ASRock Industrial iEP-5002G Elkhart Lake Rugged IoT Controller

  • Product Name: Asrock iEP-5002G
  • System Type: Rugged Industrial IoT Controller
  • CPU: Latest and Powerful Intel Atom x6000E Processor
  • RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
  • Expansion: Most Flexible IOs and Expansion for Industrial Applications
  • Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options

Description

The ASRock Industrial iEP-5002G Industrial IoT Controller features high computing power with a compact and rugged design for mission-critical applications. The Series provides flexible IOs and ranged expansion slots for various communications, flawlessly connecting edge-to-cloud in various Edge AI applications.

Features

  • Latest and Powerful Intel Atom x6000E Processor
  • Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C)
  • 6-36VDC Wide Range Power Inputs
  • Most Flexible IOs and Expansion for Industrial Applications
  • Intel TCC and TSN Support for Real-Time Computing
  • DIN Rail or Wall Mount Options

Specification

Processor System  
   
CPU Intel® Elkhart Lake SoC Processors
x6212RE, DC,1.2GHz, 6W
Video 1 x HDMI 2.0b, 1 x VGA
Memory 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
Expansion Slot  
   
SIM Socket 1 x External SIM card socket for 4G LTE or 5G module
RF& Antenna (Option) M.2 Wi-Fi 5 module supports IEEE 802.11 a/b/g/n/ac + BT 5.1 (Option)
M.2 Wi-Fi 6E module supports IEEE 802.11 a/b/g/n/ac/ax + BT 5.2 (Option)
2 x 4G LTE antenna + 2 x Wi-Fi antenna (Option)
4 x 5G antenna + 2 x Wi-Fi antenna (Option)
M.2 1 x M.2 Key E Socket (2230) for Wi-Fi module
1 x M.2 Key B Socket (3042/3052) for 4G LTE module / 5G module
I/O  
   
Ethernet 3 x 1GbE (Current FW and driver may change in the future)
PoE (Option) 2 x PoE (Intel I210AT, Option)
The operating temp. and power delivery spec of PoE sku TBD
Serial Port 3 x COM (RS-232/422/485 BIOS select)
USB 2 x USB 3.2 Gen1
2 x USB 2.0
Digital I/O 4DIs/4DOs
Audio 1 x Mic in
1 x Line out
CANBus (Option) 1 x CANBus connector supports up to 2 CANBus devices via additional cable
Storage  
   
SD Slot 1x Micro SD card slot, supports SDXC V3.01
SATA 1 x 2.5″ 9.5mm SATA3 HDD or SSD
M.2 1 x M.2 Key M Socket (2280) with PCIe x2/SATA3 for Storage
Power Requirements  
   
DC Input 6-36 VDC, 80V Surge Protection
Supports Latch Adaptor
AC to DC Adaptor (Option) AC input 100-240Vac, 1.5A 50-60Hz, DC output 19V, 3.42A,
65W Adaptor (Latch type)
Environment  
   
Operating Temp -40°C ~ 70°C (-40°F~158°F)
Storage Temp -40°C ~ 85°C (-40°F~185°F)
Humidity ~95% @ 40°C (non-condensing)
Vibration Operating: 5 Grms, 5-500 Hz, 3 axes with SSD
ESD Contact +/-8 KV, Air +/-15 KV
Shock Operating 50 Grms, half sine 11 ms duration with SSD
EMC CE and FCC Class A (EN61000-6-4/-2)
Safety UL, CB
Mechanical  
   
Dimensions (W x H x D) 58mm (W) x 125mm (D) x 157mm (H)
Indicator 1 x SATA / NVMe Storage LED, 1 x Wi-Fi / BT LED
Function 1 x Power Button, 1 x Clear CMOS Button
Weight Net Weight : 1.3kg
Mounting DIN-Rail or Wall mounting
Manageability / Security  
   
Manageability WDT,, Intel® In-Band Manageability
Security TPM2.0
Add-on Feature / OS Support  
   
Real-Time Enablement TSN, TCC support under YOCTO
OS Support Windows 10, Linux

 

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

BVM Design and Manufacturing

BVM Customisation Service
Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Embedded Product Design

Turnkey solutions for brand-new concepts or maturing existing prototypes.

System Integration

Adapting and scaling proven hardware platforms to your exact use case.

Embedded Software

Porting, customized OS development, and mass-deployment services.

  • Windows, Linux & Android Image Capture
  • Custom Golden Master Image Creation
  • Mass OS Deployment Services
  • Custom BIOS & Firmware Configuration
  • OS Lifecycle & Update Management
  • Driver Integration & Compatibility Validation

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Click here to find out more.