DFI RPS9HC Intel Raptor Lake S COM-HPC
- Product Name: DFI RPS9HC
- Motherboard Form Factor: COM-HPC
- CPU: 13th Gen Intel Core with Intel R680E/Q670E/H610E Chipset
- RAM: 4 DDR5 SODIMM 3600MHz up to 128GB
- Expansion: Multiple Expansion: 1 PCIe x16, 4 PCIe x4, 2 PCIe x1
- Other features: Quad Displays: eDP + 3 DDI; DDI supports up to 8K; Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0; Typically supports 10-Year CPU Life Cycle Until Q1’ 38
Description
Introducing the DFI RPS9HC Intel Raptor Lake S COM-HPC, a powerhouse solution for high-performance computing needs. Engineered with the 13th Gen Intel Core and supported by the Intel R680E/Q670E/H610E Chipset, this versatile module accommodates up to 128GB of DDR5 SODIMM at 3600MHz for a seamless and responsive experience. Immerse yourself in stunning visuals with Quad Displays, comprising eDP and 3 DDI, with DDI supporting up to 8K resolution.
Expand your possibilities with multiple expansion options, including 1 PCIe x16, 4 PCIe x4, and 2 PCIe x1. Enjoy efficient networking with 2 Intel 2.5GbE ports and streamline data transfer with 6 USB 3.2 Gen2 and 8 USB 2.0 ports. Additionally, benefit from a typically supported 10-year CPU life cycle until Q1’38, ensuring longevity and reliability for your computing needs. Elevate your performance with the DFI RPS9HC, combining advanced features and extended support in a compact and powerful form factor.
Key Features
- 13th Gen Intel® Core™ with Intel® R680E/Q670E/H610E Chipset
- 4 DDR5 SODIMM 3600MHz up to 128GB
- Quad Displays: eDP + 3 DDI
- DDI supports up to 8K
- Multiple Expansion: 1 PCIe x16, 4 PCIe x4, 2 PCIe x1
- Rich I/O: 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 8 USB 2.0
- Typically supports 10-Year CPU Life Cycle Until Q1’ 38 (Based on Intel IOTG Roadmap), and available for an additional 5 years support under SPS Process.
Specification
| System |
| Processor |
| 13th Gen Intel® Core™ Processors, LGA 1700 Socket Processors, TDP support up to 65W |
| Intel® Core™ I9-13900E (24 Cores, 36M Cache, up to 5.2 GHz); 65W |
| Intel® Core™ I9-13900TE (24 Cores, 36M Cache, up to 5.0 GHz); 35W |
| Intel® Core™ I7-13700E (16 Cores, 30M Cache, up to 5.1 GHz); 65W |
| Intel® Core™ I7-13700TE (16 Cores, 30M Cache, up to 4.8 GHz); 35W |
| Intel® Core™ I7-13700T (16 Cores, 30M Cache, up to 4.9 GHz); 35W |
| Intel® Core™ I5-13500E (14 Cores, 24M Cache, up to 4.6 GHz); 65W |
| Intel® Core™ I5-13500TE (14 Cores, 24M Cache, up to 4.5 GHz); 35W |
| Intel® Core™ I5-13500T (14 Cores, 24M Cache, up to 4.6 GHz); 35W |
| Intel® Core™ I5-13400E (10 Cores, 20M Cache, up to 4.6 GHz); 65W |
| Intel® Core™ I3-13100E (4 Cores, 12M Cache, up to 3.3 GHz); 60W |
| Intel® Core™ I3-13100TE (4 Cores, 12M Cache, up to 4.1 GHz); 35W |
| Intel® Core™ I3-13100T (4 Cores, 12M Cache, up to 4.2 GHz); 35W |
| Chipset |
| Intel® R680E/Q670E/H610E Chipset |
| Memory |
| 4pcs DDR5 SO-DIMM up to 128GB |
| Dual Channel DDR5 |
| ECC support by R680 with i7 and i5 |
| BIOS |
| AMI SPI 256Mbit |
| Graphics |
| Controller |
| Intel® HD Gen 9 Graphics |
| Feature |
| OpenGL 4.5, DirectX 12, OpenCL 2.1 |
| HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9 |
| HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9 |
| Display |
| 3 x DDI (HDMI/DP++) support to 8K |
| 1 x eDP support to 5K |
| Quad Displays |
| eDP + 3 DDI |
| Expansion |
| Interface |
| 1 x PCIe x16 (Gen5) |
| 4 x PCIe x4 (Gen4) |
| 2 x PCIe x4 (Gen3) |
| 2 x PCIe x1 (Gen3) |
| 1 x PCIe x16 (Gen 4) |
| 8 x PCIe x1 (Gen 3) |
| 1 x eSPI |
| 1 x I2C |
| 1 x SMBus |
| 2 x UART (TX/RX/RTS/CTS) |
| Audio |
| Audio Codec |
| HD Audio |
| Ethernet |
| PHY |
| 2 x Intel® I226 series (10/100/1000Mbps/2.5G) |
| I/O |
| USB |
| 4 x USB 3.2 Gen2 |
| 8 x USB 2.0 |
| SATA |
| 2 x SATA 3.0 (up to 6Gb/s) |
| GPIO |
| 12 bit in/out |
| Watchdog Timer |
| Output & Interval |
| System Reset, Programmable via Software from 1 to 255 Seconds |
| Security |
| TPM |
| TPM2.0 (Available Upon Request) |
| Power |
| Type |
| 12V, 5VSB, VCC_RTC (ATX mode) |
| 12V, VCC_RTC (AT mode) |
| Consumption |
| TBD |
| OS Support |
| Microsoft |
| Windows 10 IoT Enterprise 64-bit |
| Linux |
| Ubuntu 20.04 |
| Environment |
| Temperature |
| Operating: 0 to 60°C |
| Storage: -40 to 85°C |
| Humidity |
| Operating: 5 to 90% RH |
| Storage: 5 to 90% RH |
| MTBF |
| TBD |
| Mechanism |
| Dimensions |
| COM HPC® Client Size C |
| 6.30″ x 4.72″ (160mm x 120mm) |
| Compliance |
| PICMG COM HPC® R1.15, Client Size C |
| Standards and Certifications |
| Certifications |
| CE, FCC, RoHS |
| Packing List |
| Packing List |
| • COM836 carrier board kit, 770-COM8361-000G |
| Country of Origin |
| Country of Origin |
| Taiwan |
Ordering Information
| Model Name | Part Number | Description |
| RPS9HC-R680E-BS-13900E | 770-RPS9HC1-000G | Intel® Core™ i9-13900E, R680E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C |
| RPS9HC-Q670E-BS-13700E | 770-RPS9HC1-100G | Intel® Core™ i7-13700E, Q670E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C |
| RPS9HC-H610E-BS-13100E | 770-RPS9HC1-200G | Intel® Core™ i3-13100E, H610E, 3 DDI + 1 eDP, 4 USB3.2 Gen2, TPM 2.0 (Opt.), Cooler Thermal, 0~60°C |
BVM Customisation Service
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.
If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.
Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.
Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.
Design | Develop | Test | Manufacture
With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality
Here’s a selection of our design, manufacturing & associated services: –
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
 Testing |
 Materials Management |
 Logistics and Tracking |
 External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |