DFI HPT253 AMD Ryzen Embedded 8000 Series 4″ EPIC SBC

  • Product Name: DFI HPT253
  • Motherboard Form Factor: 4″ EPIC SBC
  • CPU: AMD Ryzen Embedded 8000 Series
  • RAM: Dual DDR5-5600 SODIMM, up to 96GB
  • Expansion: 1x M.2 M-Key, 1x M.2 B-Key, 1x M.2 E-Key
  • Other features: Quad display support (HDMI, LVDS, DP, DP Type-C Alt Mode); 2x 2.5GbE, 1x GbE; USB 3.2, USB-C; 3x COM, 1x COM/DIO

Description

The DFI HPT253 is a compact and high-performance 4-inch EPIC single board computer (SBC) powered by the AMD Ryzen Embedded 8000 Series processor, designed for advanced industrial edge computing and embedded applications requiring strong graphics, AI capability, and multi-display support. It supports dual-channel DDR5-5600 SODIMM memory up to 96GB, delivering high bandwidth and responsiveness for demanding workloads such as automation, vision systems, and industrial control.

For visual applications, the board enables quad-display output via HDMI, LVDS, DisplayPort, and USB-C Alt Mode, making it ideal for multi-screen HMI, kiosks, and control systems. Expansion flexibility is provided through multiple M.2 slots (M-Key, B-Key, and E-Key), allowing integration of NVMe storage, wireless modules, and other peripheral cards. Connectivity is extensive, featuring dual 2.5GbE LAN, one Gigabit Ethernet port, USB 3.2, USB-C, and multiple COM ports, ensuring compatibility with a wide range of industrial devices and legacy systems.

Overall, the HPT253 is a powerful and versatile embedded platform built for edge AI, industrial automation, smart manufacturing, and advanced HMI solutions where performance, connectivity, and reliability are critical.

Key Features

    • AMD Ryzen Embedded 8000 Processor
    • Dual DDR5-5600 SODIMM up to 96GB
    • Quad Displays: HDMI + LVDS + DP + DP Type C Alt mode
    • Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Rich I/O: 2 2.5GbE, 1 GbE, 2 USB 3.2, 1 USB-C, 3 COM, 1 COM/DIO

Specification

Category Specification
Processor AMD® Ryzen™ Embedded 8000 Series (up to 45W TDP);
Ryzen™ Embedded 8845HS (8C, up to 5.0GHz);
Ryzen™ Embedded 8640U (6C, up to 4.9GHz)
Memory Dual DDR5-5600 SODIMM, up to 96GB
BIOS AMI SPI 256Mbit
Graphics AMD® Radeon™ RDNA3 Graphics
Display Interfaces HDMI 2.0, LVDS/eDP, DisplayPort 1.4, DisplayPort Type-C Alt Mode
Max Resolution HDMI/DP up to 4096×2160 @ 60Hz; LVDS up to 1920×1200 @ 60Hz
Multi-Display Quad display support: HDMI + LVDS + DP + DP Type-C Alt Mode
Expansion 1× M.2 M-Key 2280 (PCIe Gen4 x4); 1× M.2 B-Key 3052 (USB 3.0/2.0, SIM for 4G/5G); 1× M.2 E-Key 2230 (USB 2.0 / PCIe x1)
Ethernet 2× Intel® I226V 2.5GbE RJ-45; 1× Intel® i210AT Gigabit Ethernet (optional OOB support)
Front I/O 2× USB 3.2; 1× USB 2.0; 1× USB Type-C (USB 3.2); HDMI/LVDS/DP/DP Type-C display outputs; audio (Line-out/Line-in/Mic-in); power & reset buttons
Rear I/O COM ports (RS-232/422/485 and RS-232 configurations as specified)
Internal I/O 2× USB 2.0 headers (1.0mm pitch); 1× SATA 3.0
Serial Ports COM1 RS-232/422/485; COM2 RS-232; COM3 RS-232; COM4 RS-232/422/485 or 8-bit DIO (jumper selectable)
Storage 1× SATA 3.0
Cooling Smart FAN support
Watchdog Timer Programmable system reset (1–255 seconds)
Security TPM 2.0
Power Input 9–36V DC
Power Connector DC-in jack; optional 4-pin right-angle connector
RTC Battery CR2032 coin cell (cable type)
Operating System Windows 11 IoT Enterprise 64-bit; Linux support
Operating Environment Operating: 0°C to 60°C; Storage: -40°C to 85°C; 5–90% RH
Form Factor 4″ SBC
Dimensions 165mm × 115mm (6.49″ × 4.53″)
PCB Thickness 1.6mm
Certifications CE, FCC, RoHS
Packing List 1× HPT253 motherboard; 1× cooler (TBD)
Country of Origin Taiwan

Ordering Information

Model Name Part Number Description
HPT253-BCN-8845HS TBD AMD Ryzen Embedded 8845HS, 8 cores, 45W, HDMI + LVDS + DP + DP Type C Alt mode, 3 LAN, 4 COM, 2 USB 3.2, 9~36 VDC, 0~60°C
HPT253-BCN-8640U TBD AMD Ryzen Embedded 8640U, 6 cores,28W, HDMI + LVDS + DP + DP Type C Alt mode, 3 LAN, 4 COM, 2 USB 3.2, 9~36 VDC, 0~60°C

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