ASRock Industrial SBC-371 13th Gen Raptor Lake 3.5″SBC

  • Product Name: Asrock Industrial SBC-371
  • Motherboard Form Factor: 3.5″ SBC
  • CPU: Intel 13th Gen Raptor Lake-P MCP Processors
  • RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 64 GB (32GB per DIMM)
  • Expansion: 1 x PCIe x1, 2 x USB 3.2 Gen2x2, 3 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x M.2 Key B, 3 x COM, 1 x SATA3
  • Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type-C), 1 x LVDS or eDP, TPM 2.0 onboard IC, Supports Intel vPro (SBC-371P/SBC-371M), VMD RAID 0/1, 12~36V DC-In PWR/ 12V DC-In only (BOM option)

Description

Introducing the ASRock Industrial SBC-371, a cutting-edge 3.5″ Single Board Computer (SBC) engineered for robust performance with Intel® 13th Gen Raptor Lake-P MCP Processors. This compact powerhouse is designed to elevate your computing experience, supporting 2 x 260-pin SO-DIMM DDR4 slots with speeds up to 3200 MHz, providing a maximum of 64GB (32GB per DIMM) for efficient multitasking.

Versatility is at its core with 1 x PCIe x1, 2 x USB 3.2 Gen2x2, 3 x USB 3.2 Gen2, and 2 x USB 2.0 ports, along with 1 x M.2 Key M, 1 x M.2 Key E, and 1 x M.2 Key B slots for flexible expansion. Storage options include 1 x SATA3 port, and networking capabilities are robust with 2 x Intel 2.5 Gigabit LAN.

Experience a versatile display setup with support for quad displays, featuring 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type-C), and 1 x LVDS or eDP. Security features include an onboard TPM 2.0 IC, and for enhanced manageability, it supports Intel® vPro (SBC-371P/SBC-371M) and VMD RAID 0/1.

Power your system with a wide range of options, thanks to the 12~36V DC-In PWR or the 12V DC-In only (BOM option). The ASRock Industrial SBC-371 is a compact and powerful solution, redefining the benchmarks for 3.5″ SBCs and offering a perfect blend of performance, connectivity, and security for diverse computing applications.

key Features

  • Intel® 13th Gen Raptor Lake-P MCP Processors
  • 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 64 GB (32GB per DIMM)
  • 1 x PCIe x1, 2 x USB 3.2 Gen2x2, 3 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x M.2 Key B, 3 x COM, 1 x SATA3
  • 2 x Intel 2.5 Gigabit LAN
  • Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type-C), 1 x LVDS or eDP
  • TPM 2.0 onboard IC
  • Supports Intel® vPro (SBC-371P/SBC-371M), VMD RAID 0/1
  • 12~36V DC-In PWR/ 12V DC-In only (BOM option)

Specification

Form Factor  
   
Dimensions 3.5″SBC (5.8-in x 4-in x 0.94-in, 14.7 cm x 10.2 cm x 2.40 cm)
Processor System  
   
CPU Intel® 13th Gen (Raptor Lake-P) Core™ Processors
SBC-371P (i7-1365UE, 2P+8E)
SBC-371M (i5-1335UE, 2P+8E)
SBC-371V (i3-1315UE, 2P+4E)
Chipset MCP
BIOS AMI SPI 256 Mbit
Memory  
   
Technology Dual Channel DDR4 3200 MHz
Capacity 64GB (32GB per DIMM)
Socket 2 x 260-pin SO-DIMM
Graphics  
   
Controller Intel® Iris® Xe Graphics
HDMI HDMI 2.0b
Max resolution up to 4096 x 2160@60Hz
DisplayPort DP 1.4a
Max resolution up to 4096 x 2160@60Hz
LVDS Dual channel 24 bit up to 1920 x 1200@60Hz
(Connector shared with eDP)
eDP Max resolution up to 1920 x 1080@60Hz
(Connector shared with LVDS)
MultiDisplay Quad display (Included 2 output from Type-C)
Expansion Slot  
   
PCIe 1 x PCIe x1 Gen3 (supports up to 10W)
M.2 1 x M.2 (Key E, 2230) with PCIe x1, USB 2.0 and CNVi for Wireless
1 x M.2 (Key B, 3042/3052) with PCIe x1 or SATA3 and USB 3.2 and USB 2.0 and SIM for 4G/5G
SIM Socket 1 x SIM socket connected to M.2 key B
Audio  
   
Interface Realtek ALC233 HD, High Definition Audio. Line-out, Mic-in
Ethernet  
   
Controller/ Speed SBC-371P/SBC-371M
LAN1: Intel® I226LM with 10/100/1000/2500 Mbps, supports vPro
LAN2: Intel® I226V with 10/100/1000/2500 Mbps
SBC-371V
LAN1: Intel® I226LM with 10/100/1000/2500 Mbps
LAN2: Intel® I226V with 10/100/1000/2500 Mbps
Connector 2 x RJ-45
Rear I/O  
   
HDMI 1 x HDMI2.0b
DisplayPort 1 x DP 1.4++
USB 2 x USB 3.2 Gen2
2 x USB 3.2 Gen2x2 (Type-C, 5V/3A, support DP 1.4a display output)
Ethernet 2 x 2.5 Gigabit LAN
Internal Connector  
   
USB 1 x USB 3.2 Gen 2
2 x USB 2.0 (1 x 2.54 pitch header)
COM COM1, COM3, COM4 (RS-232/422/485)
GPIO 4 x GPI, 4 x GPO
LVDS 1 (Connector with LVDS/eDP signal, switch by BIOS)
SATA PWR Output 1
Speaker Header 1
Storage  
   
M.2 1 x M.2 (Key M, 2242/2260/2280) with PCIex4 for SSD
SATA 1 x SATA3 (6Gb/s)
RAID Intel® VMD RAID 0/1
**supported by PCIE interface
PCIE interface: M.2 Key B+ M.2 Key M
Security  
   
TPM TPM 2.0 onboard IC
Watchdog Timer  
   
Output From Super I/O to drag RESETCON#
Interval 256 Segments, 0, 1, 2, …255sec
Power Requirements  
   
Input PWR 12~36V DC-In with 4-pin wafer PWR cable or DC Jack
12V DC-In only (BOM option)
Power On AT/ATX Supported
– AT : Directly PWR on as power input ready
– ATX : Press button to PWR on after power input ready
Environment  
   
Operating Temp -20ºC ~ 70ºC
Storage Temp -40° C ~ 85° C
Operating Humidity 5% ~ 90%
Storage Humidity 5% ~ 90%
Accessories  
   
Gift Package 1 x Heat Spreader 102.22*147.01mm (13G070252031AK)
3 x SCREW M2*2,D=5 (13G020302031AK)
2 x COM Cable (14G000000310AK)
1 x SATA Data Cable (14G00010107DAK)
1 x SATA Power Cable (14G000100410AK)
1 x DC-in Cable (14G000600900AK)
Bulk Package 3 x SCREW M2*2,D=5 (13G020302031AK)

BVM Customisation Service

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If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

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Embedded Software: Configuration, Integration and Deployment

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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

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• Burn in Test
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