansion: Support M.2 B key 3042/3052 5G-NR module
    • Other features: Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz), Up to 4 LAN or 6 USB, 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • ITMH100 1

    Winmate ITMH100 Intel Tiger Lake i5-1135G7 Modular Box PC

    • Product Name: Winmate ITMH100
    • System Type: Intel Tiger Lake Modular Box PC
    • CPU: Intel Tiger Lake UP3 Core i5-1135G7
    • RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
    • Expansion: Optional with Modular front Display as a Panel PC
    • Other features: Multi Video Output (HDMI/DisplayPort), Quick & Easy Replaceable Hard Disk Design (No Tools required), Support wide range 9-29V DC input
  • DT200 CS side w600

    DFI DT200-CS High Performance MXM Embedded System

    • Product Name: DFI DT200-CS
    • System Type: High Performance MXM Embedded System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: DDR4 2400/2666MHz up to 64GB
    • Expansion: Support M.2 B key 3052 5G cellular module
    • Other features: Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection), AI accelerated: up to 110W GPU MXM module supported, Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • HBFDF05 Front45D com

    Jetway HBFDF05 Series Tiger Lake Embedded Mini PC

    • Product Name: Jetway HBFDF05
    • System Type: Tiger Lake Embedded Box PC
    • CPU: Intel Tiger Lake-UP3 SoC Processor (TDP 15W)
    • RAM: 2* SO-DIMM DDR4-3200MHz up to 64GB
    • Expansion: 2* USB2.0, 4* USB3.2, 2* HDMI, 2* DP, 2* RJ45, 1Audio
    • Other features: Support 4 4K HDR Displays or 1* 8K SDR Displays, DC-12V_60W Adapter
    This product has multiple variants. The options may be chosen on the product page
  • ES220 CSSide200612 w600

    DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System

    • Product Name: DFI ES220-CS
    • System Type: High Performance 9th/8th Gen iCore Embedded System
    • CPU: 8th/9th Gen Intel Core Processors with Intel C246/Q370/H310 Chipset
    • RAM: 2 DDR4 SODIMM up to 64GB
    • Expansion: Single/Triple storage: 1 M.2 SSD + 2 2.5″ SSD (option) (with RAID supported)
    • Other features: Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM, 2 HDMI 2.0 Support resolution 4K@60Hz, Acoustic level support full load 36dB @operating temperature 45° C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • PALM 3A100DW R 1

    LEX PALM-3A100DW-R AMD Ryzen Embedded Computer

    • Product Name: Lex PALM-3A100DW-R
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded R1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 1 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 1 x M.2
    • Other features: With Independent Three 4K Display
  • PALM 3A100DW V 1

    LEX PALM-3A100DW-V AMD Ryzen Embedded Computer

    • Product Name: Lex PALM-3A100DW-V
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded V1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2
    • Other features: With Independent Four 4K Display
    This product has multiple variants. The options may be chosen on the product page
  • EC51X CSSide210310R1 w600

    DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Industrial Computer

    • Product Name: DFI EC510-CS/EC511-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 1 PCIe and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC51x-CS6G86E-Q), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC543 CSSide210324 w600

    DFI EC543-CS 8th/9th Gen 5G Fanless Industrial Computer

    • Product Name: DFI EC543-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC543-CS6G86E-Q configuration), Support 5G communication, Operating temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC500 CSSide200824 w600

    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC500-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC90ASide210324 w600

    DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System

    • Product Name: DFI EC90A-GH
    • System Type: Ultra Small Mini PC Fanless Embedded System
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
    • Expansion: 1 x Mini-PCIe (PCIe signal)
    • Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • ECX700 ADP 1

    DFI ECX700-ADP 12th Gen Outdoor Ruggedized IPC67 Mini PC

    • Product Name: DFI ECX700-ADP
    • System Type: Outdoor Ruggedized IPC67 Box PC
    • CPU: Intel Alder Lake-P Processor i5-1245UE / i7-1265UE
    • RAM: Supports DDR4 memory
    • Expansion: Multiple I/O interfaces for versatile connectivity
    • Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)
    This product has multiple variants. The options may be chosen on the product page
  • RC300 CS SideIO200729R2 w600

    DFI EC300-CS AI-Enabled 5G MXM PoE High Performance System

    • Product Name: DFI EC300-CS
    • System Type: AI-Enabled 5G MXM PoE High Performance System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: 4 x RJ45 type PoE ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • iBOX TGLL1

    ASRock Industrial iBOX-1265UE Intel Alder Lake-P i7 Fanless Mini PC

    • Product Name: Asrock iBOX-1265UE
    • System Type: Industrial Fanless BOX PC
    • CPU: Intel 12th Gen (Alder Lake-P) Core Processors
    • RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
    • Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
  • iBOX TGLL1

    ASRock Industrial iBOX-1215UE Intel Alder Lake-P i3 Fanless Mini PC

    • Product Name: Asrock iBOX-1215UE
    • System Type: Industrial Fanless BOX PC
    • CPU: Intel 12th Gen (Alder Lake-P) Core Processors
    • RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
    • Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
  • iBOX TGLL1

    ASRock Industrial iBOX-1245UE Intel Alder Lake-P i5 Fanless Mini PC

    • Product Name: Asrock iBOX-1245UE
    • System Type: Industrial Fanless BOX PC
    • CPU: Intel 12th Gen (Alder Lake-P) Core Processors
    • RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
    • Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
  • IBOX V2000L1

    ASRock Industrial iBOX-V2000M AMD Ryzen Fanless Mini PC

    • Product Name: Asrock iBOX-V2000M
    • System Type: Fanless BOX PC
    • CPU: AMD Ryzen Embedded V2718
    • RAM: 2 x 260-pin non-ECC/ECC SO-DIMM up to 64GB DDR4 3200 MHz
    • Expansion: 4 x USB 3.2 Gen2, 4 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.2a (2 from Type C), TPM onboard, 12V~19V DC-In, 171.8 x 109.45 x 50.05mm, Fanless Barebone
  • IBOX V2000L1

    ASRock Industrial iBOX-V2000V AMD Ryzen Fanless Mini PC

    • Product Name: Asrock iBOX-V2000V
    • System Type: Fanless BOX PC
    • CPU: AMD Ryzen Embedded V2516
    • RAM: 2 x 260-pin non-ECC/ECC SO-DIMM up to 64GB DDR4 3200 MHz
    • Expansion: 4 x USB 3.2 Gen2, 4 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 1 x Realtek 1 Gigabit LAN, 1 x Realtek 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.2a (2 from Type C), TPM onboard, 12V~19V DC-In, 171.8 x 109.45 x 50.05mm, Fanless Barebone
  • GM341 GHF

    DFI GM341-GHF V1000/R1000 Gaming Embedded System

    • Product Name: DFI GM341-GHF
    • System Type: Gaming Embedded System
    • CPU: AMD Ryzen Embedded V1000/R1000 processors
    • RAM: Two 260-pin SODIMM up to 32GB
    • Expansion: 5 COM, 6 USB, 2 LAN, M.2 support
    • Other features: High performance Radeon VEGA series graphics, 4 DP++ 4K monitor support (V1000), Comprehensive gaming features, 12V DC single input, 10-Year CPU Life Cycle Support
    This product has multiple variants. The options may be chosen on the product page
  • GM330 BFF 1

    DFI GM330 AMD Ryzen G-Series GX-217GI Embedded Gaming System

    • Product Name: DFI GM330-BFF-217GI
    • System Type: Embedded Gaming System
    • CPU: AMD Embedded G-Series Processor Dual Core 1.7GHz GX-217GI
    • RAM: 260-pin SODIMM up to 32GB Dual Channel DDR4 3200MHz
    • Expansion: 2 DP++, 5 COM, 7 USB, 2 LAN, M.2 support
    • Other features: 12V DC single input, Stereo audio amp output