Seiko 3″ MP-B30L IP54 Mobile (portable) Label Printer

• Seiko – MP-B30L – Mobile / Portable Thermal Label Printer

• 3″ Mobile Label and Receipt Printer, IP54, 1,8m drop rate

Description

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Seiko Mobile Thermal Printer Series – Stylish and easy to operate.

The new MP-B30L (3″) from Seiko is capable of printing labels and complements our range of products for the Logistics, Retail and Healthcare sectors. Our MP mobile printer series is known for its reliability, performance and durability while weighing only 395g including the battery. The MP-B30L achieves the fastest printing speed in its class (130mm/sec) and drop resistance (1.8m).

It supports a variety of operating systems such as Windows and Android, and offers smart wireless connectivity with mobile devices such as smartphones and tablets via Bluetooth and wireless LAN. Making it easy to use anywhere and everywhere. In addition to being used for receipt printing, it is also an ideal product for label printing for business use such as food labels for takeout and delivery products and label tags for warehouse and logistics management.

Features

  • Ultra Small Mobile Label Printer
  • Compact & Light Weight
  • Drop rating: 1,8m (6 feet), IP rating: IP54
  • Printing Speed: 130mm/s max
  • Simple Operation & Stylish Design
  • Optional Cradle for Charging

SII Portable Print Service for Android and iOS

The Print Service recognizes Bluetooth and WLAN coupled Seiko Instruments printers, and allows printing directly from various apps (for example the browser).

The following printers are supported:

  • MP-B20 – 2″ Portable Printer
  • MP-B30 – 3″ Portable Printer
  • MP-B30L – 3″ Portable Printer
  • MP-A40 – 4″ Rugged Portable Printer
  • DPU-S445 – 4″ Portable Printer
  • RP-F10 – POS Receipt Printer
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Specification

   
*1 with Partition plate (option) *2 Selected model. *3 This number is test result based on SII procedures, not guaranteed value. *4 Use recommended thermal papers *5 Excluding protrusion *6 with battery, without paper roll *7 Please see “Associated software tool” for details.
ESC/POS™: Registered trademark of SEIKO EPSON CORP.
Windows® is the registered trademark of Microsoft Corporation(USA).
AndroidTM is a trademark of Google Inc.
iPad, iPhone, iPod are trademarks of Apple Inc., registered in the U.S. and other countries.
iOS is a trademark or registered trademark of Cisco in the U.S. and other countries and is used under license.
Printing Method Thermal line dot printing
Number of dots/line 576
Resolution (dots/mm) 8
Paper width (mm) 80+0-1 / 76.2+0-1 / 58+0-1
Printing width (mm) 72
Speed (mm/sec) max 130
Outside diameter of paper roll (mm) max ф 51
Character matrix (H×W mm) 24 x 12, 24 x 24, 16 x 8, 16 x 16
Character dimensions (H×W mm) 3.0 × 1.5, 3.0 × 3.0, 2.0 × 1.0, 2.0 × 2.0
Type of Paper Roll paper, Label roll paper
Character type Code page(17pages), Optional font, Downloaded character,
User-defined character, JIS 1&2 Level Kanji, Special character
Bar code UPC-A/E, JAN(EAN)8/13, ITF, CODE39, CODABAR, CODE93, CODE128, PDF417, QR Code, MaxiCode, Data Matrix, GS1 Databar, AZTEC
Power supply Li-ion Battery
Communication interface USB, Bluetooth®, W-LAN*1
Input buffer 4K bytes
Command ESC/POS™ conformity, ZPL Ⅱ™ conformity, CPCL conformity
Cutting method Tear bar
Drop Rating 1.8m*2
Operating Temperature (°C) -20 to 55
Service life: Abrasion resistance (km) 50*3
Dimensions (W×D×H mm) 105 × 126 × 58*4
Mass (g) 395*5
Standard FCC, CE, VCCI
Bundled items AC adapter, Battery, USB cable, Belt clip
Options Cradle for charging,
Single battery charger, Quad battery charger,
Car charger, Strap, Carrying case
Software*6 Printer driver, OPOS, POS for .NET, Android™(SDK),iOS SDK,
Xamarin SDK, URL Print Agent

Printer Drivers / SDK

Please see https://seiko-instruments.de/thermal-printer/ for the latest drivers.

Video

BVM Design and Manufacturing

BVM Customisation Service
Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Embedded Product Design

Turnkey solutions for brand-new concepts or maturing existing prototypes.

System Integration

Adapting and scaling proven hardware platforms to your exact use case.

Embedded Software

Porting, customized OS development, and mass-deployment services.

  • Windows, Linux & Android Image Capture
  • Custom Golden Master Image Creation
  • Mass OS Deployment Services
  • Custom BIOS & Firmware Configuration
  • OS Lifecycle & Update Management
  • Driver Integration & Compatibility Validation

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Click here to find out more.