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COM Express Basic

COM Express Basic modules provide high-level processing performance and high-speed interfaces for a wide range of demanding computing applications such as medical and industrial automation. Our Basic modules are compatible with COM Express pin-out Type 2, Type 6, and Type 7 – selectable in wide range of Intel Core Series and AMD Ryzen solutions. We also can provide standard operational temperature modules (0°C to +60°C) and wide temperature (-40°C to +85°C).

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  • RBT970 1

    DFI RBT970 AMD Ryzen Embedded V3000 COM Express Basic

    • Product Name: DFI RBT970
    • Motherboard Form Factor: COM Express Basic
    • CPU: AMD Ryzen Embedded V3000 Series processors
    • RAM: Dual DDR5 SODIMM 4800MHz up to 64GB
    • Expansion: 1 PCIe x14 (Gen 4), 1 SMBus, 1 I2C, 1 LPC, UART
    • Other features: Support extended operating temperature: -40 to 85°C; Support 2 x 10G Ethernet and 1 x 2.5G Ethernet; Rich I/O: 4 USB 3.2, 4 USB 2.0, 2 SATA 3.0
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  • TGH960

    DFI TGH960 Intel Tiger Lake iCore / Xeon Com Express Basic Module

    • Product Name: DFI TGH960
    • Motherboard Form Factor: Intel Tiger Lake iCore / Xeon Com Express Basic Module
    • CPU: 11th Generation Intel® Processor COM Express® Basic
    • RAM: DDR4 3200MHz SODIMM up to 128GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
    • Other features: VGA + LVDS*/eDP + 3 DDI, DP++ supports 4K resolution, Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q2′ 36 (Based on Intel IOTG Roadmap)
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  • CH961 front

    DFI CH961 8th/9th Gen Intel iCore Xeon Celeron COM Express Basic

    • Product Name: DFI CH961
    • Motherboard Form Factor: COM Express Basic
    • CPU: 8th/9th Gen Intel iCore Xeon Celeron
    • RAM: Dual channel DDR4 2666MHz SODIMM up to 96GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Other features: Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays; DP++ resolution supports up to 4096×2304 @ 60Hz; Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
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  • COM 653L1

    ASRock Industrial COM-653-E-2176M 8th Gen Com Express Basic

    • Product Name: Asrock COM-653-E-2176M
    • Motherboard Form Factor: COM Express
    • CPU: Intel® 8th Generation Intel® Core™ Processor BGA 1440 / Intel® Xeon® Processor E-2100M
    • RAM: Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
    • Expansion: 2 x DDI channels, 1 x eDP (shared with LVDS); 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
    • Other features: 1 x Intel® LAN; 1 x TPM2.0 on board IC (optional)
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  • GH960 w600

    DFI GH960 Ryzen Embedded Com Express Basic Module

    • Product Name: DFI GH960
    • Motherboard Form Factor: Com Express Module
    • CPU: Ryzen Embedded
    • RAM: Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
    • Expansion: Multiple expansion: 1 PCIe x8, 7 PCIe x1
    • Other features: Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default)；Supports up to four independent displays; DP++ resolution supports up to 4096×2304 @ 60Hz; Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0; 10-Year CPU Life Cycle Support Until Q2′ 27 (Based on AMD Roadmap)
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  • COM 653L1

    ASRock Industrial COM-653-i3-8100H 8th Gen Com Express Basic

    • Product Name: Asrock COM-653-i3-8100H
    • Motherboard Form Factor: COM Express
    • CPU: Intel® 8th Generation Intel® Core™ Processor BGA 1440 / Intel® Xeon® Processor E-2100M
    • RAM: Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
    • Expansion: 2 x DDI channels, 1 x eDP (shared with LVDS); 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
    • Other features: 1 x Intel® LAN; 1 x TPM2.0 on board IC (optional)
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  • COM 653L1

    ASRock Industrial COM-653-i5-8400H 8th Gen Com Express Basic

    • Product Name: Asrock COM-653-i5-8400H
    • Motherboard Form Factor: COM Express
    • CPU: Intel® 8th Generation Intel® Core™ Processor BGA 1440 / Intel® Xeon® Processor E-2100M
    • RAM: Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
    • Expansion: 2 x DDI channels, 1 x eDP (shared with LVDS); 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
    • Other features: 1 x Intel® LAN; 1 x TPM2.0 on board IC (optional)
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  • COM 653L1

    ASRock Industrial COM-653-i7-8850H 8th Gen Com Express Basic

    • Product Name: Asrock COM-653-i7-8850H
    • Motherboard Form Factor: COM Express
    • CPU: Intel® 8th Generation Intel® Core™ Processor BGA 1440 / Intel® Xeon® Processor E-2100M
    • RAM: Supports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB
    • Expansion: 2 x DDI channels, 1 x eDP (shared with LVDS); 4 x USB 3.1, 8 x USB 2.0, 4 x SATA3
    • Other features: 1 x Intel® LAN; 1 x TPM2.0 on board IC (optional)
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  • CH960 w600

    DFI HM370 8th Gen Com Express Basic Module

    • Product Name: DFI HM370
    • Motherboard Form Factor: Com Express Module
    • CPU: 8th Generation Intel Core
    • RAM: Dual channel DDR4 2666MHz SODIMM up to 32GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Other features: Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays; eDP resolution supports up to 4096×2304 @ 60Hz; Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
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  • CEM510

    Axiomtek CEM510 COM Express Basic – Xeon & 7th Generation i7/i5/i3

    • Product Name: Axiomtek CEM510
    • Motherboard Form Factor: COM Express Basic
    • CPU: Intel Xeon & 7th Generation i7/i5/i3
    • RAM: 2 DDR4-2133 SO-DIMM slots, up to 32GB ECC or non-ECC
    • Expansion: 1 PCIe x16 and 8 PCIe x1 Gen. 3
    • Other features: Intel CM238/QM175/HM175 chipset; 4 SATA-600 with RAID 0/1/5/10; 4 USB 3.0 and 8 USB 2.0; Intel AMT 11.0 and TPM 1.2 function supported; AXView 2.0 intelligent remote management software for industrial IoT applications
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