IEI TANK-XM813 15th Gen Core Ultra 2 (Arrow Lake) Fanless Computer

  • Product Name: IEI TANK-XM813
  • System Type: Fanless Embedded Computer
  • CPU: 15th Gen Intel Core Ultra 9/7/5 (Arrow Lake-S), LGA1851, Max 65W TDP
  • RAM: 16GB DDR5 5600 (Up to 96GB)
  • Expansion: Multiple internal expansion boards, optional backplanes, and chassis
  • Other Features: Dual 2.5GbE ports, multiple USB and serial ports, CE/FCC compliant

Description

The IEI TANK-XM813 is a high-performance fanless embedded computer designed for industrial applications requiring reliability, flexibility, and powerful processing. Equipped with support for 15th Gen Intel Core Ultra processors (Arrow Lake-S) up to 65W TDP, this system delivers exceptional computing power while maintaining energy efficiency. With 16GB DDR5 5600 memory pre-installed (expandable up to 96GB), the TANK-XM813 ensures smooth multitasking and rapid data processing. Its dual 2.5GbE ports provide fast and stable network connectivity, making it ideal for edge computing, automation, and AI-based applications.

Designed for expandability, the system features multiple internal expansion boards, optional backplanes, and chassis configurations, allowing for customized solutions tailored to specific industrial needs. A variety of USB and serial ports ensures compatibility with a wide range of peripherals. Built to withstand demanding environments, the IEI TANK-XM813 is CE/FCC compliant, ensuring it meets high industry standards for safety and performance. Whether deployed in manufacturing, automation, or AI-driven applications, this rugged embedded system delivers unparalleled reliability and versatility.

Key Features

  • Supported CPUs: LGA1851 socket 15th generation Intel Core Ultra 9/7/5 processors (Arrow Lake -S ) (MAX 65W TDP)
  • DDR5 5600 (16GB pre-installed) (up to 96GB)
  • 2 x 2.5GbE ports
  • Multiple USB ports and serial ports
  • Multiple internal expansion boards for flexible selection
  • Various optional backplanes and chassis
  • CE/FCC compliant

Specification

Category Specification
CPU LGA1851 socket, supports 15th Gen Intel® Core™ Ultra 9/7/5 (Arrow Lake-S) (Max 65W TDP)
Chipset W880
System Memory 2 x SO-DIMM DDR5 5600 (16GB pre-installed, up to 96GB)
Power DC Jack: 12V28V DC Terminal Block: 12V28V DC
USB Ports 7 x USB 3.2 Gen2
Ethernet 2 x RJ-45: 2.5 GbE (Intel® I226V, colay I226LM)
COM Ports 2 x RS-232/422/485
4 x RS-232
Digital I/O 12-bit Digital I/O (6-in / 6-out)
Display 1 x HDMI
1 x DP++
1 x USB4 (Display + USB 3.2 Gen2)
Audio 1 x Mic
1 x Line-out
TPM Supports Intel PTT
2 x 10-pin TPM connector
Watchdog Timer Programmable 1 ~ 255 sec/min
Expansion Slots 1 x M.2 2280 M-key (PCIe Gen4 x4)
1 x M.2 2230 A-key (USB + PCIe x1, supports vPRO)
Optional backplane support
Cooling Method Fanless
4-pin external system fan connector
Drive Bays 2 x 2.5” SATA 6Gb/s HDD/SSD bays
Buttons 1 x Power button
1 x Reset button
1 x AT/ATX switch
Indicators 1 x Power LED (green)
1 x HDD LED (yellow)
Construction Extruded aluminium alloy
Colour Black
Dimensions 230.6 x 256.04 x 76.2 mm
Weight 3.2 / 3.5 kg
Operating Temperature -20°C ~ 60°C with airflow (CPU TDP 35W & SSD)
-20°C ~ 50°C with airflow (CPU TDP 65W & SSD)
Humidity 10% ~ 95% non-condensing
Operating Vibration Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD)
Operating Shock MIL-STD-810G 514.6C-1 (SSD)
Safety & EMC CE/FCC compliant
OS Support Microsoft Windows 10 / Windows 11, Linux

Ordering Information

Model Description
TANK-XM813-U9AD-R10 Ruggedized Fanless Embedded System with Intel® Ultra 9, 16GB RAM, 1x HDMI, 1x DP++, USB4, 12~28V DC, and RoHS
TANK-XM813-U7AD-R10 Ruggedized Fanless Embedded System with Intel® Ultra 7, 16GB RAM, 1x HDMI, 1x DP++, USB4, 12~28V DC, and RoHS
TANK-XM813-U5AD-R10 Ruggedized Fanless Embedded System with Intel® Ultra 5, 16GB RAM, 1x HDMI, 1x DP++, USB4, 12~28V DC, and RoHS
TANK-XM813-R10 Ruggedized Fanless Embedded System supporting Intel® 15th Gen CPU, 2x DDR5 SODIMM, 1x HDMI, 1x DP++, USB4, 2x RS232/422/485, 4x RS232, 7x USB 3.2, 12x GPIO, Audio, 12~28V DC, and RoHS

IEI Tank Embedded Computers

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

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Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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