DFI ADS630-R680E/Q670E 12th Gen Alder Lake ATX Motherboard

DFI ADS630-R680E/Q670E ATX, 12th Gen Intel Core, 4 DDR4 UDIMM, 1 PCIe x16, 4 PCIe x4, 2 PCI, 2 M.2 M key, 1 M.2 E Key, 1 VGA, 1 HDMI, 2 DP++

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Description

  • 12th Gen Intel® Core Processors
  • 4 DDR4 UDIMM up to 128GB
  • Quad Displays: VGA + 2 x DP++ + HDMI
  • Supports 8K/ 4K resolution
  • Multiple Expansion: 1 PCIe x16(Gen 5), 4 PCIe x4(Gen 4), 2 PCI, 2 M.2 M key, 1 M.2 E Key
  • Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 4 USB 3.2 Gen1, 3 USB 2.0

Specification

System

Processor
12th Generation Intel® LGA 1700 Socket Processors, TDP support up to 125W
Intel® Core™ i9-12900E (16 Cores, 30M Cache, up to 5.0 GHz); 65W
Intel® Core™ i9-12900TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W
Intel® Core™ i7-12700E (12 Cores, 25M Cache, up to 4.8 GHz); 65W
Intel® Core™ i7-12700TE (12 Cores, 25M Cache, up to 4.6 GHz); 35W
Intel® Core™ i5-12500E (6 Cores, 18M Cache, up to 4.5 GHz); 65W
Intel® Core™ i5-12500TE (6 Cores, 18M Cache, up to 4.3 GHz); 35W
Intel® Core™ i3-12100E (4 Cores, 12M Cache, up to 4.2 GHz); 60W
Intel® Core™ i3-12100TE (4 Cores, 12M Cache, up to 4.0 GHz); 35W
Intel® Pentium® G7400E (2 Cores, 6M Cache, 3.6 GHz); 46W
Intel® Pentium® G7400TE (2 Cores, 6M Cache, 3.0 GHz); 35W
Intel® Celeron® G6900E (2 Cores, 4M Cache, 3.0 GHz); 46W
Intel® Celeron® G6900TE (2 Cores, 4M Cache, 2.4 GHz); 35W
Chipset
Intel® R680E/Q670E Chipset
Memory
Four 288-pin UDIMM up to 128GB
Dual Channel DDR4 3200 MHz (ECC support: R680E only)
BIOS
AMI SPI 256Mbit

Graphics

Controller
Intel® HD Gen 9 Graphics
Feature
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
Display
1 x VGA, resolution up to 1920×1200 @ 60Hz
2 x DP++, resolution up to 7680×4320 @ 60Hz
1 x HDMI 2.0a, resolution up to 4096×2160 @ 24Hz
Quad Displays
VGA + 2 x DP++ + HDMI

Expansion

Interface
1 x PCIe x16 (Gen 5)
3 x PCIe x4 (Gen 4)
1 x PCIe x4 (Gen 4) (Default, co-lay M.2 M key)
2 x PCI
1 x M.2 2230 E key (PCIe/USB 2.0/Intel CNVi support)(Discrete Wifi 6E support)
1 x M.2 2242/2260/2280 M key (Opt. co-lay PCIe x4 Gen 4.0 NVMe with intel RST support)
1 x M.2 2242/2260/2280 M key (PCIe x4 Gen4 NVMe/Intel Optane Memory support)

Audio

Audio Codec
Realtek ALC888

Ethernet

Controller
2 x Intel® I225LM PCIe (10M/100M/1000Mbps/2.5G) (only Xeon, Core i9/i7/i5 support iAMT)
2 x Intel® x550-AT2 (10 GBASE-T/1 GbE/100 Mbps)

Rear I/O

Ethernet
2 x 2.5GbE (RJ-45)
2 x 10GbE (RJ-45)
USB
4 x USB 3.2 Gen2
4 x USB 3.2 Gen1
Display
1 x VGA
2 x DP++
1 x HDMI 2.0a
Audio
1 x Line-out
1 x Mic-in
1 x Line-in (opt. by request, MOQ required)

Internal I/O

Serial
2 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)
4 x RS-232 (2.54mm pitch)
USB
2 x USB 3.2 Gen 2 (Key B 20-pin)
2 x USB 2.0 (2.54mm pitch, Colay vertical Type A, opt.: MOQ required)
1 x USB 2.0 Vertical Type A
Audio
1 x Front Audio Header
1 x S/PDIF
SATA
4 x SATA 3.0 (up to 6Gb/s)
RAID 0/1/5/10
DIO
1 x 8-bit DIO
SMBus
1 x SMBus
PS/2
1 x PS/2 (2.54mm pitch)

Watchdog Timer

Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds

Security

TPM
Nuvoton TPM2.0 (opt., MOQ required)

Power

Type
ATX
Connector
8-pin ATX 12V power
24-pin ATX power
Consumption
TBD
RTC Battery
CR2032 Coin Cell

OS Support

Microsoft
Windows 10 IoT Enterprise 64-bit
Windows Server 2019
Linux
Linux

Environment

Temperature
Operating: -5 to 65°C
Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery
Humidity
Operating: 5 to 95% RH
Storage: 5 to 95% RH
MTBF
TBD

Mechanism

Dimensions
ATX Form Factor
305mm (12″) x 244mm (9.6″)
Height
PCB: 1.6mm
Top Side: 33.3mm, Bottom Side: 4mm

Standards and Certifications

Certifications
CE, FCC Class B

Packing List

Packing List
1 ADS630 motherboard
1 COM port cables (Length: 300mm, 2 x COM ports) A81-015026-023G
1 Serial ATA data cable (Length: 500mm) 332-553001-005G
1 I/O shield A49-CMS630-000G
1 M.2 screw/standoff A32-112016-041G

Country of Origin

Country of Origin
Taiwan

Datasheet

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If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

 

Design | Develop | Test | Manufacture

Here’s a selection of our design, manufacturing

& associated services: –

 

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.DesignToOrder

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:BuildToOrder

  • Custom specification (CPU, Ram, I/O, Storage)
  • Chassis customisation and branding
  • Custom BIOS
  • Software – Custom OS Image
  • Custom Packaging and branding
  • Integrating newly designed or existing hardware into a larger system

Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & DeploymentEmbeddedSoftware

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images?
  • Custom BIOS

Manufacturer : DFI

Motherboard

  • Form Factor : ATX

CPU

  • Powered By : Intel
  • CPU Family : Celeron, iCore, Pentium
  • CPU Generation : Alder Lake
  • CPU Model : G6900E, G6900TE, G7400E, G7400TE, i3-12100E, i3-12100TE, i5-12500E, i5-12500TE, i7-12700E, i7-12700TE, i9-12900E, i9-12900TE
  • CPU Speed :
  • CPU Cores : 12 Cores, 16 Cores, 6 Cores, Dual Core, Quad Core

Memory

  • Memory Installed :
  • Memory Slots : 4
  • Memory Type : 3200Mhz DDR4

I/O and Expansion

  • Expansion Slots : M/2, PCIe, SATA
  • LAN Ports : 4
  • Serial Ports : 6
  • USB 2 Ports : 3
  • USB 3 Ports :
  • USB 3.1 Ports : 10
  • Video Output : DisplayPort, HDMI, VGA
  • Multi Display : Quad Display
  • Wireless Connectivity :

Operating System

  • OS : Linux, Windows

Certifications

  • Certifications :

Industry

  • Industry :

Features

  • 24/7 Use :
  • 4G-GPS :
  • Artificial Intelligence Use : Artificial Intelligence, Machine Learning, Machine Vision
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT :
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays : Quad
  • NUC :
  • Other Features : GPIO
  • PoE :
  • Rugged : Yes
  • Ryzen :
  • System Type :
  • Touchscreen :
  • Whiskey Lake :
  • Wide Temp : Yes

Categories :