DFI RPS9HC Intel Raptor Lake S COM-HPC

  • Product Name: DFI RPS9HC
  • Motherboard Form Factor: COM-HPC
  • CPU: 13th Gen Intel Core with Intel R680E/Q670E/H610E Chipset
  • RAM: 4 DDR5 SODIMM 3600MHz up to 128GB
  • Expansion: Multiple Expansion: 1 PCIe x16, 4 PCIe x4, 2 PCIe x1
  • Other features: Quad Displays: eDP + 3 DDI; DDI supports up to 8K; Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0; Typically supports 10-Year CPU Life Cycle Until Q1’ 38
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Description

Introducing the DFI RPS9HC Intel Raptor Lake S COM-HPC, a powerhouse solution for high-performance computing needs. Engineered with the 13th Gen Intel Core and supported by the Intel R680E/Q670E/H610E Chipset, this versatile module accommodates up to 128GB of DDR5 SODIMM at 3600MHz for a seamless and responsive experience. Immerse yourself in stunning visuals with Quad Displays, comprising eDP and 3 DDI, with DDI supporting up to 8K resolution.

Expand your possibilities with multiple expansion options, including 1 PCIe x16, 4 PCIe x4, and 2 PCIe x1. Enjoy efficient networking with 2 Intel 2.5GbE ports and streamline data transfer with 6 USB 3.2 Gen2 and 8 USB 2.0 ports. Additionally, benefit from a typically supported 10-year CPU life cycle until Q1’38, ensuring longevity and reliability for your computing needs. Elevate your performance with the DFI RPS9HC, combining advanced features and extended support in a compact and powerful form factor.

Key Features

  • 13th Gen Intel® Core™ with Intel® R680E/Q670E/H610E Chipset
  • 4 DDR5 SODIMM 3600MHz up to 128GB
  • Quad Displays: eDP + 3 DDI
  • DDI supports up to 8K
  • Multiple Expansion: 1 PCIe x16, 4 PCIe x4, 2 PCIe x1
  • Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0
  • Typically supports 10-Year CPU Life Cycle Until Q1’ 38 (Based on Intel IOTG Roadmap), and available for an additional 5 years support under SPS Process.

Specification

System
Processor
13th Gen Intel® Core™ Processors, LGA 1700 Socket Processors, TDP support up to 65W
Intel® Core™ I9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); 65W
Intel® Core™ I9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); 35W
Intel® Core™ I7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); 65W
Intel® Core™ I7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W
Intel® Core™ I7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); 35W
Intel® Core™ I5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); 65W
Intel® Core™ I5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); 35W
Intel® Core™ I5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); 35W
Intel® Core™ I5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); 65W
Intel® Core™ I3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); 60W
Intel® Core™ I3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); 35W
Intel® Core™ I3-13100T (4 Cores, 12M Cache, up to 4.2 GHz); 35W
Chipset
Intel® R680E/Q670E/H610E Chipset
Memory
4pcs DDR5 SO-DIMM up to 128GB
Dual Channel DDR5
ECC support by R680 with i7 and i5
BIOS
AMI SPI 256Mbit
Graphics
Controller
Intel® HD Gen 9 Graphics
Feature
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
Display
3 x DDI (HDMI/DP++) support to 8K
1 x eDP support to 5K
Quad Displays
eDP + 3 DDI
Expansion
Interface
1 x PCIe x16 (Gen5)
4 x PCIe x4 (Gen4)
2 x PCIe x4 (Gen3)
2 x PCIe x1 (Gen3)
1 x PCIe x16 (Gen 4)
8 x PCIe x1 (Gen 3)
1 x eSPI
1 x I2C
1 x SMBus
2 x UART (TX/RX/RTS/CTS)
Audio
Audio Codec
HD Audio
Ethernet
PHY
2 x Intel® I226 series (10/100/1000Mbps/2.5G)
I/O
USB
4 x USB 3.2 Gen2
8 x USB 2.0
SATA
2 x SATA 3.0 (up to 6Gb/s)
GPIO
12 bit in/out
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
TPM2.0 (Available Upon Request)
Power
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Consumption
TBD
OS Support
Microsoft
Windows 10 IoT Enterprise 64-bit
Linux
Ubuntu 20.04
Environment
Temperature
Operating: 0 to 60°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
COM HPC® Client Size C
6.30″ x 4.72″ (160mm x 120mm)
Compliance
PICMG COM HPC® R1.15, Client Size C
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
• COM836 carrier board kit, 770-COM8361-000G
Country of Origin
Country of Origin
Taiwan

Ordering Information

Model Name Part Number Description
RPS9HC-R680E-BS-13900E 770-RPS9HC1-000G Intel® Core™ i9-13900E, R680E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C
RPS9HC-Q670E-BS-13700E 770-RPS9HC1-100G Intel® Core™ i7-13700E, Q670E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C
RPS9HC-H610E-BS-13100E 770-RPS9HC1-200G Intel® Core™ i3-13100E, H610E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C

Datasheet

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