DFI RPS9HC Intel Raptor Lake S COM-HPC
- Product Name: DFI RPS9HC
- Motherboard Form Factor: COM-HPC
- CPU: 13th Gen Intel Core with Intel R680E/Q670E/H610E Chipset
- RAM: 4 DDR5 SODIMM 3600MHz up to 128GB
- Expansion: Multiple Expansion: 1 PCIe x16, 4 PCIe x4, 2 PCIe x1
- Other features: Quad Displays: eDP + 3 DDI; DDI supports up to 8K; Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0; Typically supports 10-Year CPU Life Cycle Until Q1’ 38
Description
Introducing the DFI RPS9HC Intel Raptor Lake S COM-HPC, a powerhouse solution for high-performance computing needs. Engineered with the 13th Gen Intel Core and supported by the Intel R680E/Q670E/H610E Chipset, this versatile module accommodates up to 128GB of DDR5 SODIMM at 3600MHz for a seamless and responsive experience. Immerse yourself in stunning visuals with Quad Displays, comprising eDP and 3 DDI, with DDI supporting up to 8K resolution.
Expand your possibilities with multiple expansion options, including 1 PCIe x16, 4 PCIe x4, and 2 PCIe x1. Enjoy efficient networking with 2 Intel 2.5GbE ports and streamline data transfer with 6 USB 3.2 Gen2 and 8 USB 2.0 ports. Additionally, benefit from a typically supported 10-year CPU life cycle until Q1’38, ensuring longevity and reliability for your computing needs. Elevate your performance with the DFI RPS9HC, combining advanced features and extended support in a compact and powerful form factor.
Key Features
- 13th Gen Intel® Core™ with Intel® R680E/Q670E/H610E Chipset
- 4 DDR5 SODIMM 3600MHz up to 128GB
- Quad Displays: eDP + 3 DDI
- DDI supports up to 8K
- Multiple Expansion: 1 PCIe x16, 4 PCIe x4, 2 PCIe x1
- Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0
- Typically supports 10-Year CPU Life Cycle Until Q1’ 38 (Based on Intel IOTG Roadmap), and available for an additional 5 years support under SPS Process.
Specification
System |
Processor |
13th Gen Intel® Core™ Processors, LGA 1700 Socket Processors, TDP support up to 65W |
Intel® Core™ I9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); 65W |
Intel® Core™ I9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); 35W |
Intel® Core™ I7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); 65W |
Intel® Core™ I7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W |
Intel® Core™ I7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); 35W |
Intel® Core™ I5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); 65W |
Intel® Core™ I5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); 35W |
Intel® Core™ I5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); 35W |
Intel® Core™ I5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); 65W |
Intel® Core™ I3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); 60W |
Intel® Core™ I3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); 35W |
Intel® Core™ I3-13100T (4 Cores, 12M Cache, up to 4.2 GHz); 35W |
Chipset |
Intel® R680E/Q670E/H610E Chipset |
Memory |
4pcs DDR5 SO-DIMM up to 128GB |
Dual Channel DDR5 |
ECC support by R680 with i7 and i5 |
BIOS |
AMI SPI 256Mbit |
Graphics |
Controller |
Intel® HD Gen 9 Graphics |
Feature |
OpenGL 4.5, DirectX 12, OpenCL 2.1 |
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9 |
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9 |
Display |
3 x DDI (HDMI/DP++) support to 8K |
1 x eDP support to 5K |
Quad Displays |
eDP + 3 DDI |
Expansion |
Interface |
1 x PCIe x16 (Gen5) |
4 x PCIe x4 (Gen4) |
2 x PCIe x4 (Gen3) |
2 x PCIe x1 (Gen3) |
1 x PCIe x16 (Gen 4) |
8 x PCIe x1 (Gen 3) |
1 x eSPI |
1 x I2C |
1 x SMBus |
2 x UART (TX/RX/RTS/CTS) |
Audio |
Audio Codec |
HD Audio |
Ethernet |
PHY |
2 x Intel® I226 series (10/100/1000Mbps/2.5G) |
I/O |
USB |
4 x USB 3.2 Gen2 |
8 x USB 2.0 |
SATA |
2 x SATA 3.0 (up to 6Gb/s) |
GPIO |
12 bit in/out |
Watchdog Timer |
Output & Interval |
System Reset, Programmable via Software from 1 to 255 Seconds |
Security |
TPM |
TPM2.0 (Available Upon Request) |
Power |
Type |
12V, 5VSB, VCC_RTC (ATX mode) |
12V, VCC_RTC (AT mode) |
Consumption |
TBD |
OS Support |
Microsoft |
Windows 10 IoT Enterprise 64-bit |
Linux |
Ubuntu 20.04 |
Environment |
Temperature |
Operating: 0 to 60°C |
Storage: -40 to 85°C |
Humidity |
Operating: 5 to 90% RH |
Storage: 5 to 90% RH |
MTBF |
TBD |
Mechanism |
Dimensions |
COM HPC® Client Size C |
6.30″ x 4.72″ (160mm x 120mm) |
Compliance |
PICMG COM HPC® R1.15, Client Size C |
Standards and Certifications |
Certifications |
CE, FCC, RoHS |
Packing List |
Packing List |
• COM836 carrier board kit, 770-COM8361-000G |
Country of Origin |
Country of Origin |
Taiwan |
Ordering Information
Model Name | Part Number | Description |
RPS9HC-R680E-BS-13900E | 770-RPS9HC1-000G | Intel® Core™ i9-13900E, R680E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C |
RPS9HC-Q670E-BS-13700E | 770-RPS9HC1-100G | Intel® Core™ i7-13700E, Q670E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C |
RPS9HC-H610E-BS-13100E | 770-RPS9HC1-200G | Intel® Core™ i3-13100E, H610E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C |
BVM Custom Carrier Board Design Service:
If you cant find an “off the shelf” carrier board that meets your requirements speak with our in house design team who can customize an existing board or design a new one.
Click here to find out more.
BVM Customisation Service
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.
If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.
Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.
Design | Develop | Test | Manufacture
With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality
Here’s a selection of our design, manufacturing & associated services: –
Design to Order: OEM/ODM Embedded Product Design ServicesFor customers designing a brand-new product from scratch or working with an existing prototype.
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Build to Order: Embedded Computer Design and Customisation ServicesTake an existing system and we can:
Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs Embedded Software Services : Configuration, Integration and DeploymentPorting, Integration & Deployment
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
Testing |
Materials Management |
Logistics and Tracking |
External Manufacturing |
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
Click here to find out more.
BVM Custom Carrier Board Design Service:
If you cant find an “off the shelf” carrier board that meets your requirements speak with our in house design team who can customize an existing board or design a new one.
If you’re unable to find an off-the-shelf carrier board that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing carrier board to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the carrier board not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.
Whether it’s modifying an existing carrier board or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.
At BVM we have been designing custom carrier PCBs for many years and have experienced the changes in technology
From 16-bit CPU modules, disc and network interfaces to the latest high speed PCIe devices, custom power supplies – and, of course, PCB carrier boards, BVM have built up a library of standard building blocks when it comes to producing bespoke electronic designs.
With our in-depth electronics engineering design experience, we’ll ensure your carrier PCB design is a successful one.
Regardless if your choice of COM/SOM module is X86 or ARM based – or even if your design stems from a developer platform such as Raspberry Pi, Jetson, Beagle Bones, Arduino …etc, if your long-term vision lies in a COM/SOM module and custom carrier PCB design for the product you want to bring to market, BVM will ensure your carrier PCB design meets your needs.
Our PCB prototyping and volume manufacturing services include:-
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- Selection and procurement of electronics components
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- Writing of test regime software
How can BVM help you with Carrier Board and PCB design?
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- Experience & expertise – With over 30 years of PCB design experience, we have an in-depth knowledge of carrier PCB board design, their assembly and all other associated aspects concerned with printed circuit board production.
- BVM get it right first time……. The most important aspect of PCB design is accuracy, so it’s important to choose a design partner that provides you with trust backed up with a pedigree & track record in producing carrier designs. BVM ensure your design will be right first time – whether that’s prototypes or further development & final production-ready units to take your product to market.
- Design services based in the UK – BVM’s carrier PCB design services are completed by our in-house CAD team based in Southampton, Hampshire – ensuring the quality of design you’d expect from a British PCB designer
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