Jetway HBJC150I225 12th/13th/14th Gen 1U Rackmount

  • Product Name: Jetway HBJC150I225
  • System Type: 1U Rackmount system with a 1U FLEX 400W Power Supply
  • CPU: Supports Intel LGA1700 12th/13th/14th Gen Socket Processors
  • RAM: 2x DDR5 4800MHz/5600MHz SO-DIMM slots, supporting up to 96GB
  • Expansion: 1x DP, 1x HDMI, and 1x VGA for triple display support
  • Other features: Dual Ethernet ports (1GbE and 2.5GbE), rich I/O (8x USB, 2x COM, audio jack), and optional onboard TPM 2.0 security

Description

The Jetway HBJC150I225 is a space-efficient 1U rackmount chassis powered by Intel’s 12th, 13th, and 14th Gen LGA1700 socket processors. Designed to deliver heavy-duty desktop-class performance in a streamlined form factor, it supports up to 96GB of high-speed DDR5 memory across dual SO-DIMM slots. Equipped with dynamic display capabilities, the system supports up to three simultaneous independent displays via DisplayPort, HDMI, and VGA. Fast network throughput is delivered through dual Ethernet ports (1GbE and 2.5GbE), making it an ideal choice for network appliances, firewalls, and data routing.

With an abundant I/O suite—including 8 USB ports, 2 COM ports, and dedicated audio connections—alongside optional onboard TPM 2.0 hardware security, the HBJC150I225 provides flexible connectivity and robust data protection. Driven by an efficient 400W 1U FLEX power supply, this rackmount system offers exceptional reliability for demanding operational environments.

Key Features

  • Supports Intel 12th/13th/14th Gen Processors: LGA1700 Socket (Max 65W TDP).
  • Support Intel LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 65W)
  • DDR5 Memory: 2x 4800MHz/5600MHz SO-DIMM up to 96GB.
  • Triple Display Support: 1x DP, 1x HDMI, 1x VGA.
  • Dual Ethernet Ports: 1GbE and 2.5GbE for faster networking
  • Comprehensive I/O: 8x USB, 1x MIC, 1x Line-out, 1x Line-in, 2x COM
  • Onboard TPM 2.0 (optional): Enhanced data security.
  • 1U FLEX 400W Power Supply: Efficient power for rackmount systems.

Specification

SYSTEM
MB FORM FACTOR Mini-ITX
CPU Intel® LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 65W)
CHIPSET Intel® Q670E/H610/H610E
MEMORY 2 x DDR5 4800MHz SO-DIMM, up to 96GB
2 x DDR5 5600MHz SO-DIMM, up to 64GB (Intel® 13th/14th Gen CPU)
BIOS AMI Flash ROM
SECURITY TPM2.0
RTC BATTERY Lithium Battery
OS SUPPORT Windows® 11 (64bit)
Linux
POWER
POWER REQUIREMENT ATX Power Supply
1U FLEX 400W ATX PWR (4+24 pin)
POWER ON MODE ATX (Default) Mode
DISPLAY
GPU Intel® UHD Graphics
DP 1 x DP1.4a (Max Resolution: 4096 x 2304@60Hz)
HDMI 1 x HDMI 2.0b (Max Resolution: 4096 x 2160@60Hz)
VGA 1 x VGA (Max Resolution: 1920 x 1080 @60Hz)
MULTIPLE DISPLAY Support 3 Displays
AUDIO
CODEC Realtek Audio Codec
LAN
ETHERNET 1 x Intel® i219-LM GbE + 1 x Intel® i225-V 2.5GbE (Q670)
1 x Intel® i219-V GbE + 1 x Intel® i225-V 2.5GbE (H610)
SYSTEM I/O
REAR PANEL I/O 2 x RJ45
6 x USB 3.2 Gen.2 (HBJC150I225-Q670)
4 x USB 3.2 Gen.2 + 2 x USB2.0 (HBJC150I225-H610)
1 x HDMI
1 x DP
1 x VGA
2 x COM
1 x Line-in
1 x Line-out
1 x MIC-in
FRONT PANEL I/O 1 x Power Button
1 x Reset Button
2 x USB 2.0
1 x Power LED
1 x HDD LED
STORAGE
SATA 2 x SATA III (6 Gb/s) 2.5” Device, (HBJC150I225-Q670 support RAID 0, 1)
EXPANSION
M.2 1 x M-key 2280 (PCIe Gen.3 x4 interface) support NVMe
1 x M-Key 2242 (PCIe Gen.4 x4/SATA interface) support NVMe (HBJC150I225-Q670 only)
1 x E-Key 2230 (USB 2.0/PCIe 3.0 x1) Support CNVi
1 x B-key 3042 (PCIe Gen.3 x1/USB3.2 Gen.2/USB2.0 interface) (HBJC150I225-Q670 only)
1 x B-key 3042 (PCIe Gen.3 x1 interface) (HBJC150I225-H610 only)
PCIe 1 x PCI Express x16 (Gen.4)
SIM 1 x SIM Card Slot
OTHERS
OTHER 1 x GPIO (8 Bit)
MECHANICAL
DIMENSIONS (W x D x H) 430.0 (W) x 252.0 (D) x 44.0 (H) mm
GROSS WEIGHT 5.2 kg
NET WEIGHT 4.2 kg
ENVIRONMENT & CERTIFICATION
SHOCK 15G, 11ms duration
VIBRATION 1 Grms/ 5~ 500Hz/ Operation
OPERATING TEMPERATURE 0°C ~ 50°C (32°F ~ 122°F)
STORAGE TEMPERATURE -40°C ~ 85°C (-40°F ~ 185°F)
OPERATING HUMIDITY 10 ~ 90% @ 40°C, Non-condensing
CERTIFICATION CE/FCC Class A
LVD
ESG DECLARATION EU RoHS
China RoHS
ErP

BVM Customisation Service
Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

Build to Order Banner

Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs, Panel PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Android image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images
  • Custom BIOS

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.